An Analysis of the Effect of Laser Beam Geometry on Laser Transformation Hardening

2005 ◽  
Vol 128 (3) ◽  
pp. 659-667 ◽  
Author(s):  
Shakeel Safdar ◽  
Lin Li ◽  
M. A. Sheikh ◽  
Zhu Liu
Keyword(s):  
Laser Beam ◽  
Laser Scanning ◽  
Rapid Heating ◽  
Homogenization Temperature ◽  
Slow Heating ◽  
Transient Effects ◽  
Full Transformation ◽  
Heating And Cooling ◽  
Beam Geometry ◽  
Laser Transformation Hardening

The effect of transformation hardening depends upon both heating and cooling rates. It is desirable to have a slow heating rate and a rapid cooling rate to achieve full transformation. To date laser transformation hardening has been carried out using circular or rectangular beams which result in rapid heating and cooling. Although the use of different beam intensity distributions within the circular or rectangular laser beams has been studied to improve the process, no other beam geometries have been investigated so far for transformation hardening. This paper presents an investigation into the effects of different laser beam geometries in transformation hardening. Finite element modeling technique has been used to simulate the steady state and transient effects of moving beams in transformation hardening of EN 43A steel. The results are compared with experimental data. The work shows that neither of the two commonly used beams, circular and rectangular, are optimum beam shapes for transformation hardening. The homogenization temperature exceeds the melting point for these beam shapes for the usual laser scanning speeds and power density. Triangular beam geometry has been shown to produce the best thermal history to achieve better transformation and highest hardness due to slower heating without sacrificing the processing rate and hardening depths.

Modelling of laser cladding of medium carbon steel - a first approach

2004 ◽  
Vol 120 ◽  
pp. 405-412
Author(s):  
J. Ahlström ◽  
B. Karlsson ◽  
S. Niederhauser
Keyword(s):  
Carbon Steel ◽  
Laser Beam ◽  
Laser Cladding ◽  
Rapid Heating ◽  
Current Model ◽  
Substrate Material ◽  
Medium Carbon Steel ◽  
Medium Carbon ◽  
Heating And Cooling ◽  
Railway Wheels

A model on laser cladding of medium carbon steel, used in railway wheels and rails, is developed and implemented. When the laser beam is scanned over the surface during the cladding operation, phase transformations occur in the topmost layer of the substrate material due to rapid heating and cooling. The hardened regions may later be annealed, either during subsequent passes of the laser beam or by for example induction heating. The current model is a first step towards judging the resulting microstructure and hardness in the heat affected zone under the clad.

Influence of Intrinsic Heat Treatment (IHT) on Precipitation Kinetics during Laser Beam Powder Bed Fusion of Al-Mg-Sc Alloy

2021 ◽  
Vol 1161 ◽  
pp. 47-55
Author(s):  
Yuvaraj Ganpati Patil ◽  
Loreen Mertens ◽  
Andre Dröse ◽  
Vasily Ploshikhin
Keyword(s):  
Laser Beam ◽  
Volume Fraction ◽  
Rapid Heating ◽  
Process Analysis ◽  
Powder Bed Fusion ◽  
Precipitation Kinetics ◽  
Powder Bed ◽  
Post Process ◽  
Heating And Cooling

Laser Beam Powder Bed Fusion (LBPBF) process has a unique feature termed as IntrinsicHeat Treatment (IHT), where solidified layers undergo series of heating and cooling (during thesubsequent building of a part). Thus, the LBPBF process offers the opportunity for the formation of microstructuralfeatures, which can have the potential to transform the mechanical properties of the part.In the case of AlMgSc alloy, L12 phase Al3Sc precipitates are thermodynamically favored to nucleatein the Al matrix due to coherency. After post-process analysis, it is evident that Al3Sc precipitatesformed during the LBPBF process, but it is unlikely to monitor (in-situ) the kinetics of precipitation.Therefore, based on inputs from the thermal model, the simulation of precipitation kinetics during theLBPBF process (IHT) is performed. The rapid heating and cooling cause the formation of new vacancies,where Al3Sc precipitates can nucleate and grow. The KWN model based on solid-state phasetransformation is used for modeling of precipitation kinetics. The thermal data at two locations in apart is collected and used to determine the average radius, number density, and volume fraction ofprecipitates. It is found that the IHT does not influence precipitation kinetics, and has no potential toalter the spatial properties of the part.

