Submerged Jet Impingement Cooling of a Nanostructured Plate

2010 ◽  
Author(s):  
Muhsincan Sesen ◽  
Ali Kosar ◽  
Ebru Demir ◽  
Evrim Kurtoglu ◽  
Nazli Kaplan ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Silicon Wafer ◽  
Heat Removal ◽  
Jet Impingement ◽  
Wafer Surface ◽  
Small Scale ◽  
Copper Thin Film ◽  
Thin Film Layer

In this paper, the results of a series of heat transfer experiments conducted on a compact electronics cooling device based on single phase jet impingement techniques are reported. Deionized-water is propelled into four microchannels of inner diameter 685 μm which are used as nozzles and located at a nozzle to surface distance of 2.5mm. The generated jet impingement is targeted through these channels towards the surface of a nanostructured plate. This plate of size 20mmx20mm consisted of ∼600 nm long copper nanorod arrays with an average nanorod diameter of ∼150 nm, which were integrated on top of a silicon wafer substrate coated with a copper thin film layer (i.e. Cu-nanorod/Cu-film/Silicon-wafer). Heat removal characteristics induced through jet impingement are investigated using the nanostructured plate and compared to results obtained from a flat plate of copper thin film coated on silicon wafer surface. Enhancement in heat transfer up to 15% using the nanostructured plate has been reported in this paper. Heat generated by small scale electronic devices is simulated using a thin film heater placed on an aluminum base. Surface temperatures are recorded by a data acquisition system with the thermocouples integrated on the surface at various locations. Constant heat flux provided by the film heater is delivered to the nanostructured plate placed on top of the base. Volumetric flow rate and heat flux values were varied in order to better characterize the potential enhancement in heat transfer by nanostructured surfaces.

Effect of Pressure on Boiling Heat Transfer Mechanism by Using MEMS Technology

2014 ◽  
Author(s):  
Kei Oda ◽  
Hiroyasu Ohtake ◽  
Koji Hasegawa
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Silicon Wafer ◽  
Boiling Heat Transfer ◽  
Experimental Results ◽  
Heat Transfer Mechanism ◽  
Copper Thin Film ◽  
Effect Of Pressure ◽  
System Pressure ◽  
Mems Technology

Since boiling heat transfer has a high heat transfer coefficient, it has been used as a cooling technique for high-temperature bodies and it has been investigated for more than 70 years [1]. However, it has not yet been fully clarified: because the boiling phenomena are affected by many factors, such as the coalescence of bubbles, the fluid convection, the heat conduction and the physics on the contact of the gas, the liquid and the solid phase, boiling phenomena are considerably complicated. The present paper investigated an effect of pressure on boiling heat transfer mechanism by using the MEMS technology. And, boiling heat transfer enhancement in water under low pressure and low boiling temperature was examined experimentally. Steady state pool boiling experiments were conducted by using a copper thin-film and a silicon wafer for the test heater and pure water at atmospheric condition for the test liquid. The system pressure was 0.010, 0.10 and 0.15 MPa, respectively. The heaters were made of a printed circuit board and a commercial silicon wafer. The width was 7.5 mm, the length was 10 mm. The test sections were arranged for horizontal position facing upward. The test heaters had an artificial cylindrical-cavity of 0.010 or 0.040 mm in diameter; the cavities were fabricated by using the MEMS technology, i.e., wet etching technology and deep RIE. The test heaters were heated by Joule heating of d.c. current from a low-voltage high-current stabilizer. The heating rate of the heater was determined from supplied current and voltage. The temperature of the heater was obtained by referring to the measured electric resistance. The present experimental results showed the boiling bubble grew up to about 20 mm in diameter then the bubble released without coalesce of bubble under low pressure condition. Thus, the bubble coalesce was slight. From the experimental results, the gradient of boiling curve by using the copper thin-film was about 3: the heat transfer characteristic was dominant to nucleate boiling. On the other hand, the gradient of boiling curve by using the Silicon wafer (Non-cavity) was about unity: the heat transfer was dominant to heat convection of single-phase flow. According to the present observation of the boiling bubbles, the boiling heat transfer was dominant to latent heat: the ratio of the phase change and the convection was about 90 % and 10 %, respectively. The heat transfer ratio of the convection increased as the system pressure increased.

Supersonic Two-Phase Impinging Jet Heat Transfer

2012 ◽  
Vol 135 (2) ◽  
Author(s):  
Richard R. Parker ◽  
James F. Klausner ◽  
Renwei Mei
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Heat Removal ◽  
Jet Impingement ◽  
Impinging Jet ◽  
High Heat Flux ◽  
Two Phase ◽  
Air Jet

The experimental heat transfer rates from a supersonic two-phase impinging air jet with disperse droplets are presented. The experimental configuration consists of an expanding disperse mixture of air and water through a converging–diverging nozzle, designed for Mach 3.26 with a liquid to air mass flow ratio ranging from 1.28% to 3.83%, impinging upon a thin film heater constructed of nichrome. The spatially varying heat transfer coefficient is measured, and peak values are on the order of 200,000 W/m2K. Two distinct regions of heat transfer are identified, one dominated by the jet impingement flow and another dominated by thin film heat transfer. The heat transfer coefficient of an impinging jet with dry air and no droplets is measured during the investigation as well. The heat transfer results are compared, and it is demonstrated that the addition of disperse water droplets to the jet significantly increases the heat removal capability of the jet as well as smoothing the spatial temperature distribution of the heater surface. As much as an order of magnitude increase in heat transfer coefficient is observed near the centerline of the jet and a factor of 3–5 increase is seen at a distance of approximately 4 nozzle diameters from the jet. The fundamental heat transfer coefficient measurements should benefit applications involving supersonic two-phase jets for high heat flux thermal management.

Supersonic Two Phase Impinging Jet Heat Transfer

2010 ◽  
Author(s):  
Richard R. Parker ