Imperfect Return Path Effects on RLCG Model of Single and Coupled Interconnects: Propagation delay, Rise Time and Crosstalk Prediction

2002 ◽  
Author(s):  
J.F. Legier ◽  
E. Paleczny ◽  
K. Bouazzati ◽  
D. Deschachi ◽  
F. Huret
Keyword(s):  
Rise Time ◽  
Propagation Delay ◽  
Return Path

On the Extraction of On-Chip Inductance

2003 ◽  
Vol 12 (01) ◽  
pp. 31-40 ◽  
Author(s):  
Yehea I. Ismail ◽  
Eby G. Friedman
Keyword(s):  
Relative Error ◽  
Computational Efficiency ◽  
Rise Time ◽  
High Speed ◽  
Propagation Delay ◽  
Cmos Circuits ◽  
Signal Waveform ◽  
Inductance Extraction ◽  
On Chip ◽  
High Computational Efficiency

Inductance extraction has become an important issue in the design of high speed CMOS circuits. Two characteristics of on-chip inductance are discussed in this paper that can significantly simplify the extraction of on-chip inductance. The first characteristic is that the sensitivity of a signal waveform to errors in the inductance values is low, particularly the propagation delay and the rise time. It is quantitatively shown in this paper that the error in the propagation delay and rise time is below 9.4% and 5.9%, respectively, assuming a 30% relative error in the extracted inductance values. If an RC model is used for the same example, the corresponding errors are 51% and 71%, respectively. The second characteristic is that the magnitude of the on-chip inductance is a slow varying function of the width of a wire and the geometry of the surrounding wires. These two characteristics can be exploited by using simplified techniques that permit approximate and sufficiently accurate values of the on-chip inductance to be determined with high computational efficiency.

Desain dan Komparasi Kontrol Kecepatan Motor DC

2020 ◽  
Vol 7 (2) ◽  
pp. 127-134
Author(s):  
Safah Tasya Aprilyani ◽  
Irianto Irianto ◽  
Epyk Sunarno
Keyword(s):  
Steady State ◽  
Rise Time ◽  
Settling Time ◽  
Proportional Integral

Penggunaan kontrol sangat diperlukan dalam pengaturan kecepatan motor DC. Dalam pengaturan kecepatan motor DC, salah satu jenis kontrol yang digunakan adalah kontrol Proportional Integral (PI). Untuk 4 jenis metode pada kontrol PI yang digunakan adalah metode Ziegler Nichole, Chien Servo 1, Chien Regulator 1 dan perhitungan secara analitik yang telah diperoleh dari data yang sudah ada.  Namun kontrol dengan PI 4 metode yang digunakan  sebagai pembanding memiliki waktu respon kecepatan saat stabil cenderung lambat baik dari nilai settling time, rise time dan steady state. Maka dari itu dilakukan komparasi antara 4 metode kontrol PI dengan penggunaan kontrol fuzzy. Dalam membandingkan antara 4 metode kontrol PI dan kontrol fuzzy terdapat beberapa parameter sebagai perbandingan yaitu maximum overshoot, steady state, rise time dan settling time. Hasil dari perbandingan tersebut adalah kontrol fuzzy dapat menghasilkan performa lebih baik jika dibandingkan dengan 4 metode pada kontrol PI. Kontrol fuzzy memiliki nilai rise time sebesar 0,015 detik, nilai settling time sebesar 0,025 detik dengan kecepatan sebesar 2900 rpm serta error steady state sebesar 3,33% tanpa adanya overshoot dan osilasi.

