Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

1997 ◽  
Vol 119 (3) ◽  
pp. 163-170 ◽  
Author(s):  
W. Jung ◽  
J. H. Lau ◽  
Y.-H. Pao
Keyword(s):  
Solder Joint ◽  
Prediction Models ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Reliability Prediction ◽  
Full Matrix ◽  
The Past ◽  
Mask Design ◽  
Plastic Ball ◽  
Joint Deformation

The application of Ball Grid Array (BGA) technology in electronic packaging on high I/O plastic and ceramic packages has grown significantly during the past few years. Although PBGA (plastic BGA) has several advantages over fine-pitch Quad Flat Pack (QFP) in terms of smaller package area, higher I/Os, lower switching noise, large pitch, higher assembly yield, and improved robustness in manufacturing process, potential package reliability problems can still occur, e.g., excessive solder joint deformation induced by substrate warpage, moisture ingression (popcorn effect), large variation in solder ball size, voiding as a result of flux entrapment and improper pad/solder mask design (Marrs and Olachea, 1994; Solberg, 1994; Freyman and Petrucci, 1995; Lau, 1995; Donlin, 1996; Lasky et al., 1996; Munroe et al., 1996). Regardless of its improved thermal fatigue performance over the past few years through an extensive amount of research, the BGA solder joint may still pose a reliability issue under harsh environment, e.g., automotive underhood, larger package size, or higher temperature and temperature gradient due to increase in power dissipation of the package. Numerous studies in BGA solder joint deformation and reliability under thermal and mechanical loadings can be found in the literature, e.g., Borgesen et al. (1993), Choi et al. (1993), Guo et al. (1993), Ju et al. (1994), Lau et al. (1994) Lau (1995), and Heinrich et al. (1995). Also, reliability prediction models have been developed by, e.g., Darveaux et al. (1995) and Darveaux (1996). The present study focuses on the application of a detailed nonlinear finite element analysis (FEA) to studying the thermal cyclic response of solder joints in two particular BGA packages, full-matrix and perimeter. Both time-independent plasticity and time-dependent effect, i.e., creep and relaxation, are considered in the constitutive equations of solder joint to evaluate the discrepancy in the results of life prediction. The critical solder joint is identified, and the locations that are most susceptible to fatigue failure in the critical joint are discussed. Some limitations in computation and reliability prediction are also discussed.

Elevated Stand-Off Heights in Solder Joint Interconnections of Surface Mounted IC Packages Result in Appreciable Stress and Warpage Relief

2018 ◽  
Vol 2018 (1) ◽  
pp. 000534-000542
Author(s):  
Ephraim Suhir ◽  
Sung Yi ◽  
Jennie S. Hwang ◽  
R. Ghaffarian
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Calculated Data ◽  
Ball Grid Array ◽  
Substantial Improvement ◽  
Stress Model ◽  
Solder Material ◽  
The Difference ◽  
Free Solder ◽  
Ic Package

Abstract The “head-in-pillow” (HnP) defects in lead-free solder joint interconnections of IC packages with conventional (small) stand-off heights of the solder joints, and particularly in packages with fine pitches, are attributed by many electronic material scientists to the three major causes: 1) attributes of the manufacturing process, 2) solder material properties and 3)design-related issues. The latter are thought to be caused primarily by elevated stresses in the solder material, as well as by the excessive warpage of the PCB-package assembly and particularly to the differences in the thermally induced curvatures of the PCB and the package. In this analysis the stress-and-warpage issue is addressed using an analytical predictive stress model. This model is a modification and an extension of the model developed back in 1980-s by the first author. It is assumed that it is the difference in the post-fabrication deflections of the PCB-package assembly that is the root cause of the solder materials failures and particularly and perhaps the HnP defects. The calculated data based on the developed analytical thermal stress model suggest that the replacement of the conventional ball-grid-array (BGA) designs with designs characterized by elevated stand-off heights of the solder joints could result in significant stress and warpage relief and, hopefully, in a lower propensity of the IC package to HnP defects as well. The general concepts are illustrated by a numerical example, in which the responses to the change in temperature of a conventional design referred to as ball-grid-array (BGA) and a design with solder joints with elevated stand-off heights referred to as column-grid-array (CGA) are compared. The computed data indicated that the effective stress in the solder material is relieved by about 40% and the difference between the maximum deflections of the PCB and the package is reduced by about 60%, when the BGA design is replaced by a CGA system. Although no proof that the use of solder joints with elevated stand-off heights will lessen the package propensity to the HnP defects is provided, the authors think that there is a reason to believe that the application of solder joints with elevated stand-off heights could result in a substantial improvement in the general IC package performance, including, perhaps, its propensity to HnP defects.

