Research on the Size Effect of Specific Cutting Energy Based on Numerical Simulation of Single Grit Scratching

2018 ◽  
Vol 140 (7) ◽  
Author(s):  
Tao Zhang ◽  
Feng Jiang ◽  
Lan Yan ◽  
Xipeng Xu
Keyword(s):  
Numerical Simulation ◽  
Size Effect ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Specific Cutting Energy ◽  
Cutting Energy ◽  
Simulation Results ◽  
The Relationship ◽  
Single Grit Scratch

A method of research on the size effect of the specific cutting energy based on the numerical simulation has been proposed. The theoretical model of the research on size effect of specific cutting energy using single grit scratching simulation has been presented. A series of single grit scratch simulations with different scratching depths have been carried out to acquire different material removal rates. Then, the specific cutting energy has been calculated based on the power consumed and the material removal rate. The relationship between the specific cutting energy and the material removal rate has been given which agrees well with that presented by Malkin. The simulation results have been analyzed further to explain the size effect of specific cutting energy.

Wear Characteristics of the Sub-Aperture Tools and Material Removal Rate in Precision Grinding with Loose Abrasives

2007 ◽  
Vol 329 ◽  
pp. 69-74
Author(s):  
H. Cheng ◽  
H.Y. Tam ◽  
Y. Gao ◽  
Yong Bo Wu ◽  
Y. Wang
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
High Efficiency ◽  
Removal Rate ◽  
Process Analysis ◽  
Actual Process ◽  
Correlative Function ◽  
Glass Specimen ◽  
Grinding Tool ◽  
The Relationship

This paper proposes a sub-aperture grinding tool for loose abrasive computer controlled surfacing, which is designed to perform epicyclic motion and rotate around its centre at a rapid rate, whilst the entire mechanism revolves around a secondary centre at a slower rate. In actual process, the wear of the tool could affect the material removal function, and make the process unstable, thus in fact, it is difficult to make a deterministic manufacturing. The focus of the present paper is on wearing characteristics of sub-aperture tools and the wear evenness as the main objectives. To make a further study, material removal function of the tool is firstly established through theoretically modelling, next, a correlative function with weighted factors is built, which is suitable for specifying the wearing degree of the tool. Finally, to discover the relationship between the material removal rate and the tool wearing characteristics, and to optimize the grinding process, analysis and experiments are then carried out on a K9 glass specimen by means of three kinds of tool materials, i.e., polyurethane pad, aluminum plate and pitch based on the proposed technique and model. The results indicated that the required high efficiency and precision could be achieved by choosing proper processes.

The Influence of the Grinding Force to the Material Removal Rate in the Heavy Load Honing

2011 ◽  
Vol 63-64 ◽  
pp. 719-722
Author(s):  
Jian Ye Guo ◽  
Chao Yu ◽  
Guang Qi Cai
Keyword(s):  
Mathematical Model ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Processing Technology ◽  
Heavy Load ◽  
Theoretical Significance ◽  
The Mathematical Model ◽  
The Relationship

This paper took the grinding force in the heavy load honing as the object to research, it mainly analyzed the influence of the grinding force to the material removal rate. First the mathematical model of grinding force was established from starting with the honing pressure. Then the mathematical model of material removal rate was established according to the relationship between material removal volume and honing pressure. Finally the influence of the honing pressure to the material removal rate was analyzed with the aid of software. The results of this paper have important theoretical significance to optimize the processing technology of heavy load honing and further enhance the machining precision and the honing efficiency.

scholarly journals Material Removal Rate of Double-faced Mechanical Polishing of 4H-SiC Substrate

2021 ◽  
Author(s):  
Peng Zhang ◽  
Jingfang Yang ◽  
Huadong Qiu
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Mechanical Polishing ◽  
Ring Gear ◽  
The Third ◽  
Regression Test ◽  
Polishing Pads ◽  
The Relationship

Abstract Silicon carbide (SiC) has been a promising the-third-generation semiconductor power device material for high-power, high-temperature, substrate applications. It aims to improve the material removal rate (MRR), on the premise of ensuring the surface roughness requirements of the double-faced mechanical polishing of 6-inch SiC substrate. To obtain the relationship between any point on SiC substrate and polishing pads, the model about double-faced mechanical polishing has been built and the kinematics equations were created. Best optimized material removal rate parameters were obtained. MRR reached the maximum when speed rate of the outside ring gear to the inside sun gear m=-1, speed rate of lower plate to the inside sun gear n=5, SiC substrate distribution radius RB=75. The primary and secondary order of MRR (n>m>RB) was obtained. An accurate mathematical model of orthogonal rotary regression test of Tri-factor quadratic of MRR was established and the regression model was significant. Surface quality of SiC substrate was observed and characterized with SEM and AFM. It greatly provides a key guarantee for the next process of CMP, confirmed the importance of MRR to ultra-smooth polishing, and provides a guarantee for its application in semiconductor equipment and technology.

Research on CMP Characteristics Attribute to Groove Size

2011 ◽  
Vol 189-193 ◽  
pp. 4112-4115 ◽  
Author(s):  
Yong Chang Guo ◽  
Young Kyun Lee ◽  
Hyun Seop Lee ◽  
Hae Do Jeong
Keyword(s):  
Size Effect ◽  
Friction Force ◽  
Material Removal Rate ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Removal Rate ◽  
Mechanical Polishing ◽  
Experimental Results ◽  
Groove Width ◽  
Significant Difference

Groove pads are used quite widely in chemical mechanical polishing (CMP), and groove size plays an important role in CMP characteristics. This study focuses on the investigation of the groove size effect using X-Y groove pads which are different with pitch and width. The first experiment shows the size effect on the polishing characteristics including material removal rate (MRR), within wafer non-uniformity (WIWNU) on 4 inch oxide blanket wafers for 60 seconds. The second experiment verifies the reason why MRR and WIWNU are different, by the calculation of slurry duration time (SDT) resulting from the change of friction force. All experimental results indicated that a significant difference of slurry flow attributed to groove width and pitch has an impressive influence on friction force, finally the MRR and WIWNU are affected by the groove size.

