Enhanced Thermal Performance of High Flux LED Systems with Two-Phase Immersion Cooling

Abstract In order to meet increasing performance demand from high-performance computing (HPC) and edge computing, thermal design power (TDP) of CPU and GPU needs to increase. This creates thermal challenge to corresponding electronic packages with respect to heat dissipation. In order to address this challenge, two-phase immersion cooling is gaining attention as its primary mode of heat of removal is via liquid-to-vapor phase change, which can occur at relatively low and constant temperatures. In this paper, integrated heat spreader (IHS) with boiling enhancement features is proposed. 3D metal printing and metal injection molding (MIM) are the two approaches used to manufacture the new IHS. The resultant IHS with enhancement features are used to build test vehicles (TV) by following standard electronic package assembly process. Experimental results demonstrated that boiling enhanced TVs improved two-phase immersion cooling capability by over 50% as compared to baseline TV without boiling enhanced features.

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Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays ◽

10.1115/ipack2015-48496 ◽

2015 ◽

Cited By ~ 9

Author(s):

Raphael Mandel ◽

Serguei Dessiatoun ◽

Patrick McCluskey ◽

Michael Ohadi

Keyword(s):

Heat Transfer ◽

Heat Flux ◽

Pressure Drop ◽

Saturation Temperature ◽

Absolute Pressure ◽

High Flux ◽

Vapor Quality ◽

Two Phase ◽

Fluid Delivery ◽

Future Work

This work presents the experimental design and testing of a two-phase, embedded manifold-microchannel cooler for cooling of high flux electronics. The ultimate goal of this work is to achieve 0.025 cm2-K/W thermal resistance at 1 kW/cm2 heat flux and evaporator exit vapor qualities at or exceeding 90% at less than 10% absolute pressure drop. While the ultimate goal is to obtain a working two-phase embedded cooler, the system was first tested in single-phase mode to validate system performance via comparison of experimentally measured heat transfer coefficient and pressure drop to the values predicted by CFD simulations. Upon validation, the system was tested in two phase mode using R245fa at 30°C saturation temperature and achieved in excess of 1 kW/cm2 heat flux at 45% vapor quality. Future work will focus on increasing the exit vapor quality as well as use of SiC for the heat transfer surface upon completion of current experiments with Si.

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The interface effect of carbon nanotube suspension on the thermal performance of a two-phase closed thermosyphon

Journal of Applied Physics ◽

10.1063/1.2357705 ◽

2006 ◽

Vol 100 (10) ◽

pp. 104909 ◽

Cited By ~ 80

Author(s):

H. S. Xue ◽

J. R. Fan ◽

Y. C. Hu ◽

R. H. Hong ◽

K. F. Cen

Keyword(s):

Carbon Nanotube ◽

Thermal Performance ◽

Interface Effect ◽

Two Phase

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Development of Analysis Algorithm and Computational Methodology for the Evaluation of Non-Uniform Energy Conversion System Performance: Part I — Component Analysis Modules

Advanced Energy Systems ◽

10.1115/imece2006-14960 ◽

2006 ◽

Cited By ~ 1

Author(s):

Casey Loughrin ◽

Hyunjae Park ◽

Robert Weber

Keyword(s):

Energy Conversion ◽

Thermal Performance ◽

System Performance ◽

Flow Characteristics ◽

Heating System ◽

Component Analysis ◽

Connectivity Matrix ◽

Two Phase ◽

Energy Conversion Systems ◽

The Individual

This paper examines the development of the individual component analysis modules applied to two selected energy conversion systems; a vapor-compression refrigeration system and a boiler heating system. The energy conversion components used in this work are the evaporator, condenser, expansion valve, mixing chamber, open feedwater heater, pipe, boiler, pump, and compressor. The developed component analysis modules are able to apply input data and specifications to estimate the corresponding thermal performance of the component. Upon investigation of the two case studies presented, it was found that the two-phase heat exchanging components such as the evaporator, condenser and boiler were the primary sources of the non-uniform system performance characteristics. As a consequence, a system connectivity matrix has been developed to evaluate the mass and energy flow characteristics of working fluids between components. The developed component analysis modules, in conjunction with the system connectivity matrix, were exclusively used to calculate the local and overall system thermal performance.

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Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems ◽

10.1115/ipack2020-2541 ◽

2020 ◽

Author(s):

Jackson B. Marcinichen ◽

John R. Thome ◽

Raffaele L. Amalfi ◽

Filippo Cataldo

Keyword(s):

Thermal Performance ◽

Experimental Validation ◽

Cooling System ◽

Electronics Cooling ◽

Operating Conditions ◽

Two Phase ◽

Data Set ◽

Pressure Drops ◽

Wide Range ◽

Important Challenge

Abstract Thermosyphon cooling systems represent the future of datacenter cooling, and electronics cooling in general, as they provide high thermal performance, reliability and energy efficiency, as well as capture the heat at high temperatures suitable for many heat reuse applications. On the other hand, the design of passive two-phase thermosyphons is extremely challenging because of the complex physics involved in the boiling and condensation processes; in particular, the most important challenge is to accurately predict the flow rate in the thermosyphon and thus the thermal performance. This paper presents an experimental validation to assess the predictive capabilities of JJ Cooling Innovation’s thermosyphon simulator against one independent data set that includes a wide range of operating conditions and system sizes, i.e. thermosyphon data for server-level cooling gathered at Nokia Bell Labs. Comparison between test data and simulated results show good agreement, confirming that the simulator accurately predicts heat transfer performance and pressure drops in each individual component of a thermosyphon cooling system (cold plate, riser, evaporator, downcomer (with no fitting parameters), and eventually a liquid accumulator) coupled with operational characteristics and flow regimes. In addition, the simulator is able to design a single loop thermosyphon (e.g. for cooling a single server’s processor), as shown in this study, but also able to model more complex cooling architectures, where many thermosyphons at server-level and rack-level have to operate in parallel (e.g. for cooling an entire server rack). This task will be performed as future work.

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