Determination of Dynamic Material Properties of Silicone Rubber Using One-Point Measurements and Finite Element Simulations

2012 ◽  
Vol 61 (11) ◽  
pp. 3031-3038 ◽  
Author(s):  
Jürgen Ilg ◽  
Stefan J. Rupitsch ◽  
Alexander Sutor ◽  
Reinhard Lerch
Keyword(s):  
Finite Element ◽  
Silicone Rubber ◽  
Material Properties ◽  
Finite Element Simulations ◽  
Dynamic Material Properties

Determination of Charge Coefficient of Piezoelectric Films Using a Combined Finite Element Model and Dynamic Loading Technique

2020 ◽  
Vol 835 ◽  
pp. 229-242
Author(s):  
Oboso P. Bernard ◽  
Nagih M. Shaalan ◽  
Mohab Hossam ◽  
Mohsen A. Hassan
Keyword(s):  
Finite Element ◽  
Dynamic Loading ◽  
Material Properties ◽  
Accurate Determination ◽  
Substrate Material ◽  
Experimental Results ◽  
Piezoelectric Composite ◽  
Piezoelectric Film ◽  
Piezoelectric Charge

Accurate determination of piezoelectric properties such as piezoelectric charge coefficients (d33) is an essential step in the design process of sensors and actuators using piezoelectric effect. In this study, a cost-effective and accurate method based on dynamic loading technique was proposed to determine the piezoelectric charge coefficient d33. Finite element analysis (FEA) model was developed in order to estimate d33 and validate the obtained values with experimental results. The experiment was conducted on a piezoelectric disc with a known d33 value. The effect of measuring boundary conditions, substrate material properties and specimen geometry on measured d33 value were conducted. The experimental results reveal that the determined d33 coefficient by this technique is accurate as it falls within the manufactures tolerance specifications of PZT-5A piezoelectric film d33. Further, obtained simulation results on fibre reinforced and particle reinforced piezoelectric composite were found to be similar to those that have been obtained using more advanced techniques. FE-results showed that the measured d33 coefficients depend on measuring boundary condition, piezoelectric film thickness, and substrate material properties. This method was proved to be suitable for determination of d33 coefficient effectively for piezoelectric samples of any arbitrary geometry without compromising on the accuracy of measured d33.

scholarly journals Reliability analysis of girth welds by using finite element simulations with uncertain material properties

2021 ◽  
Vol 1043 (3) ◽  
pp. 032071
Author(s):  
Cheng Qian ◽  
Jin Xiao Meng ◽  
Yi Ren ◽  
Bo Sun ◽  
Qiang Feng ◽  
...  
Keyword(s):  
Finite Element ◽  
Reliability Analysis ◽  
Material Properties ◽  
Finite Element Simulations ◽  
Girth Welds ◽  
Uncertain Material Properties

scholarly journals OS1003 Determination of Dynamic Material Properties for PLLA/PCL Polymer Blends Using Experiments and Simulations of SHPB Methods

2012 ◽  
Vol 2012 (0) ◽  
pp. _OS1003-1_-_OS1003-2_
Author(s):  
Yoshitaka ITO ◽  
Masahiro NISHIDA ◽  
Tetsuo TAKAYAMA ◽  
Mitsugu TODO
Keyword(s):  
Polymer Blends ◽  
Material Properties ◽  
Dynamic Material Properties

Determination of Mechanical Properties of Polymer Interphase Using Combined Atomic Force Microscope (AFM) Experiments and Finite Element Simulations

2018 ◽  
Vol 51 (20) ◽  
pp. 8229-8240 ◽  
Author(s):  
Min Zhang ◽  
Yang Li ◽  
Pavan V. Kolluru ◽  
L. Catherine Brinson
Keyword(s):  
Mechanical Properties ◽  
Finite Element ◽  
Atomic Force Microscope ◽  
Finite Element Simulations ◽  
Atomic Force

scholarly journals Population-specific material properties of the implantation site for transcatheter aortic valve replacement finite element simulations

2018 ◽  
Vol 71 ◽  
pp. 236-244 ◽  
Author(s):  
Giorgia M. Bosi ◽  
Claudio Capelli ◽  
Mun Hong Cheang ◽  
Nicola Delahunty ◽  
Michael Mullen ◽  
...  
Keyword(s):  
Finite Element ◽  
Aortic Valve ◽  
Aortic Valve Replacement ◽  
Valve Replacement ◽  
Material Properties ◽  
Transcatheter Aortic Valve Replacement ◽  
Finite Element Simulations ◽  
Implantation Site ◽  
Transcatheter Aortic Valve ◽  
Specific Material

