Numerical Analysis of Temperature Uniformity of Liquid Cooling Based Battery Module With Incremental Heat Transfer Area

2020 ◽  
Vol 12 (5) ◽  
Author(s):  
Zhiguo Tang ◽  
Qin Gao ◽  
Jie Li ◽  
Jianping Cheng
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Contact Area ◽  
Three Dimensional ◽  
Lithium Ion ◽  
Temperature Uniformity ◽  
Heat Transfer Area ◽  
Liquid Cooling ◽  
Inlet Velocity ◽  
Battery Module

Abstract Battery thermal management (BTM) has an important significance for electronic vehicles to keep them operating in a reasonable temperature range and reduce local temperature differences. In this study, a novel structure of liquid cooling-based lithium-ion battery module with a variable contact area of heat-conductive blocks is proposed. Three-dimensional transient simulations are carried out to investigate the thermal performance of the proposed structure. The effects of block height, height gradient, and inlet velocity are discussed. The results indicate that simply increasing the height of heat-conductive blocks could have a negative effect on cooling performance and that a variable heat transfer area could efficiently improve the temperature uniformity of the battery module. In addition, the thermal performance of the proposed battery module is sensitive to inlet velocity, but the positive effect can be decreased when the velocity is adequately increased. The temperature difference (ΔT) of the battery module with a variable contact area can achieve below 4 °C, and its reduced percentage can be 47.7% compared with that of the module with a consistent contact area when the inlet velocity is 0.2 m/s.

A comparative study between air cooling and liquid cooling thermal management systems for a high-energy lithium-ion battery module

2021 ◽  
Vol 198 ◽  
pp. 117503 ◽  
Author(s):  
Mohsen Akbarzadeh ◽  
Theodoros Kalogiannis ◽  
Joris Jaguemont ◽  
Lu Jin ◽  
Hamidreza Behi ◽  
...  
Keyword(s):  
Comparative Study ◽  
Lithium Ion Battery ◽  
Thermal Management ◽  
Lithium Ion ◽  
High Energy ◽  
Management Systems ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Battery Module

Study on Copper Cold Plate Designs for Electronics Liquid Cooling System

2006 ◽  
Author(s):  
Yi. Feng ◽  
Y. Wang ◽  
C. Y. Huang
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Cooling System ◽  
Pure Copper ◽  
Cold Plate ◽  
Performance Limits ◽  
Liquid Cooling ◽  
Cold Plates ◽  
Management Approaches ◽  
Liquid Cooling System

The increasing power consumption of microelectronic systems and the dense layout of semiconductor components leave very limited design spaces with tight constraints for the thermal solution. Conventional thermal management approaches, such as extrusion, fold-fin, and heat pipe heat sinks, are somehow reaching their performance limits, due to the geometry constraints. Currently, more studies have been carried out on the liquid cooling technologies, as the flexible tubing connection of liquid cooling system makes both the accommodation in constrained design space and the simultaneous cooling of multi heating sources feasible. To significantly improve the thermal performance of a liquid cooling system, heat exchangers with more liquid-side heat transfer area with acceptable flow pressure drop are expected. This paper focuses on the performance of seven designs of source heat exchanger (cold plate). The presented cold plates are all made in pure copper material using wire cutting, soldering, brazing, or sintering process. Enhanced heat transfer surfaces such as micro channel and cooper mesh are investigated. Detailed experiments have been conducted to understand the performance of these seven cooper cold plates. The same radiators, fan, and water pump were connected with each cooper cold plate to investigate the overall thermal performance of liquid cooling system. Water temperature readings at the inlets and outlets of radiators, pump, and colder plate have been taken to interpret the thermal resistance distribution along the cooling loop.

Thermal Performance of a Heat Storage Module Using Calcium Chloride Hexahydrate

1984 ◽  
Vol 106 (1) ◽  
pp. 106-111 ◽  
Author(s):  
D. Dietz
Keyword(s):  
Heat Transfer ◽  
Experimental Data ◽  
Phase Change ◽  
Calcium Chloride ◽  
Thermal Performance ◽  
Heat Storage ◽  
Heat Transfer Area ◽  
Transfer Rates ◽  
Chloride Hexahydrate ◽  
Change Material

The thermal performance of an air-heated/cooled, phase-change, heat stoage module was tested and evaluated. The module (rated at 38.7 kWh) consist of 130 vertically oriented tubes filled with 729 kg (1607 lb) of calcium chloride hexahydrate and enclosed in a rectangular box. Heat transfer rates measured during charging and discharging decreased with time as a result of decreasing effective heat transfer area and increasing thermal resistance of the phase-change material. These two dominant effects are included in a proposed mathematical model that predicted the experimental data.

