Direct bonding of polycrystalline diamond substrate onto Si wafer under atmospheric conditions

Author(s):  
T. Matsumae ◽  
Y. Kurashima ◽  
H. Takagi ◽  
H. Umezawa ◽  
E. Higurashi
2012 ◽  
Vol 1395 ◽  
Author(s):  
T. Misu ◽  
K. Koh ◽  
T. Arai

ABSTRACTCVD polycrystalline diamond surfaces were etched using reactive ion etching system with either a conventional stainless steel electrode or MgO sintered ceramic containing electrode. The micro-needle array of high aspect on diamond substrate surfaces obtained with MgO electrode was fabricated by using back-sputtering from MgO electrode. The RMS roughness of diamond substrate surfaces obtained with MgO electrode is higher than those obtained with stainless steel electrode.


2009 ◽  
Vol 407-408 ◽  
pp. 388-391 ◽  
Author(s):  
Mutsumi Touge ◽  
Takayuki Nakano ◽  
Keishi Yamaguchi ◽  
Akihisa Kubota ◽  
Junji Watanabe

Polycrystalline diamond (PCD) has been widely used for various cutting tools and die components making use of its hardness and wear resistance properties. The polishing method of a single crystal diamond substrate and SiC using ultraviolet irradiation was newly developed to obtain mirror-finished surfaces. Due to the long polishing time in this method, a better pre-machined surface is required to shorten the total processing time. In this work, the constant-pressure grinding was performed using a cup type metal-bonded diamond wheel and a constant pressure device. After the good constant-pressure grinding, the PCD was finished by the polishing under the ultraviolet irradiation, and the microroughness was reached to be 0.71 nmRa.


Sensors ◽  
2021 ◽  
Vol 21 (18) ◽  
pp. 6113
Author(s):  
Szymon Łoś ◽  
Kazimierz Fabisiak ◽  
Kazimierz Paprocki ◽  
Mirosław Szybowicz ◽  
Anna Dychalska

The polycrystalline diamonds were synthesized on n-type single crystalline Si wafer by Hot Filament CVD method. The structural properties of the obtained diamond films were checked by X-ray diffraction and Raman spectroscopy. The conductivity of n-Si/p-diamond, sandwiched between two electrodes, was measured in the temperature range of 90–300 K in a closed cycle cryostat under vacuum. In the temperature range of (200–300 K), the experimental data of the conductivity were used to obtain the activation energies Ea which comes out to be in the range of 60–228 meV. In the low temperature region i.e., below 200 K, the conductivity increases very slowly with temperature, which indicates that the conduction occurs via Mott variable range hopping in the localized states near Fermi level. The densities of localized states in diamond films were calculated using Mott’s model and were found to be in the range of 9×1013 to 5×1014eV−1cm−3 depending on the diamond’s surface hydrogenation level. The Mott’s model allowed estimating primal parameters like average hopping range and hopping energy. It has been shown that the surface hydrogenation may play a crucial role in tuning transport properties.


2020 ◽  
Author(s):  
Takashi Matsumae ◽  
Yuichi Kurashima ◽  
Hideki Takagi ◽  
Hitoshi Umezawa ◽  
Eiji Higurashi

2021 ◽  
Vol 191 ◽  
pp. 52-55
Author(s):  
Takashi Matsumae ◽  
Yuichi Kurashima ◽  
Hideki Takagi ◽  
Hitoshi Umezawa ◽  
Eiji Higurashi

1993 ◽  
Vol 115 (2) ◽  
pp. 124-132 ◽  
Author(s):  
E. Kuru ◽  
A. K. Wojtanowicz

This paper presents a simulation study to evaluate the combined effect of cutting depth (drilling rate) and wear (bit dull) on the thermal response of polycrystalline diamond compact (PDC) cutters under downhole drilling conditions. A new understanding of frictionally generated heat between rock and PDC cutter is introduced from the analysis of forces active on the wearflat and the cutting (leading) surfaces of a cutter. Then this new concept is used to predict PDC bit performance with the controlled temperature of its cutters. Previous concepts, largely based on the laboratory drilling tests (with low drilling rate and under atmospheric conditions), recognize only one source of heat—the wearflat surface. However, this study, using field data, shows that the heat generated at the cutting surface may significantly contribute to the total heat flux in the cutter. As a result, the distribution of temperature within the cutter is changed, which particularly affects the maximum value of temperature at the cutting edge. A simplified 2-D finite difference numerical code is used to quantify the difference in cutter wearflat temperatures calculated with and without the additional heat flux generated at the cutting surface. The numerical analysis reveals that neglecting the cutting surface effect results in underestimation of the actual wearflat temperature by 10 to 530 percent, depending upon bit dull and downhole hydraulics. Also demonstrated is the actual impact of these findings on field drilling practices. The example comparison is made by calculating the optimal-control procedures for PDC bit with and without the effect of cutting surface. In these procedures, wearflat temperature becomes a mathematical constraint which limits weight on bit and rotational speed. The comparison includes calculation of the maximum bit performance curves which represent maximum drilling rate attainable for a bit to drill a predetermined length of a borehole (footage). The curves show an up to 18 percent reduction of drilling rate when the new and more rigorous temperature limitation is used. In addition, the example calculations show that the actual temperature of the bit cutters can be 460°C (860°F), and exceeds by almost 30 percent its maximum acceptable value of 350°C (660°F). For practical applications, the study reveals that many field failures of PDC bits may have been caused by lack of understanding of operational limits imposed by heat considerations.


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