STABILISASI TEGANGAN KELUARAN BUCK CONVERTER DENGAN METODE FUZZY LOGIC CONTROLLER

JURNAL ELTEK ◽  
2018 ◽  
Vol 16 (2) ◽  
pp. 125
Author(s):  
Oktriza Melfazen
Keyword(s):  
Fuzzy Logic ◽  
Steady State ◽  
Rise Time ◽  
Fuzzy Logic Controller ◽  
Buck Converter ◽  
Settling Time

Buck converter idealnya mempunyai keluaran yang stabil, pemanfaatandaya rendah, mudah untuk diatur, antarmuka yang mudah dengan pirantiyang lain, ketahanan yang lebih tinggi terhadap perubahan kondisi alam.Beberapa teknik dikembangkan untuk memenuhi parameter buckconverter. Solusi paling logis untuk digunakan pada sistem ini adalahmetode kontrol digital.Penelitian ini menelaah uji performansi terhadap stabilitas tegangankeluaran buck converter yang dikontrol dengan Logika Fuzzy metodeMamdani. Rangkaian sistem terdiri dari sumber tegangan DC variable,sensor tegangan dan Buck Converter dengan beban resistif sebagaimasukan, mikrokontroler ATMega 8535 sebagai subsistem kontroldengan metode logika fuzzy dan LCD sebagai penampil keluaran.Dengan fungsi keanggotaan error, delta error dan keanggotaan keluaranmasing-masing sebanyak 5 bagian serta metode defuzzifikasi center ofgrafity (COG), didapat hasil rerata error 0,29% pada variable masukan18V–20V dan setpoint keluaran 15V, rise time (tr) = 0,14s ; settling time(ts) = 3,4s ; maximum over shoot (%OS) = 2,6 dan error steady state(ess) = 0,3.

Pulse Rise Time Dependence of Switching Field of Co/Pt Multilayer Dot

2012 ◽  
Vol 132 (10) ◽  
pp. 838-843 ◽  
Author(s):  
Nobuaki Kikuchi ◽  
Yoshihiro Suyama ◽  
Satoshi Okamoto ◽  
Osamu Kitakami
Keyword(s):  
Time Dependence ◽  
Rise Time ◽  
Switching Field ◽  
Pulse Rise Time

Materials Issues and Characterization of Low-k Dielectric Materials

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 49-54 ◽  
Author(s):  
E. Todd Ryan ◽  
Andrew J. McKerrow ◽  
Jihperng Leu ◽  
Paul S. Ho
Keyword(s):  
Process Integration ◽  
Dielectric Materials ◽  
Propagation Delay ◽  
Thermomechanical Properties ◽  
General Criterion ◽  
Crosstalk Noise ◽  
Total Delay ◽  
Interlayer Dielectrics ◽  
Performance Improvements ◽  
And Performance

Continuing improvement in device density and performance has significantly affected the dimensions and complexity of the wiring structure for on-chip interconnects. These enhancements have led to a reduction in the wiring pitch and an increase in the number of wiring levels to fulfill demands for density and performance improvements. As device dimensions shrink to less than 0.25 μm, the propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant. Accordingly the interconnect delay now constitutes a major fraction of the total delay limiting the overall chip performance. Equally important is the processing complexity due to an increase in the number of wiring levels. This inevitably drives cost up by lowering the manufacturing yield due to an increase in defects and processing complexity.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILDs) and alternative architectures have surfaced to replace the current Al(Cu)/SiO2 interconnect technology. These alternative architectures will require the introduction of low-dielectric-constant k materials as the interlayer dielectrics and/or low-resistivity conductors such as copper. The electrical and thermomechanical properties of SiO2 are ideal for ILD applications, and a change to material with different properties has important process-integration implications. To facilitate the choice of an alternative ILD, it is necessary to establish general criterion for evaluating thin-film properties of candidate low-k materials, which can be later correlated with process-integration problems.