Failure Analysis of the Solder Joints in Flip-Chip BGA Packages under Free-Drop Test

2014 ◽  
Vol 936 ◽  
pp. 628-632 ◽  
Author(s):  
Guo Zheng Yuan ◽  
Xia Chen ◽  
Xue Feng Shu
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Test Method ◽  
Drop Test ◽  
Test Reliability ◽  
Internal Crack ◽  
The Real ◽  
Plastic Ball ◽  
Free Drop

The failure of plastic ball grid array under intense dynamic loading was studied in the project. This paper presents the drop test reliability results of SnPb flip-chip on a standard JEDEC drop reliability test board. The failure mode and mechanism of planar array package in the drop test was comprehensively analyzed. High acceleration dropping test method was used to research the reliability of BGA (ball grid array) packages during the free-drop impact process. The model RS-DP-03A drop device was used to simulate the falling behavior of BGA chip packages under the real conditions, The drop condition meets the JEDEC22-B111 standards (pulse peak 1500g, pulse duration 0.5 ms) when dropping from the 650mm height . In the testing, according to the real-time changes of dynamic voltage, the relationship between drop times and different phases of package failure was analyzed. With the dye-penetrated method and optical microscopy, it was easy to observe the internal crack and failure locations. The growth mechanism of the cracks in solder joints under the condition of drop-free was analyzed and discussed.

A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads

1999 ◽  
Vol 123 (2) ◽  
pp. 127-131 ◽  
Author(s):  
Kuo-Ning Chiang ◽  
Chang-Ming Liu
Keyword(s):  
Thermal Stress ◽  
Solder Joint ◽  
Solder Joints ◽  
Numerical Models ◽  
Ball Grid Array ◽  
Stress Strain ◽  
Restoring Force ◽  
Array Type ◽  
Finite Element Software ◽  
Area Array

As electronic packaging technology moving to the CSP, wafer level packaging, fine pitch BGA (ball grid array) and high density interconnections, the wireability of the PCB/substrate and soldering technology are as important as reliability issues. In this work, a comparison of elliptical/round pads of area array type packages has been studied for soldering, reliability, and wireability requirements. The objective of this research is to develop numerical models for predicting reflow shapes of solder joint under elliptical/round pad boundary conditions and to study the reliability issue of the solder joint. In addition, a three-dimensional solder liquid formation model is developed for predicting the geometry, the restoring force, the wireability, and the reliability of solder joints in an area array type interconnections (e.g., ball grid array, flip chip) under elliptical and round pad configurations. In general, the reliability of the solder joints is highly dependent on the thermal-mechanical behaviors of the solder and the geometry configuration of the solder ball. These reliability factors include standoff height/contact angle of the solder joint, and the geometry layout/material properties of the package. An optimized solder pad design cannot only lead to a good reliability life of the solder joint but also can achieve a better wireability of the substrate. Furthermore, the solder reflow simulation used in this study is based on an energy minimization engine called Surface Evolver and the finite element software ABAQUS is used for thermal stress/strain nonlinear analysis.

The Anti-Vibration Design of the Ball Grid Array Solder Joint

2015 ◽  
Vol 713-715 ◽  
pp. 103-106
Author(s):  
Fan You ◽  
Yong Guang Huang ◽  
Ben Li
Keyword(s):  
Finite Element Method ◽  
Stress Response ◽  
Solder Joint ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Solid Model ◽  
The Finite Element Method ◽  
Lower Height ◽  
Different Diameters ◽  
Vibration Performance

In order to improve the anti-vibration performance of the Ball Grid Array solder joints, its solid model is established in ANSYS. Analyzing the stress response under the shock and vibration environment by using the finite element method. Then discussing the stress response of solder joints with different diameters and different heights in the same shock and vibration environment of each location for providing the basis for anti-vibration design. The results show that the longer diameter and lower height solder joint is more favorable to improve its anti-vibration performance.

Sign in / Sign up

Export Citation Format

Share Document