Loop Heat Pipes for Thermal Management of Electric Vehicles

Author(s):  
Randeep Singh ◽  
Tien Nguyen

Abstract This present paper investigates the potential of loop heat pipe (LHP), with respect to technological merits and application niche, in automotive thermal management. Broadly, LHP design and applicability for hot spot cooling in electronics (local dissipation), and for heat transport over longer distances (remote dissipation) has been proposed and discussed in detail. The basic module in these applications includes loop heat pipe with different shapes and sizing factors. Two types of LHP design have being tested and results discussed. The miniature version, with 10 mm thick and flat evaporator, for cooling ECU with 70 W chipset while keeping source temperature below 100 °C limit was evaluated. Two larger versions with cylindrical evaporator, 25 mm diameter & 150 mm length, and heat transfer distances of 250 mm and 1000 mm respectively were tested for power electronics and battery cooling, with more than 500 W transport capabilities in gravity field. In conclusions, loop heat pipes will provide an energy efficient passive thermal control solution for next generation low emission automotive, particularly for electric vehicles which have high level electrifications and more definitive cooling requirements.

1999 ◽  
Author(s):  
J. B. Long ◽  
J. M. Ochterbeck

Abstract Loop heat pipes currently are being used in the thermal control systems for satellites. To expand possible loop heat pipe applications, information regarding response to transient heat inputs is required. In this investigation, two loop heat pipes with dual compensation chambers were subjected to heat inputs of varying magnitude, frequency, and waveform (square and sinusoidal). The performance of each loop heat pipe under these conditions was evaluated in different gravitational orientations. The upper and lower limits of heat transport also were assessed. A principle finding was that cyclic heat loads tended to aid startup of the loop heat pipes at the low power inputs.


Author(s):  
Guangming Xu ◽  
Rongjian Xie ◽  
Nanxi Li ◽  
Cheng Liu

Abstract Two kinds of new refrigerant-R1234ze (E) and R245fa were discussed as substitutes or supplements to traditional working fluids of loop heat pipes based on their favorable thermophysical properties and characteristics such as being safe and environmentally friendly. Thermal characteristics of a loop heat pipe with sintering copper wick at different charging ratios were experimentally investigated under variable heat loads. The results showed that the optimal charging ratio in the loop heat pipe range from 65% to 70%, and at this charging level, the R1234ze(E) system had better start-up response, while the R245fa system presented a stronger heat transfer capacity. The characteristic temperature of R1234ze(E) system was below 35 °C, and the corresponding thermal resistance was 0.08 K/W ~ 1.62 K/W under heat loads ranging from 5 W to 40 W. The thermal resistance of the R245fa system was 0.18 K/W ~ 0.91 K/W under heat loads of 10 W ~ 60 W, and the operating temperature was below 60 °C. The loop heat pipes charged with the proposed new refrigerants exhibit superb performance in room temperature applications, making them beneficial for enhancing the performance of electronics, and could provide a distinctive choice for the cooling of small-sized electronics especially.


Author(s):  
Navdeep S. Dhillon ◽  
Jim C. Cheng ◽  
Albert P. Pisano

Theoretical and numerical thermodynamic analysis of the evaporator section of a planar microscale loop heat pipe is presented, to minimize the permissible wick thickness in such a device. In conventional cylindrical loop heat pipes, a minimum wick thickness is required in order to reduce parasitic heat flow, and prevent vapor leakage, into the compensation chamber. By taking advantage of the possibilities allowed by microfabrication techniques, a planar evaporator/compensation chamber design topology is proposed to overcome this limitation, which will enable wafer-based loop heat pipes with device thicknesses on the order of a millimeter or less. Thermodynamic principles governing two-phase flow of the working fluid in a loop heat pipe are analyzed to elucidate the fundamental requirements that would characterize the startup and steady state operation of a planar phase-change device. A three dimensional finite element thermal-fluid solver is implemented to study the thermal characteristics of the evaporator section and compensation chamber regions of a planar vertically wicking micro-columnated loop heat pipe. The use of in-plane thermal conduction barriers to reduce parasitic heat flow into the compensation chamber is demonstrated.


2013 ◽  
Vol 711 ◽  
pp. 223-228 ◽  
Author(s):  
Shen Chun Wu ◽  
Jhih Huang Gao ◽  
Zih Yan Huang ◽  
Dawn Wang ◽  
Cho Jeng Huang ◽  
...  

This study investigates the effects of increasing the evaporating area of wick in a loop heat pipe (LHP). This work attempts to improve the performance of the loop heat pipe by increasing the number of grooves and thereby the surface area of the wick. The number of grooves is increased from eight to twelve. Experimental results show that increasing the number of grooves not only increases the surface area of the wick but also enhances LHP performance. When the evaporating surface area increases by 50%, which corresponds to increasing the number of grooves from eight to twelve, the heat transfer capacity increases from 310W to 470W and the thermal resistance is reduced from 0.21°C/W to 0.17°C/W. According to preliminary measurements, increasing the number of grooves in the loop heat pipe is highly promising for improving the heat transfer performance.


2014 ◽  
Vol 875-877 ◽  
pp. 356-361 ◽  
Author(s):  
Nandy Putra ◽  
Wayan Nata Septiadi ◽  
Rosari Saleh ◽  
Rardi Artono Koestoer ◽  
Suhendro Purbo Prakoso

The determinants of heat pipe performances are its wick and working fluid, instead of controlled by the material, dimension, and the shape of heat pipe. This study aimed to determine the effect of using nanofluid on the performance of Loop heat pipes (LHP) with CuO-water nanofluid that using biomaterials wick. LHP was made of 8 mm diameter copper pipe, with the diameter of evaporator and the condenser was 20 mm respectively and the length of the heat pipe was 100 mm. The wick was made of biomaterials Collaria Tabulate and the working fluid was CuO-water nanofluids where the CuO nanoparticles were synthesized by sol-gel method. The characteristic of the Tabulate Collaria biomaterial as a wick in LHP was also investigated in this experiment. The results of the experiments showed that the temperature differences between the evaporator and condenser sections with the biomaterial wick and CuO-water nanofluid were less than those using pure water. These results make the biomaterial (Collar) and nanofluids are attractive both as wick and working fluid in LHP technology. Keywords: loop heat pipe, wick, biomaterial, nanofluid.


Author(s):  
Alejandro Torres ◽  
Donatas Mishkinis ◽  
Andrei Kulakov ◽  
Francisco Romera ◽  
Carmen Gregori

Energies ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2453
Author(s):  
Kyaw Zin Htoo ◽  
Phuoc Hien Huynh ◽  
Keishi Kariya ◽  
Akio Miyara

In loop heat pipes (LHPs), wick materials and their structures are important in achieving continuous heat transfer with a favorable distribution of the working fluid. This article introduces the characteristics of loop heat pipes with different wicks: (i) sintered stainless steel and (ii) ceramic. The evaporator has a flat-rectangular assembly under gravity-assisted conditions. Water was used as a working fluid, and the performance of the LHP was analyzed in terms of temperatures at different locations of the LHP and thermal resistance. As to the results, a stable operation can be maintained in the range of 50 to 520 W for the LHP with the stainless-steel wick, matching the desired limited temperature for electronics of 85 °C at the heater surface at 350 W (129.6 kW·m−2). Results using the ceramic wick showed that a heater surface temperature of below 85 °C could be obtained when operating at 54 W (20 kW·m−2).


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