scholarly journals Failure Analysis of Direct Liquid Cooling System in Data Centers

2018 ◽  
Vol 140 (2) ◽  
Author(s):  
Sami Alkharabsheh ◽  
Udaya L. N. Puvvadi ◽  
Bharath Ramakrishnan ◽  
Kanad Ghose ◽  
Bahgat Sammakia
Keyword(s):  
Cooling System ◽  
Processing Unit ◽  
System Failure ◽  
Liquid Cooling ◽  
Central Processing ◽  
Chip Temperature ◽  
Cpu Utilization ◽  
Speed Change ◽  
Liquid Cooling System ◽  
The Impact

In this paper, the impact of direct liquid cooling (DLC) system failure on the information technology (IT) equipment is studied experimentally. The main factors that are anticipated to affect the IT equipment response during failure are the central processing unit (CPU) utilization, coolant set point temperature (SPT), and the server type. These factors are varied experimentally and the IT equipment response is studied in terms of chip temperature and power, CPU utilization, and total server power. It was found that failure of this cooling system is hazardous and can lead to data center shutdown in less than a minute. Additionally, the CPU frequency throttling mechanism was found to be vital to understand the change in chip temperature, power, and utilization. Other mechanisms associated with high temperatures were also observed such as the leakage power and the fans' speed change. Finally, possible remedies are proposed to reduce the probability and the consequences of the cooling system failure.

Failure Analysis of Direct Liquid Cooling System in Data Centers

2017 ◽  
Author(s):  
Sami Alkharabsheh ◽  
Bharath Ramakrishnan ◽  
Bahgat Sammakia
Keyword(s):  
Data Center ◽  
Cooling System ◽  
System Failure ◽  
Liquid Cooling ◽  
Chip Temperature ◽  
Cpu Utilization ◽  
Speed Change ◽  
Main Factors ◽  
Liquid Cooling System ◽  
The Impact

In this paper, the impact of direct liquid cooling (DLC) system failure on the IT equipment is studied experimentally. The main factors that are anticipated to affect the IT equipment response during failure are the CPU utilization, coolant set point temperature (SPT) and the server type. These factors are varied experimentally and the IT equipment response is studied in terms of chip temperature and power, CPU utilization and total server power. It was found that failure of the cooling system is hazardous and can lead to data center shutdown in less than a minute. Additionally, the CPU frequency throttling mechanism was found to be vital to understand the change in chip temperature, power, and utilization. Other mechanisms associated with high temperatures were also observed such as the leakage power and the fans speed change. Finally, possible remedies are proposed to reduce the probability and the consequences of the cooling system failure.

Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers

2018 ◽  
Author(s):  
Sami Alkharabsheh ◽  
Udaya L. N. Puvvadi ◽  
Bharath Ramakrishnan ◽  
Kanad Ghose ◽  
Bahgat Sammakia
Keyword(s):  
Data Center ◽  
Cooling System ◽  
Rate Of Change ◽  
Operating Conditions ◽  
Thermal Mass ◽  
Liquid Cooling ◽  
Chip Temperature ◽  
Fan Speed ◽  
Liquid Cooling System ◽  
The Impact

This work experimentally studies the impact of facility cooling failure of a direct liquid cooling (DLC) system on the IT equipment (ITE). The facility side of a DLC system removes the heat from a secondary loop — in direct contact with the ITE — and discard it in a chiller loop or ambient. The CPU utilization and coolant set point temperature (SPT) are varied to understand the effect of failure under different operating conditions. The ITE response is studied in terms of chip temperature and power, and fan speed. It was found that failure of the facility cooling system is not hazardous to the IT operation. The rate of change in temperature after failure is low and is sufficient to turn the ITE off safely. This is attributed to the surrounding air in the data center and the thermal mass of the cooling system.

Multi-objective optimization of a chip-attached micro pin fin liquid cooling system

2021 ◽  
pp. 117187
Author(s):  
Vahideh Radmard ◽  
Yaser Hadad ◽  
Srikanth Rangarajan ◽  
Cong H. Hoang ◽  
Najmeh Fallahtafti ◽  
...  
Keyword(s):  
Cooling System ◽  
Multi Objective Optimization ◽  
Liquid Cooling ◽  
Multi Objective ◽  
Pin Fin ◽  
Liquid Cooling System

Study on Copper Cold Plate Designs for Electronics Liquid Cooling System

2006 ◽  
Author(s):  
Yi. Feng ◽  
Y. Wang ◽  
C. Y. Huang
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Cooling System ◽  
Pure Copper ◽  
Cold Plate ◽  
Performance Limits ◽  
Liquid Cooling ◽  
Cold Plates ◽  
Management Approaches ◽  
Liquid Cooling System