scholarly journals QPOs in compact binaries from small scale eruptions in an inner magnetized disk

2020 ◽  
Author(s):  
Nicolas Scepi ◽  
Mitchell C Begelman ◽  
Jason Dexter
Keyword(s):  
Rapid Heating ◽  
Small Scale ◽  
Type B ◽  
Periodic Oscillations ◽  
X Ray ◽  
Compact Binaries ◽  
Heating And Cooling ◽  
Low Mass ◽  
X Ray Binaries ◽  
Standard Disk

Abstract Dwarf novæ (DNe) and low mass X-ray binaries (LMXBs) are compact binaries showing variability on time scales from years to less than seconds. Here, we focus on explaining part of the rapid fluctuations in DNe, following the framework of recent studies on the monthly eruptions of DNe that use a hybrid disk composed of an outer standard disk and an inner magnetized disk. We show that the ionization instability, that is responsible for the monthly eruptions of DNe, is also able to operate in the inner magnetized disk. Given the low density and the fast accretion time scale of the inner magnetized disk, the ionization instability generates small, rapid heating and cooling fronts propagating back and forth in the inner disk. This leads to quasi-periodic oscillations (QPOs) with a period of the order of 1000 s. A strong prediction of our model is that these QPOs can only develop in quiescence or at the beginning/end of an outburst. We propose that these rapid fluctuations might explain a subclass of already observed QPOs in DNe as well as a, still to observe, subclass of QPOs in LMXBs. We also extrapolate to the possibility that the radiation pressure instability might be related to Type B QPOs in LMXBs.

Numerical Simulation on Temperature Field in Multi-Layers Inside-Beam Powder Feeding when Laser Cladding

2012 ◽  
Vol 499 ◽  
pp. 114-119 ◽  
Author(s):  
Ming Di Wang ◽  
Shi Hong Shi ◽  
X.B. Liu ◽  
Cheng Fa Song ◽  
Li Ning Sun
Keyword(s):  
Numerical Simulation ◽  
Heat Source ◽  
Laser Beam ◽  
Cooling Rate ◽  
Light Source ◽  
Laser Cladding ◽  
Laser Scanning ◽  
Initial Conditions ◽  
Cladding Layer ◽  
Powder Feeding

Numerical simulation of laser cladding is the main research topics for many universities and academes, but all researchers used the Gaussian laser light source. Due to using inside-beam powder feeding for laser cladding, the laser is dispersed by the cone-shaped mirror, and then be focused by the annular mirror, the laser can be assumed as the light source of uniform intensity.In this paper,the temperature of powder during landing selected as the initial conditions, and adopting the life-and-death unit method, the moving point heat source and the uniform heat source are realized. In the thickness direction, using the small melt layer stacking method, a finite element model has been established, and layer unit is acted layer by layer, then a virtual reality laser cladding manu-facturing process is simulated. Calculated results show that the surface temperature of the cladding layer depends on the laser scanning speed, powder feed rate, defocus distance. As cladding layers increases, due to the heat conduction into the base too late, bath temperature will gradually increase. The highest temperature is not at the laser beam, but at the later point of the laser beam. In the clad-ding process, the temperature cooling rate of the cladding layer in high temperature section is great, and in the low-temperature, cooling rate is relatively small. These conclusions are also similar with the normal laser cladding. Finally, some experiments validate the simulation results. The trends of simulating temperature are fit to the actual temperature, and the temperature gradient can also ex-plain the actual shape of cross-section.

Rapid heating and cooling of aluminum alloys in a fluidized bed

1970 ◽  
Vol 12 (2) ◽  
pp. 156-159 ◽  
Author(s):  
V. P. Kurbatov ◽  
V. I. Murav'ev
Keyword(s):  
Aluminum Alloys ◽  
Fluidized Bed ◽  
Rapid Heating ◽  
Heating And Cooling

Hollow Graphitic Carbon Nanospheres Synthesized by Rapid Pyrolytic Carbonization

2021 ◽  
Vol 68 ◽  
pp. 1-16
Author(s):  
Cheng Zhang ◽  
Qing Shan Gao ◽  
Lu Yun Jiao ◽  
Laura Bogen ◽  
Nicole Forte ◽  
...  
Keyword(s):  
Rapid Heating ◽  
Conductivity Measurement ◽  
Graphitic Carbon ◽  
Bet Surface Area ◽  
Slow Heating ◽  
X Ray Diffraction ◽  
Carbon Nanospheres ◽  
X Ray ◽  
Carbonization Process ◽  
Transmission Electron

