I-V-T studies on ternary silicide Co/sub 1-x/Ni/sub x/Si/sub 2//n-Si Schottky contacts

Author(s):  
Shiyang Zhu ◽  
Guoping Ru ◽  
Xinping Qu ◽  
R.L. Van Meirhaeghe ◽  
S. Forment ◽  
...  
Author(s):  
Z. Liliental-Weber ◽  
C. Nelson ◽  
R. Ludeke ◽  
R. Gronsky ◽  
J. Washburn

The properties of metal/semiconductor interfaces have received considerable attention over the past few years, and the Al/GaAs system is of special interest because of its potential use in high-speed logic integrated optics, and microwave applications. For such materials a detailed knowledge of the geometric and electronic structure of the interface is fundamental to an understanding of the electrical properties of the contact. It is well known that the properties of Schottky contacts are established within a few atomic layers of the deposited metal. Therefore surface contamination can play a significant role. A method for fabricating contamination-free interfaces is absolutely necessary for reproducible properties, and molecularbeam epitaxy (MBE) offers such advantages for in-situ metal deposition under UHV conditions


Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.


2021 ◽  
Vol 1718 ◽  
pp. 012018
Author(s):  
M A Hadi ◽  
M A Alam ◽  
M Roknuzzaman ◽  
M T Nasir ◽  
A K M A Islam ◽  
...  

2019 ◽  
Vol 217 (7) ◽  
pp. 1900701
Author(s):  
Yuan Ren ◽  
Leidang Zhou ◽  
Kang Zhang ◽  
Liang Chen ◽  
Xiaoping Ouyang ◽  
...  

2008 ◽  
Vol 23 (10) ◽  
pp. 105005 ◽  
Author(s):  
X L Zhang ◽  
W G Sun ◽  
L Zhang ◽  
Z X Lu

Sign in / Sign up

Export Citation Format

Share Document