Relation between tin whiskering ability Sn/Ag/Cu solder alloys and current load

Author(s):  
Balazs Illes ◽  
Norbert Fehervari
Keyword(s):  
2015 ◽  
Vol 99 ◽  
pp. 313-319 ◽  
Author(s):  
Balázs Illés ◽  
Tamás Hurtony ◽  
Bálint Medgyes

2021 ◽  
Vol 26 ◽  
pp. 1-19
Author(s):  
Martín Farach-Colton ◽  
Katia Leal ◽  
Miguel A. Mosteiro ◽  
Christopher Thraves Caro

We consider the Windows Scheduling (WS) problem, which is a restricted version of Unit-Fractions Bin Packing, and it is also called Inventory Replenishment in the context of Supply Chain. In brief, WS problem is to schedule the use of communication channels to clients. Each client c i is characterized by an active cycle and a window w i . During the period of time that any given client c i is active, there must be at least one transmission from c i scheduled in any w i consecutive time slots, but at most one transmission can be carried out in each channel per time slot. The goal is to minimize the number of channels used. We extend previous online models, where decisions are permanent, assuming that clients may be reallocated at some cost. We assume that such cost is a constant amount paid per reallocation. That is, we aim to minimize also the number of reallocations. We present three online reallocation algorithms for Windows Scheduling. We evaluate experimentally multiple variants of these protocols showing that, in practice, all three achieve constant amortized reallocations with close to optimal channel usage. Our simulations also expose interesting tradeoffs between reallocations and channel usage. We introduce a new objective function for WS with reallocations that can be also applied to models where reallocations are not possible. We analyze this metric for one of the algorithms that, to the best of our knowledge, is the first online WS protocol with theoretical guarantees that applies to scenarios where clients may leave and the analysis is against current load rather than peak load. Using previous results, we also observe bounds on channel usage for one of the algorithms.


2021 ◽  
Vol 52 (S1) ◽  
pp. 275-275
Author(s):  
Rudy Ghosh ◽  
Vahid Akhavan ◽  
Harry Chou ◽  
Vikram Turkani ◽  
Stan Farnsworth

2016 ◽  
Vol 67 ◽  
pp. 135-142 ◽  
Author(s):  
E.H. Wong ◽  
J. Chrisp ◽  
C.S. Selvanayagam ◽  
S.K.W. Seah

Author(s):  
Uttara Sahaym ◽  
Babak Talebanpour ◽  
Sean Seekins ◽  
Indranath Dutta ◽  
Praveen Kumar ◽  
...  

2021 ◽  
pp. 130515
Author(s):  
Yu-qin Wu ◽  
Ze-an Tian ◽  
Fang Liu ◽  
Zi-Hou Yuan ◽  
Chen Wei ◽  
...  
Keyword(s):  

Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1545
Author(s):  
Agata Skwarek ◽  
Olivér Krammer ◽  
Tamás Hurtony ◽  
Przemysław Ptak ◽  
Krzysztof Górecki ◽  
...  

The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %. The wettability, the void formation, the mechanical strength, and the thermoelectric parameters of the composite solder alloys/joints were investigated. Furthermore, microstructural evaluations were performed using scanning electron and ion microscopy. ZnO nanoparticles decreased the composite solder alloys’ wettability, which yielded increased void formation. Nonetheless, the shear strength and the thermoelectric parameters of the composite solder alloy were the same as those of the SACX0307 reference. This could be explained by the refinement effects of ZnO ceramics both on the Sn grains and on the Ag3Sn and Cu6Sn5 intermetallic grains. This could compensate for the adverse impact of lower wettability. After improving the wettability, using more active fluxes, ZnO composite solder alloys are promising for high-power applications.


2011 ◽  
Vol 95 (11) ◽  
pp. 3001-3008 ◽  
Author(s):  
Matthias M. Koebel ◽  
Nancy El Hawi ◽  
Jia Lu ◽  
Felix Gattiker ◽  
Jürg Neuenschwander

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