Hollow graphitic porous carbon nanosphere (CNS) materials are synthesized from polymerization of resorcinol (R) and formaldehyde (F) in the presence of templating iron polymeric complex (IPC), followed by carbonization treatment. The effect of rapid heating in the carbonization process is investigated for the formation of hollow graphitic carbon nanospheres. The resulting CNS from rapid heating was characterized for its structure and properties by transmission electron microscope (TEM), x-ray diffraction (XRD), Raman spectroscopy, bulk conductivity measurement and Brunauer-Emmett-Teller (BET) surface area. Hollow graphitic CNS with reduced degree of agglomeration is observed under rapid heating during the carbonization process when compared to the CNS synthesized using the standard slow heating approach. Key words: carbon nanosphere (CNS), rapid pyrolytic carbonization, agglomeration

High Productivity Thermo-Compression Flip Chip Bonding

2014 ◽  
Vol 2014 (1) ◽  
pp. 000100-000106
Author(s):  
Tom Colosimo ◽  
Horst Clauberg ◽  
Evan Galipeau ◽  
Matthew B. Wasserman ◽  
Michael Schmidt-Lange ◽  
...  
Keyword(s):  
High Speed ◽  
Large Scale ◽  
Flip Chip ◽  
Solder Joints ◽  
Rapid Heating ◽  
Temperature Cycle ◽  
Temperature Uniformity ◽  
Heating Rates ◽  
Heating And Cooling ◽  
Chip Technology

Advancements in electronic packaging performance and cost have historically been driven by higher integration primarily provided by fab shrinks that has followed the well-known Moore's law. However, due to the tremendous and continuously increasing cost of building new fabs, the performance/cost improvements achieved via node shrinks are negated. This leaves packaging innovation as the vehicle to achieve future cost-performance improvements. This has initiated a More-than-Moore idea that has led to vigorous R&D in packaging. Advanced packages which employ ultra-fine pitch flip chip technology for chip-to-substrate, chip-to-chip, or chip-to-interposer for the first level interconnect have been developed as an answer to obtaining higher performance. However, the costs are too high as compared to traditional wire bonding. The status today is that the fundamental technical hurdles of manufacturing the new advanced packages have been solved, but cost reduction and yield improvements have to be addressed for large-scale adoption into high volume manufacturing. In traditional flip chip assembly silicon chips are tacked onto a substrate and then the solder joints are melted and mass reflowed in an oven. This mass reflow technique is troublesome as the pitch of the solder bumps become finer. This is due to the large differences in the thermal expansion coefficient of the die and the substrate, which creates stress at the solder joints and warpage of the package when the die and substrate are heated and cooled together. To mitigate and resolve this issue, thermo-compression bonders have been developed which locally reflow the solder without subjecting the entire substrate to the heating and cooling cycle. This requires that the bondhead undergo heating past the melting point of solder and then cooling down to a low enough temperature to pick the next die from the wafer that is mounted to tape. Machines in the market today can accomplish this temperature cycle in 7 to 15 seconds. This is substantially slower than the standard flip chip process which leads to high cost and is delaying the introduction of these new packages. This paper shows a flip chip bonder with a new heating and cooling concept that will radically improve the productivity of thermo-compression bonding. Data and productivity cycles from this new bond head with heating rates of over 200°C/sec and cooling of faster than 100°C/sec are revealed. Experimental results are shown of exceptional temperature accuracy across the die of 5°C throughout the cycle and better than 3°C at the final heating stage. The high speed thermo-compression bonds are analyzed and the efficacy of the new concept is proven. Excellent temperature uniformity while heating rapidly is an absolute necessity for enabling good solder joints in a fast process. Without good temperature uniformity, additional dwell times need to be incorporated to allow heat to flow to all of the joints, negating any benefits from rapid heating. Whereas the current state-of-that-art is often to program temperature in steps, this bonder can be commanded and accurately follows more complex temperature profiles with great accuracy. Examples of how this profiling can be used to enhance the uniformity and integrity of the joints with non-conductive pastes, film, and without underfill along with the associated productivity improvements will be shown. Tests that show portability across platforms that will lead to set up time and yield improvements and are identified and quantified. Additionally new ideas for materials and equipment development to further enhance productivity and yield are explored.

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