The increasing power consumption of microelectronic systems and the dense layout of semiconductor components leave very limited design spaces with tight constraints for the thermal solution. Conventional thermal management approaches, such as extrusion, fold-fin, and heat pipe heat sinks, are somehow reaching their performance limits, due to the geometry constraints. Currently, more studies have been carried out on the liquid cooling technologies, as the flexible tubing connection of liquid cooling system makes both the accommodation in constrained design space and the simultaneous cooling of multi heating sources feasible. To significantly improve the thermal performance of a liquid cooling system, heat exchangers with more liquid-side heat transfer area with acceptable flow pressure drop are expected. This paper focuses on the performance of seven designs of source heat exchanger (cold plate). The presented cold plates are all made in pure copper material using wire cutting, soldering, brazing, or sintering process. Enhanced heat transfer surfaces such as micro channel and cooper mesh are investigated. Detailed experiments have been conducted to understand the performance of these seven cooper cold plates. The same radiators, fan, and water pump were connected with each cooper cold plate to investigate the overall thermal performance of liquid cooling system. Water temperature readings at the inlets and outlets of radiators, pump, and colder plate have been taken to interpret the thermal resistance distribution along the cooling loop.

Enhancement of Central Processing Unit Liquid Cooling Performance Using Hexagonal Boron Nitride Nanofluids

2019 ◽  
Vol 11 (3) ◽  
Author(s):  
Özgür Atik ◽  
Hakan Ertürk
Keyword(s):  
Boron Nitride ◽  
Closed Loop ◽  
Performance Enhancement ◽  
Hexagonal Boron Nitride ◽  
Processing Unit ◽  
Pumping Power ◽  
Liquid Cooling ◽  
Particle Volume ◽  
Cooling Performance ◽  
Central Processing

Cooling performance enhancement of computer liquid cooling (LC) systems using hexagonal boron nitride (hBN)–water nanofluids is investigated experimentally. Particle volume fractions of 0.1–2% are considered at constant flow rates varying from 0.3 to 2 L/min for two different cold plates (CPs), with and without fins. A commercial closed-loop LC system is also tested to examine performance of hBN–water nanofluids at constant pumping power. It was observed that the thermal performance can be improved by using hBN nanofluids, and higher improvements are achieved for systems with limited convection rates.

scholarly journals Design of a prototype of an engine mechanism with rotating cylinders

2020 ◽  
Vol 318 ◽  
pp. 01004
Author(s):  
Miroslav Blatnický ◽  
Ján Dižo
Keyword(s):  
High Speed ◽  
Cooling System ◽  
Ambient Air ◽  
Combustion Engines ◽  
Connecting Rod ◽  
Rotating Cylinders ◽  
Liquid Cooling ◽  
Working Cycle ◽  
Liquid Cooling System ◽  
Crank Mechanism

In this article, authors focus on the design and construction of a real prototype of an engine mechanism with rotating cylinders and its using mainly in piston combustion engines. It is assumed, that the normal force of a piston will be completely eliminated, because the swing angle of a connecting rod will equal to zero during the whole working cycle, since the connecting arm of the piston moves just the cylinder axis. It will by allowed by the conceptual design of the mechanism presented in this article. As rotating blocks of cylinders concurrently act as a flywheel, it is proposed, that in this way there is possible to save the mass of additional flywheels. Moreover, liquid cooling system is not necessary, because the rotating cylinders sufficiently transfer heat to ambient air. In addition, the output of torque will be reached without necessity of gear transmission, which results to decreasing of needs of mechanism lubrication. Other advance of the designed mechanism are two outputs. The first output is low-speed and it goes out from rotating cylinders, i. e. from the slider-crank mechanism with revolutions n1. The other output is high-speed, from the crankshaft with revolutions n2. Because of more favourable properties of the mechanism, authors have decided to create a real device to confirm all mentioned advantages of the mechanism by the suitable way.

scholarly journals The study of gas-liquid flow dynamics in the inclined-corrugated elements of cooling tower filler unit

2019 ◽  
Vol 126 ◽  
pp. 00031 ◽  
Author(s):  
lnur N. Madyshev ◽  
Aliya I. Khafizova ◽  
Oksana S. Dmitrieva
Keyword(s):  
Liquid Flow ◽  
Cooling Tower ◽  
Cooling System ◽  
Flow Dynamics ◽  
Stable Operation ◽  
Liquid Cooling ◽  
Two Phase ◽  
Liquid Drops ◽  
Gas Liquid Flow ◽  
Liquid Cooling System

This paper deals with the studies of cooling tower, operated with the contactless evaporative cooling technology. The authors developed the cooling tower with a three-flow liquid cooling system. The authors conducted the numerical studies of gas-liquid flow dynamics in the inclined-corrugated elements of checker filling unit that allows to give us an idea of two-phase flow structure, its movement throughout the checker filling, as well as to assess the influence of mode parameters on the efficiency of collecting the liquid drops and the range of stable operation of device. The most effective operation of this device is at the pressure drop of 100 Pa, while developing the average air flow rate in the element up to 3.2 m/s.

scholarly journals Creation of two-level liquid cooling system of PC

2017 ◽  
Vol 110 ◽  
pp. 01044
Author(s):  
Sergey V. Koynov ◽  
Egor A. Tarasov
Keyword(s):  
Cooling System ◽  
Liquid Cooling ◽  
Liquid Cooling System
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