Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

2011 ◽  
Vol 133 (1) ◽  
Author(s):  
Xiaoling Yu ◽  
Lianghua Zhang ◽  
Enming Zhou ◽  
Quanke Feng
Keyword(s):  
Experimental Data ◽  
Heat Load ◽  
Thermal Modeling ◽  
Copper Plate ◽  
Vapor Chamber ◽  
Transient Time ◽  
Thermal Circuit ◽  
Igbt Modules ◽  
Igbt Module ◽  
Heat Spreading

Presently, many methods are adopted to reduce the junction-to-case thermal resistance (Rjc) of insulated-gate bipolar transistor (IGBT) modules in order to increase their power density. One of these approaches is to enhance the heat spreading capability of the base plate (heat spreader) of an IGBT module using a vapor chamber (VC). In this paper, both experimental measurement and thermal modeling are conducted on a VC-based IGBT module and two copper-plate-based IGBT modules. The experimental data show that Rjc of the VC-based IGBT module decreases substantially with the increase in the heat load of the IGBT. Rjc of the VC-based IGBT module is ∼50% of that of the 3 mm copper-plate-based IGBT module after it saturates at a heat load level of ∼200 W. The transient time of the VC-based IGBT module is also shorter than the copper-plate-based IGBT modules since the VC has higher heat spreading capability. The quicker responses of the VC-based IGBT module to reach its saturated temperature during the start-up can avoid a possible power surge. In the thermal modeling, the vapor is substituted as a solid conductor with extremely high thermal conductivity. Hence, the two-phase flow thermal modeling of the VC is simplified as a one-phase thermal conductive modeling. A thermal circuit model is also built for the VC-based IGBT module. Both the thermal modeling and thermal circuit results match well with the experimental data.

A New Design Method of IGBT Module with Embedded Vapor Chamber for Optimal Heat Radiation

2021 ◽  
Author(s):  
Chen Zhang ◽  
Jun Shen ◽  
Xiuchen Xiao ◽  
Qingli Deng ◽  
Huimin Wang ◽  
...  
Keyword(s):  
Design Method ◽  
Heat Radiation ◽  
Vapor Chamber ◽  
Optimal Heat ◽  
Igbt Module

Heat Spreading Performance of Integrated IGBT Module with Bonded Vapour Chamber for Electric Vehicle

2021 ◽  
pp. 509-515
Author(s):  
Bo Li ◽  
Yiyi Chen ◽  
Yuying Yan ◽  
Xuehui Wang ◽  
Yong Li ◽  
...  
Keyword(s):  
Electric Vehicle ◽  
Igbt Module ◽  
Heat Spreading

scholarly journals Open-Circuit Fault Diagnosis of Wind Power Converter Using Variational Mode Decomposition, Trend Feature Analysis and Deep Belief Network

2020 ◽  
Vol 10 (6) ◽  
pp. 2146 ◽  
Author(s):  
Jingxuan Zhang ◽  
Hexu Sun ◽  
Zexian Sun ◽  
Yan Dong ◽  
Weichao Dong
Keyword(s):  
Fault Diagnosis ◽  
Wind Turbine ◽  
Power Converter ◽  
Open Circuit ◽  
Original Signal ◽  
Variational Mode Decomposition ◽  
Mode Decomposition ◽  
Igbt Modules ◽  
Igbt Module ◽  
Circuit Fault Diagnosis

The power converter is a significant device in a wind power system. The wind turbine will be shut down and off grid immediately with the occurrence of the insulated gate bipolar transistor (IGBT) module open-circuit fault of the power converter, which will seriously impact the stability of grid and even threaten personal safety. However, in the existing diagnosis strategies for the power converter there are few single and double IGBT module open-circuit fault diagnosis methods producing negative results, including erroneous judgment, omissive judgment and low accuracy. In this paper, a novel method to diagnose the single and double IGBT modules open-circuit faults of the permanent magnet synchronous generator (PMSG) wind turbine grid-side converter (GSC) is proposed: Primarily, by collecting the three-phase current varying with a wind speed of 22 states, including a normal state and 21 failure states of PMSG wind turbine GSC as the original signal data. Afterward, the original signal data are decomposed by using variational mode decomposition (VMD) to obtain the mode coefficient series, which are analyzed by the proposed method base on fault trend feature for extracting the trend feature vectors. Finally, the trend feature vectors are utilized as the input of the deep belief network (DBN) for decision-making and obtaining the classification results. The simulation and experimental results show that the proposed method can diagnose the single and double IGBT modules open-circuit faults of GSC, and the accuracy is higher than the benchmark models.

scholarly journals A Model of the On-State Voltage across IGBT Modules Based on Physical Structure and Conduction Mechanisms