Thermal Management of Air-Cooling Lithium-Ion Battery Pack

2021 ◽  
Vol 38 (11) ◽  
pp. 118201
Author(s):  
Jianglong Du ◽  
Haolan Tao ◽  
Yuxin Chen ◽  
Xiaodong Yuan ◽  
Cheng Lian ◽  
...  
Keyword(s):  
Lithium Ion Battery ◽  
Thermal Management ◽  
Thermal Performance ◽  
Three Dimensional ◽  
Lithium Ion ◽  
Battery Pack ◽  
Cooling Effect ◽  
Air Cooling ◽  
Safety Issues ◽  
Battery Packs

Lithium-ion battery packs are made by many batteries, and the difficulty in heat transfer can cause many safety issues. It is important to evaluate thermal performance of a battery pack in designing process. Here, a multiscale method combining a pseudo-two-dimensional model of individual battery and three-dimensional computational fluid dynamics is employed to describe heat generation and transfer in a battery pack. The effect of battery arrangement on the thermal performance of battery packs is investigated. We discuss the air-cooling effect of the pack with four battery arrangements which include one square arrangement, one stagger arrangement and two trapezoid arrangements. In addition, the air-cooling strategy is studied by observing temperature distribution of the battery pack. It is found that the square arrangement is the structure with the best air-cooling effect, and the cooling effect is best when the cold air inlet is at the top of the battery pack. We hope that this work can provide theoretical guidance for thermal management of lithium-ion battery packs.

Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber

2019 ◽  
Vol 141 (5) ◽  
Author(s):  
Sangbeom Cho ◽  
Yogendra Joshi
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Printed Circuit Board ◽  
Mechanical Design ◽  
Three Dimensional ◽  
Circuit Board ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Conduction Model ◽  
Printed Circuit

We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through successful completion of the following tasks: patterning copper micropillar wick structures on PCB, mechanical design and fabrication of condenser, device sealing, and device vacuuming and charging with working fluid. Two prototype vapor chambers with distinct micropillar array designs are fabricated, and their thermal performance tested under various heat inputs supplied from a 2 mm × 2 mm heat source. Thermal performance of the device improves with heat inputs, with the maximum performance of ∼20% over copper plated PCB with the same thickness. A three-dimensional computational fluid dynamics/heat transfer (CFD/HT) numerical model of the vapor chamber, coupled with the conduction model of the packaging substrate is developed, and the results are compared with test data.

Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber

2009 ◽  
Author(s):  
Koichi Mashiko ◽  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Yasuhiro Horiuchi ◽  
Thang Nguyen ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Cooling System ◽  
Cold Plate ◽  
Micro Channel ◽  
Vapor Chamber ◽  
Liquid Cooling ◽  
Liquid Cooling System ◽  
Heat Spreading

Recently energy saving is most important concept for all electric products and production. Especially, in Data-Center cooling system, power consumption of current air cooling system is increasing. For not only improving thermal performance but also reducing electric power consumption of this system, liquid cooling system has been developed. This paper reports the development of cold plate technology and vapor chamber application by using micro-channel fin. In case of cold plate application, micro-channel fin technology is good for compact space design, high thermal performance, and easy for design and simulation. Another application is the evaporating surface for vapor chamber. The well-known devices for effective heat transfer or heat spreading with the lowest thermal resistance are heat pipes and vapor chamber, which are two-phase heat transfer devices with excellent heat spreading and heat transfer characteristics. Normally, vapor chamber is composed of sintered power wick. Vapor chamber container is mechanically supported by stamped pedestal or wick column or solid column, but the mechanical strength is not enough strong. So far, the application is limited in the area of low strength assembly. Sometime the mechanical supporting frame is design for preventing deformation. In this paper, the testing result of sample is described that thermal resistance between the heat source and the ambient can be improved approximately 0.1°C/W by using the micro-channel vapor chamber. Additionally, authors presented case designs using vapor chamber for cooling computer processors, and proposed ideas of using micro-channel vapor chamber for heat spreading to replace the traditional metal plate heat spreader.

Thermal Performance of a Borehole Heat Exchanger Located in Guayaquil-Ecuador Using Novel Heat Transfer Fluids

2015 ◽  
Author(s):  
Guillermo Soriano ◽  
Diego Siguenza
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Thermal Performance ◽  
Phase Change Materials ◽  
Three Dimensional ◽  
Borehole Heat Exchanger ◽  
Element Analysis ◽  
Heat Transfer Fluids ◽  
Ground Source ◽  
Microencapsulated Phase Change Materials

An analysis of thermal performance of a vertical Borehole Heat Exchanger (BHE) from a close loop Ground Source Heat Pump (GSHP) located in Guayaquil-Ecuador is presented. The project aims to assess the influence of using novels heat transfer fluids such as nanofluids, slurries with microencapsulated phase change materials and a mixture of both. The BHEs sensitive evaluation is performed by a mathematical model in a finite element analysis by using computational tools; where, the piping array is studied in one dimension scenario meanwhile its surroundings grout and ground volumes are presented as a three dimensional scheme. Therefore, an optimized model design can be achieved which would allow to study the feasibility of GSHP in buildings and industries in Guayaquil-Ecuador.

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