Thermal Conductivity: V, High-Temperature Method and Results for Alumina, Magnesia, and Beryllia from 1000° to 1800°C

1954 ◽  
Vol 37 (2) ◽  
pp. 84-88 ◽  
Author(s):  
MALCOLM McQUARRIE
2019 ◽  
Vol 34 (01) ◽  
pp. 2050006
Author(s):  
Lisha Xue ◽  
Chao Fang ◽  
Weixia Shen ◽  
Manjie Shen ◽  
Wenting Ji ◽  
...  

High-pressure technique is an effective route to synthesize thermoelectric materials and tune transport properties simultaneously. In this work, S-doped copper–selenium compounds [Formula: see text], [Formula: see text] were successfully synthesized by high-pressure and high-temperature (HPHT) technology in just 30 min. [Formula: see text] samples show layered morphology composed of abundant pores and lattice defects. The appropriate S introduction ([Formula: see text] and 0.03) can effectively enhance Seebeck coefficient and reduce the thermal conductivity of [Formula: see text]. Compared with the pure [Formula: see text] sample, [Formula: see text] exhibits a 30% lower thermal conductivity, but the decline of power factor by the distinctly increased electrical resistivity at high temperature results in a smaller zT at temperature [Formula: see text] K. The variations of thermoelectric properties are resulted from the competitive effects between S-doping and actual composition change (Cu:S). It indicates that S-doping is not so effective in improving the zT value of [Formula: see text] materials by high-pressure synthesis.


2013 ◽  
Vol 84 (5) ◽  
pp. 054902 ◽  
Author(s):  
M. Manzolaro ◽  
S. Corradetti ◽  
A. Andrighetto ◽  
L. Ferrari

Alloy Digest ◽  
2005 ◽  
Vol 54 (12) ◽  

Abstract Wieland K-88 is a copper alloy with very high electrical and thermal conductivity, good strength, and excellent stress relaxation resistance at elevated temperatures. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: CU-738. Producer or source: Wieland Metals Inc.


Small ◽  
2021 ◽  
pp. 2102128
Author(s):  
Taehun Kim ◽  
Seongkyun Kim ◽  
Eungchul Kim ◽  
Taesung Kim ◽  
Jungwan Cho ◽  
...  

2006 ◽  
Vol 317-318 ◽  
pp. 501-504 ◽  
Author(s):  
Mineaki Matsumoto ◽  
Norio Yamaguchi ◽  
Hideaki Matsubara

Effect of La2O3 addition on thermal conductivity and high temperature stability of YSZ coating produced by EB-PVD was investigated. La2O3 was selected as an additive because it had a significant effect on suppressing densification of YSZ. The developed coating showed extremely low thermal conductivity as well as high resistance to sintering. Microstructural observation revealed that the coating had fine feather-like subcolumns and nanopores, which contributed to limit thermal transport. These nanostructures were thought to be formed by suppressing densification during deposition.


2003 ◽  
Vol 793 ◽  
Author(s):  
Y. Amagai ◽  
A. Yamamoto ◽  
C. H. Lee ◽  
H. Takazawa ◽  
T. Noguchi ◽  
...  

ABSTRACTWe report transport properties of polycrystalline TMGa3(TM = Fe and Ru) compounds in the temperature range 313K<T<973K. These compounds exhibit semiconductorlike behavior with relatively high Seebeck coefficient, electrical resistivity, and Hall carrier concentrations at room temperature in the range of 1017- 1018cm−3. Seebeck coefficient measurements reveal that FeGa3isn-type material, while the Seebeck coefficient of RuGa3changes signs rapidly from large positive values to large negative values around 450K. The thermal conductivity of these compounds is estimated to be 3.5Wm−1K−1at room temperature and decreased to 2.5Wm−1K−1for FeGa3and 2.0Wm−1K−1for RuGa3at high temperature. The resulting thermoelectric figure of merit,ZT, at 945K for RuGa3reaches 0.18.


2010 ◽  
Vol 493 (1-2) ◽  
pp. 427-430 ◽  
Author(s):  
Huan Jiao ◽  
Xuan Gao ◽  
Fei Wang ◽  
Ai Wu ◽  
Ting Han

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