High Power CPU Cooling Experiment

1995 ◽  
Author(s):  
Elizabeth B. Nadworny ◽  
T. Gary Yip ◽  
Nader Farag
Keyword(s):  
Heat Transfer ◽  
High Power ◽  
Power Dissipation ◽  
Heat Removal ◽  
Data Acquisition System ◽  
Heat Sinks ◽  
Small Scale ◽  
Heat Transfer Area ◽  
Pin Fin ◽  
Transfer Parameters

Abstract This experimental study focuses on the enhancement of the heat removal process by modifying the geometry of pin fin heat sinks, while maintaining the same effective heat transfer area. The pins are cut at an angle to reduce the blockage of air flow across the surface. To perform this study, a small scale wind tunnel facility has been designed specifically for testing high power dissipation processors and other ULSI components. The facility is fully automated and controlled by an HP3852A Data Acquisition System interfaced with a 486 based PC computer. The average surface temperature, Reynolds number, Nusselt number and other relevant heat transfer parameters were reduced from the data collected. Results from the study show that a heat sink with an angled trailing edge produces the greatest enhancement of heat removal. The mechanism for the improved heat transfer is the larger temperature gradient across the surface, which is obtained by lowering the minimum temperature on the surface.

Heat Transfer Analysis of Supercritical Methane in Microchannels with Different Geometric Configurations On High Power Electromechanical Actuator

2022 ◽  
Author(s):  
Zhigang Gao ◽  
Tianhu Wang ◽  
Yuxin Yang ◽  
Xiaolong Shang ◽  
Junhua Bai ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Heat Removal ◽  
Electrical Equipment ◽  
Heat Sinks ◽  
Electromechanical Actuator ◽  
Regenerative Cooling ◽  
Geometric Configurations

Abstract The issue of regenerative cooling is one of the most important key technologies of flight vehicles, which is applied into both the engine and high-power electrical equipment. One pattern of regenerative cooling channels is the microchannel heat sinks, which are thought as a prospective means of improving heat removal capacities on electrical equipment of smaller sizes. In this paper, three numerical models with different geometric configurations, namely straight, zigzag, and sinusoid respectively, are built to probe into the thermal hydraulic performance while heat transfer mechanism of supercritical methane in microchannel heat sinks for the heat removal of high-power electromechanical actuator is also explored. In addition, some crucial influence factors on heat transfer such as inlet Reynolds number, operating pressure and heating power are investigated. The calculation results imply the positive effect of wavy configurations on heat transfer and confirm the important effect of buoyancy force of supercritical methane in channels. The heat sinks with wavy channel show obvious advantages on comprehensive thermal performance including overall thermal performance parameter ? and thermal resistance R compared with that of the straight one. The highest Nu and average heat transfer coefficient am appear in the heat sink with zigzag channels, but the pumping power of the heat sink with sinusoidal channels is lower due to the smaller flow loss.

Fluid Flow and Heat Transfer of Liquid Sodium in Small-Scale Heat Sinks With Different Geometries

2021 ◽  
Author(s):  
Mahyar Pourghasemi ◽  
Nima Fathi
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Cross Sections ◽  
Heat Sink ◽  
Volume Ratio ◽  
Heat Sinks ◽  
Liquid Sodium ◽  
Small Scale ◽  
Nusselt Numbers ◽  
The Difference

Abstract 3-D numerical simulations are performed to investigate liquid sodium (Na) flow and the heat transfer within miniature heat sinks with different geometries and hydraulic diameters of less than 5 mm. Two different straight small-scale heat sinks with rectangular and triangular cross-sections are studied in the laminar flow with the Reynolds number up to 1900. The local and average Nusselt numbers are obtained and compared against eachother. At the same surface area to volume ratio, rectangular minichannel heat sink leads to almost 280% higher convective heat transfer rate in comparison with triangular heat sink. It is observed that the difference between thermal efficiencies of rectangular and triangular minichannel heat sinks was independent of flow Reynolds number.