Wafer size effect on material removal rate in copper CMP process

2017 ◽  
Vol 31 (6) ◽  
pp. 2961-2964 ◽  
Author(s):  
Minjong Yuh ◽  
Soocheon Jang ◽  
Inho Park ◽  
Haedo Jeong
Keyword(s):  
Size Effect ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Wafer Size ◽  
Copper Cmp

scholarly journals Study on the relationship between material removal rate and tool flank temperature in orthogonal turn-milling

2021 ◽  
Vol 15 (4) ◽  
pp. JAMDSM0043-JAMDSM0043
Author(s):  
Koji SHIMANUKI ◽  
Akira HOSOKAWA ◽  
Tomohiro KOYANO ◽  
Tatsuaki FURUMOTO ◽  
Yohei HASHIMOTO
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
The Relationship ◽  
Turn Milling

Study on Cutting Force of Diamond Cutter in Special-Shaped Stone Processing

2011 ◽  
Vol 291-294 ◽  
pp. 804-809 ◽  
Author(s):  
Bo Huang ◽  
Zeng Wen Liu
Keyword(s):  
Cutting Force ◽  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Key Factors ◽  
Peripheral Speed ◽  
Factors Influencing ◽  
Relationship Of ◽  
The Relationship

The cutting force is the key factors influencing the processing precision and efficiency in special-shaped stone production. In this research, the cutting force is measured and analyzed in the process of special shaped cutter cutting stone. It is found that the relationship of cutting force with peripheral speed of cutter is nearly inverse proportional. The cutting force becomes smaller and smaller as the peripheral speed of cutter increases. The relationship of cutting force with feed rate is nearly proportional. The cutting force becomes larger and larger as the feed rate increases. The relationship between Fx, Fy and Fz is Fz > Fx > Fy. Enhancing the peripheral speed of cutter is a better way to increase the material removal rate.

Effects of Process Parameters on Surface Roughness and MRR in the hard turning of EN 36 steel

2018 ◽  
pp. 102-110
Author(s):  
Amritpal Singh ◽  
Rakesh Kumar
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Hard Turning ◽  
Control Parameter ◽  
Removal Rate ◽  
Cutting Speed ◽  
Depth Of Cut ◽  
Cutting Condition ◽  
Dry Cutting

In the present study, Experimental investigation of the effects of various cutting parameters on the response parameters in the hard turning of EN36 steel under the dry cutting condition is done. The input control parameters selected for the present work was the cutting speed, feed and depth of cut. The objective of the present work is to minimize the surface roughness to obtain better surface finish and maximization of material removal rate for better productivity. The design of experiments was done with the help of Taguchi L9 orthogonal array. Analysis of variance (ANOVA) was used to find out the significance of the input parameters on the response parameters. Percentage contribution for each control parameter was calculated using ANOVA with 95 % confidence value. From results, it was observed that feed is the most significant factor for surface roughness and the depth of cut is the most significant control parameter for Material removal rate.

Performance Analysis of Trihexyltetradecylphosphonium Chloride Ionic Fluid under MQL Condition in Hard turning

2020 ◽  
Vol 17 (1) ◽  
pp. 7629-7647
Author(s):  
A. Pandey ◽  
R. Kumar ◽  
A. K. Sahoo ◽  
A. Paul ◽  
A. Panda
Keyword(s):  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Cutting Speed ◽  
Coconut Oil ◽  
Chip Morphology ◽  
Weight Fraction ◽  
Cutting Fluid ◽  
Depth Of Cut

The current research presents an overall performance-based analysis of Trihexyltetradecylphosphonium Chloride [[CH3(CH2)5]P(Cl)(CH2)13CH3] ionic fluid mixed with organic coconut oil (OCO) during turning of hardened D2 steel. The application of cutting fluid on the cutting interface was performed through Minimum Quantity Lubrication (MQL) approach keeping an eye on the detrimental consequences of conventional flood cooling. PVD coated (TiN/TiCN/TiN) cermet tool was employed in the current experimental work. Taguchi’s L9 orthogonal array and TOPSIS are executed to analysis the influences, significance and optimum parameter settings for predefined process parameters. The prime objective of the current work is to analyze the influence of OCO based Trihexyltetradecylphosphonium Chloride ionic fluid on flank wear, surface roughness, material removal rate, and chip morphology. Better quality of finish (Ra = 0.2 to 1.82 µm) was found with 1% weight fraction but it is not sufficient to control the wear growth. Abrasion, chipping, groove wear, and catastrophic tool tip breakage are recognized as foremost tool failure mechanisms. The significance of responses have been studied with the help of probability plots, main effect plots, contour plots, and surface plots and the correlation between the input and output parameters have been analyzed using regression model. Feed rate and depth of cut are equally influenced (48.98%) the surface finish while cutting speed attributed the strongest influence (90.1%). The material removal rate is strongly prejudiced by cutting speed (69.39 %) followed by feed rate (28.94%) whereas chip reduction coefficient is strongly influenced through the depth of cut (63.4%) succeeded by feed (28.8%). TOPSIS significantly optimized the responses with 67.1 % gain in closeness coefficient.

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