Thermal Management of Electronic Devices Using Combined Effects of Nanoparticle Coating and Graphene–Water Nanofluid in a Miniature Loop Heat Pipe

Author(s):  
Trijo Tharayil ◽  
Lazarus Godson Asirvatham ◽  
S. Rajesh ◽  
Somchai Wongwises
2018 ◽  
Vol 2018.67 (0) ◽  
pp. 519
Author(s):  
Yoshitada AONO ◽  
Hosei NAGANO ◽  
Seiji YAMASHITA ◽  
Mamoru ISHIKIRIYAMA ◽  
Yu HOSHINO

Energies ◽  
2021 ◽  
Vol 14 (22) ◽  
pp. 7738
Author(s):  
Marco Bernagozzi ◽  
Nicolas Miché ◽  
Anastasios Georgoulas ◽  
Cedric Rouaud ◽  
Marco Marengo

The present investigation aims to devise a thermal management system (TMS) for electric vehicles able to improve on limitations like charging time and all-electric range, together with the safety and environmental impact of the chosen thermal medium. A research gap is identified, as focus is often on addressing system thermal performance without considering that the thermal medium must not only provide suitable performances, but also must not add risks to both passengers and the environment. Thus, this work proposes an innovative cooling system including graphite sheets and a Loop Heat Pipe, filled with Novec™ 649 as working fluid, due to its exceptional environmental properties (GWP = 1 − ODP = 0) and safety features (non-flammable, non-toxic, dielectric). A three-cell module experimental demonstrator was built to compare temperatures when the proposed TMS is run with Novec™ 649 and ethanol. Results of testing over a bespoke fast charge driving cycle show that Novec™ 649 gave a faster start-up and a slightly higher maximum temperature (0.7 °C), meaning that the gains in safety and lower environmental impact brought by Novec™ 649 came without lowering the thermal performance. Finally, the TMS was tested under three different fast charge conditions (1C, 2C, 3C), obtaining maximum temperatures of 28.4 °C, 36.3 °C and 46.4 °C, respectively.


2017 ◽  
Vol 140 (2) ◽  
Author(s):  
Trijo Tharayil ◽  
Lazarus Godson Asirvatham ◽  
S. Rajesh ◽  
Somchai Wongwises

The effect of nanoparticle coating on the performance of a miniature loop heat pipe (mLHP) is experimentally investigated for heat inputs of 20–380 W using distilled water as the working fluid. Applications include the cooling of electronic devices such as circuit breaker in low voltage switch board and insulated gate bipolar transistor. Physical vapor deposition method is used to coat the nanoparticles on the evaporator surface for different coating thicknesses of 100 nm, 200 nm, 300 nm, 400 nm, and 500 nm, respectively. An optimum filling ratio (FR) of 30% is chosen for the analysis. Experimental findings show that the nanoparticle coating gives a remarkable improvement in heat transfer of the heat pipe. An average reduction of 6.7%, 11.9%, 17.2%, and 22.6% in thermal resistance is observed with coating thicknesses of 100 nm, 200 nm, 300 nm, and 400 nm, respectively. Similarly, enhancements in evaporator heat transfer coefficients of 47%, 63.5%, 73.5%, and 86% are noted for the same coating thicknesses, respectively. Evaporator wall temperature decreased by 15.4 °C for 380 W with a coating thickness of 400 nm. The repeatability test ensures the repeatability of experiments and the stability of coatings in the long run.


2021 ◽  
pp. 1-12
Author(s):  
Filippo Pagnoni ◽  
Vincent Ayel ◽  
Yves Bertin ◽  
Jerome Coulloux ◽  
Maxime Zebian

Author(s):  
Tomonao Takamatsu ◽  
Katsumi Hisano ◽  
Hideo Iwasaki

In this paper is presented the results on performance of the cooling model using Loop Heat Pipe (LHP) system. In recent years, ever-ending demand of high performance CPU led to a rapid increase in the amount of heat dissipation. Consequently, thermal designing of electronic devices need to consider some suitable approach to achieve high cooling performance in limited space. Heat Pipe concept is expected to serve as an effective cooling system for laptop PC, however, it suffered from some problems as follows. The heat transport capability of conventional Heat Pipe decreases with the reduction in its diameter or increase in its length. Therefore, in order to use it as cooling system for future electronic devices, the above-mentioned limitations need to be removed. Because of the operating principle, the LHP system is capable of transferring larger amount of heat than conventional heat pipes. However, most of the LHP systems suffered from some problems like the necessity of installing check valves and reservoirs to avoid occurrence of counter flow. Therefore, we developed a simple LHP system to install it on electronic devices. Under the present experimental condition (the working fluid was water), by keeping the inside diameter of liquid and vapor line equal to 2mm, and the distance between evaporator and condenser equal to 200mm, it was possible to transport more than 85W of thermal energy. The thickness of evaporator was about 5mm although it included a structure to serve the purpose of controlling vapor flow direction inside it. Successful operation of this system at inclined position and its restart capability are confirmed experimentally. In order to make the internal water location visible, the present LHP system is reconstructed using transparent material. In addition, to estimate the limit of heat transport capability of the present LHP system using this thin evaporator, the air cooling system is replaced by liquid cooling one for condensing device. Then this transparent LHP system could transport more than 100W of thermal energy. However, the growth of bubbles in the reserve area with the increase in heat load observed experimentally led to an understanding that in order to achieve stable operation of the LHP system under high heat load condition, it is very much essential to keep enough water in the reserve area and avoid blocking the inlet with bubbles formation.


Author(s):  
D. Bugby ◽  
K. Wrenn ◽  
D. Wolf ◽  
E. Kroliczek ◽  
J. Yun ◽  
...  

2019 ◽  
Vol 48 (6) ◽  
pp. 2456-2477 ◽  
Author(s):  
Anand S. ◽  
Senthil Kumar M. ◽  
Balasubramanian K. R. ◽  
Ajith Krishnan R. ◽  
Maheswari L.

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