Pin-Fin Heat Sink With Horizontal Base and Blocked Edges

2008 ◽  
Author(s):  
D. Sahray ◽  
H. Shmueli ◽  
N. Segal ◽  
G. Ziskind ◽  
R. Letan
Keyword(s):  
Heat Transfer ◽  
Free Convection ◽  
Contact Resistance ◽  
Cross Section ◽  
Heat Input ◽  
Heat Sink ◽  
Numerical Study ◽  
Heat Sinks ◽  
Transfer Enhancement ◽  
Pin Fin

In the present work, horizontal-base pin fin heat sinks exposed to free convection in air are studied. They are made of aluminum, and there is no contact resistance between the base and the fins. For the same base dimensions the fin height and pitch vary. The fins have a constant square cross-section. The edges of the sink are blocked: the surrounding insulation is flush with the fin tips. The effect of fin height and pitch on the performance of the sink is studied experimentally and numerically. In the experiments, the heat sinks are heated using foil electrical heaters. The heat input is set, and temperatures of the base and fins are measured. In the corresponding numerical study, the sinks and their environment are modeled using the Fluent 6 software. The results show that heat transfer enhancement due to the fins is not monotonic. The differences between sparsely and densely populated sinks are analyzed for various fin heights. Also assessed are effects of the blocked edges as compared to the previously studied cases where the sink edges were exposed to the surroundings.

Submerged Jet Impingement Cooling of a Nanostructured Plate

2010 ◽  
Author(s):  
Muhsincan Sesen ◽  
Ali Kosar ◽  
Ebru Demir ◽  
Evrim Kurtoglu ◽  
Nazli Kaplan ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Silicon Wafer ◽  
Heat Removal ◽  
Jet Impingement ◽  
Wafer Surface ◽  
Small Scale ◽  
Copper Thin Film ◽  
Thin Film Layer

In this paper, the results of a series of heat transfer experiments conducted on a compact electronics cooling device based on single phase jet impingement techniques are reported. Deionized-water is propelled into four microchannels of inner diameter 685 μm which are used as nozzles and located at a nozzle to surface distance of 2.5mm. The generated jet impingement is targeted through these channels towards the surface of a nanostructured plate. This plate of size 20mmx20mm consisted of ∼600 nm long copper nanorod arrays with an average nanorod diameter of ∼150 nm, which were integrated on top of a silicon wafer substrate coated with a copper thin film layer (i.e. Cu-nanorod/Cu-film/Silicon-wafer). Heat removal characteristics induced through jet impingement are investigated using the nanostructured plate and compared to results obtained from a flat plate of copper thin film coated on silicon wafer surface. Enhancement in heat transfer up to 15% using the nanostructured plate has been reported in this paper. Heat generated by small scale electronic devices is simulated using a thin film heater placed on an aluminum base. Surface temperatures are recorded by a data acquisition system with the thermocouples integrated on the surface at various locations. Constant heat flux provided by the film heater is delivered to the nanostructured plate placed on top of the base. Volumetric flow rate and heat flux values were varied in order to better characterize the potential enhancement in heat transfer by nanostructured surfaces.

scholarly journals Experimental and Numerical Examinations of Temperature Distributions along SSF Pin Fins Cast through Semisolid Materials Processing

2019 ◽  
Vol 8 (12) ◽  
pp. 500-503
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Stainless Steel ◽  
Heat Sinks ◽  
Materials Processing ◽  
Length Scale ◽  
Pin Fin ◽  
Temperature Distributions ◽  
Pin Fins ◽  
Enhancing Heat Transfer

Heat sinks or fins stand deployed for enhancing heat transfer. That’s why, planned experiments remain fortified for examining the impacts of SSF pin fin on thermal dispersal concerning constant thermal value 6 W/cm2 . For that five chromel-alumel thermocouples are preferred, above and beyond, SSF pin fins materials of stainless steel and aluminum. As anticipated, for both the stated SSF pin fins, temperature declines for increasing length scale. Besides, both results are comparable with each other. However, temperature distributions over SSF aluminum pin fin declines relatively at faster rate comparable to that over SSF stainless steel pin fin. Obviously, it may be owing to higher thermal conductivity of SSF aluminum pin fin. Therefore, it carries superior, pleasant and momentous thermal performances.

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