Effect of Crack Evolution on the Resistance and Current Density of the Al Metallization in the IGBT Module During Power Cycling

2020 ◽  
Vol 20 (4) ◽  
pp. 706-715
Author(s):  
Fei Qin ◽  
Jingyi Zhao ◽  
Tong An ◽  
Jingru Dai ◽  
Yanwei Dai ◽  
...  
Keyword(s):  
Current Density ◽  
Crack Evolution ◽  
Power Cycling ◽  
Igbt Module ◽  
Al Metallization

Thermo-Mechanical Reliability of 1200V-450A IGBT Module Considering Voids in the Solder Layer

2019 ◽  
Vol 954 ◽  
pp. 202-209
Author(s):  
Xin Hua Guo ◽  
Guang Deng Yang ◽  
Jin Yuan Fu ◽  
Ke Huang
Keyword(s):  
Inelastic Strain ◽  
The Finite Element Method ◽  
Power Cycling ◽  
Power Modules ◽  
Igbt Module ◽  
Before And After ◽  
Bonding Wires ◽  
Transient Thermal ◽  
Strain Increase ◽  
Ansys Workbench

1200V-450A IGBT power modules are fabricated in this paper. We study both the steady state and transient thermal performance of the IGBT assemblies by the finite element method using commercial software ANSYS Workbench to better understand the characteristic. Furthermore, power cycling tests indicate that inelastic strain increase as the numbers of cycles increase. In addition, X-ray photographs and ultrasound scan images were compared before and after the experiment. The thrust force of bonding wires decrease with increasing numbers of cycles, as indicated by tested.

Power cycling test and failure analysis of molded Intelligent Power IGBT Module under different temperature swing durations

2016 ◽  
Vol 64 ◽  
pp. 403-408 ◽  
Author(s):  
U.M. Choi ◽  
F. Blaabjerg ◽  
S. Jørgensen ◽  
F. Iannuzzo ◽  
H. Wang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Cycling Test ◽  
Power Cycling ◽  
Igbt Module ◽  
Temperature Swing
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