scholarly journals Predictive Modeling for Glass-Side Laser Scribing of Thin Film Photovoltaic Cells

Author(s):  
Hongliang Wang ◽  
Shan-Ting Hsu ◽  
Huade Tan ◽  
Y. Lawrence Yao ◽  
Hongqiang Chen ◽  
...  

Laser scribing of multilayer-thin-film solar cells is an important process for producing integrated serial interconnection of mini-modules, used to reduce photocurrent and resistance losses in a large-area solar cell. Quality of such scribing contributes to the overall quality and efficiency of the solar cell, and therefore predictive capabilities of the process are essential. Limited numerical work has been performed in predicting the thin film laser removal processes. In this study, a fully-coupled multilayer thermal and mechanical finite element model is developed to analyze the laser-induced spatio-temporal temperature and thermal stress responsible for SnO2:F film removal. A plasma expansion induced pressure model is also investigated to simulate the nonthermal film removal of CdTe due to the micro-explosion process. Corresponding experiments of SnO2:F films on glass substrates by 1064 nm ns laser irradiation show a similar removal process to that predicted in the simulation. Differences between the model and experimental results are discussed and future model refinements are proposed. Both simulation and experimental results from glass-side laser scribing show clean film removal with minimum thermal effects indicating minimal changes to material electrical properties.

Author(s):  
Hongliang Wang ◽  
Y. Lawrence Yao ◽  
Hongqiang Chen

Laser scribing is an important manufacturing process used to reduce photocurrent and resistance losses and increase solar cell efficiency through the formation of serial interconnections in large-area solar cells. High-quality scribing is crucial since the main impediment to large-scale adoption of solar power is its high-production cost (price-per-watt) compared to competing energy sources such as wind and fossil fuels. In recent years, the use of glass-side laser scribing processes has led to increased scribe quality and solar cell efficiencies; however, defects introduced during the process such as thermal effect, microcracks, film delamination, and removal uncleanliness keep the modules from reaching their theoretical efficiencies. Moreover, limited numerical work has been performed in predicting thin-film laser removal processes. In this study, a nanosecond (ns) laser with a wavelength at 532 nm is employed for pattern 2 (P2) scribing on CdTe (cadmium telluride) based thin-film solar cells. The film removal mechanism and defects caused by laser-induced micro-explosion process are studied. The relationship between those defects, removal geometry, laser fluences, and scribing speeds are also investigated. Thermal and mechanical numerical models are developed to analyze the laser-induced spatiotemporal temperature and pressure responsible for film removal. The simulation can well-predict the film removal geometries, transparent conducting oxide (TCO) layer thermal damage, generation of microcracks, film delamination, and residual materials. The characterization of removal qualities will enable the process optimization and design required to enhance solar module efficiency.


2001 ◽  
Vol 15 (17n19) ◽  
pp. 667-670 ◽  
Author(s):  
Y. RODRÍGUEZ-LAZCANO ◽  
M. T. S. NAIR ◽  
P. K. NAIR

The possibility of generating ternary compounds through annealing thin film stacks of binary composition has been demonstrated before. In this work we report a method to produce large area coating of ternary compounds through a reaction in solid state between thin films of Sb2S3 and CuS. Thin films of Sb2S3 -CuS were deposited on glass substrates in the sequence of Sb2S3 followed by CuS (on Sb2S3 ) using chemical bath deposition method. The multilayer stack, thus produced, of approximately 0.5 μm in thickness, where annealed under nitrogen and argon atmospheres at different temperatures to produce films of ternary composition, CuxSbySz . An optical band gap of ~1.5 eV was observed in these films, suggesting that the thin films of ternary composition formed in this way are suitable for use as absorber materials in photovoltaic devices. The results on the analyses of structural, electrical and optical properties of films formed with different combinations of thickness in the multilayers will be discussed in the paper.


2013 ◽  
Vol 1538 ◽  
pp. 275-280
Author(s):  
S.L. Rugen-Hankey ◽  
V. Barrioz ◽  
A. J. Clayton ◽  
G. Kartopu ◽  
S.J.C. Irvine ◽  
...  

ABSTRACTThin film deposition process and integrated scribing technologies are key to forming large area Cadmium Telluride (CdTe) modules. In this paper, baseline Cd1-xZnxS/CdTe solar cells were deposited by atmospheric-pressure metal organic chemical vapor deposition (AP-MOCVD) onto commercially available ITO coated boro-aluminosilicate glass substrates. Thermally evaporated gold contacts were compared with a screen printed stack of carbon/silver back contacts in order to move towards large area modules. P2 laser scribing parameters have been reported along with a comparison of mechanical and laser scribing process for the scribe lines, using a UV Nd:YAG laser at 355 nm and 532 nm fiber laser.


1963 ◽  
Author(s):  
J. C. Schaefer ◽  
R. J. Humrick ◽  
E. R. Hill

2020 ◽  
Vol 110 ◽  
pp. 110524
Author(s):  
Ali Baltakesmez ◽  
Betül Güzeldir ◽  
Yunus Alkan ◽  
Mustafa Sağlam ◽  
Mehmet Biber

Metals ◽  
2018 ◽  
Vol 8 (8) ◽  
pp. 599 ◽  
Author(s):  
Fei Liu ◽  
Huixia Liu ◽  
Chenkun Jiang ◽  
Youjuan Ma ◽  
Xiao Wang

A novel high strain rate microforming technique, laser impact liquid flexible embossing (LILFE), which uses laser induced shock waves as an energy source, and liquid as a force transmission medium, is proposed by this paper in order to emboss three-dimensional large area micro arrays on metallic foils and to overcome some of the defects of laser direct shock microembossing technology. The influences of laser energy and workpiece thickness on the deformation characteristics of the pure copper foils with the LILFE process were investigated through experiments and numerical simulation. A finite element model was built to further understand the typical stages of deformation, and the results of the numerical simulation are consistent with those achieved from the experiments. The experimental and simulation results show that the forming accuracy and depth of the embossed parts increases with the increase in laser energy and decrease in workpiece thickness. The thickness thinning rate of the embossed parts increases with the decrease of the workpiece thickness, and the severest thickness thinning occurs at the bar corner region. The experimental results also show that the LILFE process can protect the workpiece surface from being ablated and damaged, and can ensure the surface quality of the formed parts. Besides, the numerical simulation studies reveal the plastic strain distribution of embossed microfeatures under different laser energy.


1995 ◽  
Vol 377 ◽  
Author(s):  
S. Sherman ◽  
P-Y. Lu ◽  
R. A. Gottscho ◽  
S. Wagner

ABSTRACTWe evaluated the characteristics of a-Si:H/a-SiNx:H thin film transistors (TFTs), and of separately deposited a-Si:H films, as functions of the a-Si:H deposition power in a high-rate, large-area, 40 MHz PE-CVD system. TFT performance and a-Si:H film properties improve with decreasing power density and deposition rate. However, low defect density a-Si:H material was deposited at rates as high as 1500 Å/min. TFTs with gate nitride deposited at 1000 A/min show excellent I-V characteristics when the a-Si:H deposition power is low enough. The TFT electron mobility in the linear regime correlates well with the Urbach energy of the a-Si:H films, suggesting that the quality of the a-Si: H controls the performance of our TFTs.


Sign in / Sign up

Export Citation Format

Share Document