Energies ◽  
2019 ◽  
Vol 12 (5) ◽  
pp. 851 ◽  
Author(s):  
Qingyi Kong ◽  
Mingxing Du ◽  
Ziwei Ouyang ◽  
Kexin Wei ◽  
William Hurley
Keyword(s):  
Working Conditions ◽  
Conduction Mechanism ◽  
Electrical Parameter ◽  
Physical Structure ◽  
Model Parameters ◽  
Insulated Gate Bipolar Transistor ◽  
Igbt Modules ◽  
Igbt Module ◽  
Detailed Method ◽  
Simulation Results

The on-state voltage is an important electrical parameter of insulated gate bipolar transistor (IGBT) modules. Due to limits in instrumentation and methods, it is difficult to ensure accurate measurements of the on-state voltage in practical working conditions. Based on the physical structure and conduction mechanism of the IGBT module, this paper models the on-state voltage and gives a detailed method for extracting the on-state voltage. Experiments not only demonstrate the feasibility of the on-state voltage separation method but also suggest a method for measuring and extracting the model parameters. Furthermore, on-state voltage measurements and simulation results certified the accuracy of this method.

Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber

2009 ◽  
Author(s):  
Koichi Mashiko ◽  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Yasuhiro Horiuchi ◽  
Thang Nguyen ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Cooling System ◽  
Cold Plate ◽  
Micro Channel ◽  
Vapor Chamber ◽  
Liquid Cooling ◽  
Liquid Cooling System ◽  
Heat Spreading

Recently energy saving is most important concept for all electric products and production. Especially, in Data-Center cooling system, power consumption of current air cooling system is increasing. For not only improving thermal performance but also reducing electric power consumption of this system, liquid cooling system has been developed. This paper reports the development of cold plate technology and vapor chamber application by using micro-channel fin. In case of cold plate application, micro-channel fin technology is good for compact space design, high thermal performance, and easy for design and simulation. Another application is the evaporating surface for vapor chamber. The well-known devices for effective heat transfer or heat spreading with the lowest thermal resistance are heat pipes and vapor chamber, which are two-phase heat transfer devices with excellent heat spreading and heat transfer characteristics. Normally, vapor chamber is composed of sintered power wick. Vapor chamber container is mechanically supported by stamped pedestal or wick column or solid column, but the mechanical strength is not enough strong. So far, the application is limited in the area of low strength assembly. Sometime the mechanical supporting frame is design for preventing deformation. In this paper, the testing result of sample is described that thermal resistance between the heat source and the ambient can be improved approximately 0.1°C/W by using the micro-channel vapor chamber. Additionally, authors presented case designs using vapor chamber for cooling computer processors, and proposed ideas of using micro-channel vapor chamber for heat spreading to replace the traditional metal plate heat spreader.

scholarly journals The Application of Approximate Entropy Theory in Defects Detecting of IGBT Module

2012 ◽  
Vol 2012 ◽  
pp. 1-7
Author(s):  
Shengqi Zhou ◽  
Luowei Zhou ◽  
Suncheng Liu ◽  
Pengju Sun ◽  
Quanming Luo ◽  
...  
Keyword(s):  
Gate Voltage ◽  
Diagnostic Method ◽  
Approximate Entropy ◽  
Key Factors ◽  
Silicon Chips ◽  
Insulated Gate Bipolar Transistor ◽  
Igbt Modules ◽  
Igbt Module ◽  
Before And After ◽  
Parasitic Parameters

Defect is one of the key factors in reducing the reliability of the insulated gate bipolar transistor (IGBT) module, so developing the diagnostic method for defects inside the IGBT module is an important measure to avoid catastrophic failure and improves the reliability of power electronic converters. For this reason, a novel diagnostic method based on the approximate entropy (ApEn) theory is presented in this paper, which can provide statistical diagnosis and allow the operator to replace defective IGBT modules timely. The proposed method is achieved by analyzing the cross ApEn of the gate voltages before and after the occurring of defects. Due to the local damage caused by aging, the intrinsic parasitic parameters of packaging materials or silicon chips inside the IGBT module such as parasitic inductances and capacitances may change over time, which will make remarkable variation in the gate voltage. That is to say the gate voltage is close coupled with the defects. Therefore, the variation is quantified and used as a precursor parameter to evaluate the health status of the IGBT module. Experimental results validate the correctness of the proposed method.

EFFECT OF HEAT SPREADING ON THE PERFORMANCE OF HEAT SINK VIA VAPOR CHAMBER

Equipment ◽  
2006 ◽  
Author(s):  
Y. S. Chen ◽  
K. H. Chien ◽  
T. C. Hung ◽  
B. S Pei ◽  
C. C. Wang
Keyword(s):  
Heat Sink ◽  
Vapor Chamber ◽  
Heat Spreading
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