Low-Dielectric-Constant Materials for ULSI Interlayer-Dielectric Applications

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 19-27 ◽  
Author(s):  
Wei William Lee ◽  
Paul S. Ho
Keyword(s):  
Packing Density ◽  
Propagation Delay ◽  
Single Chip ◽  
Crosstalk Noise ◽  
Metal Line ◽  
Total Delay ◽  
Interlayer Dielectric ◽  
Low Dielectric ◽  
Interconnect Delay ◽  
Interconnect Technology

Continuing improvement of microprocessor performance historically involves a decrease in the device size. This allows greater device speed, an increase in device packing density, and an increase in the number of functions that can reside on a single chip. However higher packing density requires a much larger increase in the number of interconnects. This has led to an increase in the number of wiring levels and a reduction in the wiring pitch (sum of the metal line width and the spacing between the metal lines) to increase the wiring density. The problem with this approach is that—as device dimensions shrink to less than 0.25 μm (transistor gate length)—propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant due to increased wiring capacitance, especially interline capacitance between the metal lines on the same metal level. The smaller line dimensions increase the resistivity (R) of the metal lines, and the narrower interline spacing increases the capacitance (C) between the lines. Thus although the speed of the device will increase as the feature size decreases, the interconnect delay becomes the major fraction of the total delay and limits improvement in device performance.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILD) as well as alternative architectures have been proposed to replace the current Al(Cu) and SiO2 interconnect technology.

Updated Efficient Area -Carry Select Adder for Low Complexity D LATCH Configuration by disease identification in brain tumor hyper spectral image

2019 ◽  
Vol 14 ◽  
Author(s):  
Teresa V.V ◽  
Anand. B
Keyword(s):  
Research Work ◽  
Low Complexity ◽  
Propagation Delay ◽  
Maximum Speed ◽  
Hyper Spectral ◽  
Ripple Carry Adder ◽  
Minimum Power Consumption ◽  
Carry Select Adder ◽  
The Look ◽  
Propagation Result

Objective: In this research work presents an efficient way Carry Select Adder (CSLA) performance and estimation. The CSLA is utilized in several system to mitigate the issue of carry propagation delay that is happens by severally generating various carries and to get the sum, select a carry because of the uses of various pairs of RCA to provide the sum of the partial section also carry by consisting carry input but the CSLA isn't time economical, then by the multiplexers extreme total and carry is chosen in the selected section. Methodology: The fundamental plan of this work is to attain maximum speed and minimum power consumption by using Binary to Excess-1. Convertor rather than RCA within the regular CSLA. Here RCA denotes the Ripple Carry Adder section. At the span to more cut back the facility consumption, a method of CSLA with D LATCH is implemented during this research work. The look of Updated Efficient Area -Carry Select Adder (UEA-CSLA) is evaluated and intended in XILINX ISE design suite 14. 5 tools. This VLSI arrangement is utilized in picture preparing application by concluding the cerebrum tumor discovery. Conclusion: In this study, medicinal pictures estimation, investigation districts in the multi phantom picture isn't that much proficient to defeat this disadvantage here utilized hyper spectral picture method is presented a sifting procedure in VLSI innovation restriction of cerebrum tumor is performed Updated Efficient Area - Carry Select Adder propagation result dependent on Matrix Laboratory in the adaptation of R2018b.

Extremely Gusty Winds from a Viewpoint of Aerodynamic Force

2020 ◽  
Author(s):  
Junji Maeda ◽  
Takashi Takeuchi ◽  
Eriko Tomokiyo ◽  
Yukio Tamura
Keyword(s):  
Wind Speed ◽  
Wind Tunnel ◽  
Rise Time ◽  
Aerodynamic Force ◽  
Step Function ◽  
Object Size ◽  
Aerodynamic Forces ◽  
Wind Force ◽  
Wind Observation

To quantitatively investigate a gusty wind from the viewpoint of aerodynamic forces, a wind tunnel that can control the rise time of a step-function-like gust was devised and utilized. When the non-dimensional rise time, which is calculated using the rise time of the gusty wind, the wind speed, and the size of an object, is less than a certain value, the wind force is greater than under the corresponding steady wind. Therefore, this wind force is called the “overshoot wind force” for objects the size of orbital vehicles in an actual wind observation. The finding of the overshoot wind force requires a condition of the wind speed recording specification and depends on the object size and the gusty wind speed.

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