Analysis of Chip Damage Risk in Thermosonic Wire Bonding

2011 ◽  
Vol 478 ◽  
pp. 75-80 ◽  
Author(s):  
Christian Dresbach ◽  
Georg Lorenz ◽  
Matthias Petzold ◽  
Holm Altenbach
Keyword(s):  
Finite Element ◽  
Material Properties ◽  
Electron Backscatter Diffraction ◽  
Copper Wire ◽  
Diffraction Method ◽  
Dielectric Materials ◽  
Finite Element Simulations ◽  
Flat Punch ◽  
Extreme Change ◽  
Damage Risk

In current highly integrated microelectronic devices including system-in-package and stacked-die solutions, system reliability is strongly influenced by reliability of the gold and copper wire bond interconnections. Especially in state-of-the-art ICs containing mechanically sensitive low-K dielectric materials, controlling the mechanical properties of the free air ball (FAB) is of utmost significance due to chip damage risks during the bond process. Because of an extreme change in microstructure when forming the FAB, the material properties change significantly. Consequently, it is necessary to determine the properties of the FAB itself, when analyzing chip damage risks via finite element simulations. We present a micro-compression test that allows the determination of the hardening behavior of typical gold and copper FABs with diameters between 45 µm and 75 µm. In this test a FAB is placed on a diamond support or a test capillary and loaded by a diamond flat punch in a microindenter. The hardening was determined from force/displacement behavior via parameter identification using finite element simulations. The identified yield stresses correlate very well with the microstructure which was determined by electron backscatter diffraction method; this means that the yield stress decreases with increasing mean grain diameter in analogy to the Hall-Petch correlation. Compared to unprocessed wires the initial yield stresses are 50% to 60% lower. Considering these material properties, the damage risk during bonding on complex bond pad layouts can be predicted more realistically. This can be shown by results of real bond structures.

scholarly journals An Evaluation of Material Properties Using EMA and FEM

2016 ◽  
Vol 24 (39) ◽  
pp. 15-22
Author(s):  
Rastislav Ďuriš ◽  
Eva Labašová
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Structural Dynamics ◽  
Material Properties ◽  
Elasticity Modulus ◽  
Natural Frequencies ◽  
Optimization Methods ◽  
Experimental Measurements ◽  
Element Analysis

Abstract The main goal of the paper is the determination of material properties from experimentally measured natural frequencies. A combination of two approaches to structural dynamics testing was applied: the experimental measurements of natural frequencies were performed by Experimental Modal Analysis (EMA) and the numerical simulations, were carried out by Finite Element Analysis (FEA). The optimization methods were used to determine the values of density and elasticity modulus of a specimen based on the experimental results.

scholarly journals Analytic analysis of auxetic metamaterials through analogy with rigid link systems

2018 ◽  
Vol 474 (2210) ◽  
pp. 20170753 ◽  
Author(s):  
Daniel Rayneau-Kirkhope ◽  
Chengzhao Zhang ◽  
Louis Theran ◽  
Marcelo A. Dias
Keyword(s):  
Finite Element ◽  
Mechanical Behaviour ◽  
Material Properties ◽  
Threshold Value ◽  
Finite Element Simulations ◽  
Elastic Instability ◽  
Lattice Systems ◽  
Rigid Link ◽  
Post Buckling ◽  
Insight Into

In recent years, many structural motifs have been designed with the aim of creating auxetic metamaterials. One area of particular interest in this subject is the creation of auxetic material properties through elastic instability. Such metamaterials switch from conventional behaviour to an auxetic response for loads greater than some threshold value. This paper develops a novel methodology in the analysis of auxetic metamaterials which exhibit elastic instability through analogy with rigid link lattice systems. The results of our analytic approach are confirmed by finite-element simulations for both the onset of elastic instability and post-buckling behaviour including Poisson’s ratio. The method gives insight into the relationships between mechanisms within lattices and their mechanical behaviour; as such, it has the potential to allow existing knowledge of rigid link lattices with auxetic paths to be used in the design of future buckling-induced auxetic metamaterials.

Determination of the dynamic material properties of shock loaded silicon-nitride

1994 ◽  
Author(s):  
Hartwig Nahme ◽  
Volker Hohler ◽  
Alois Stilp
Keyword(s):  
Silicon Nitride ◽  
Material Properties ◽  
Dynamic Material Properties
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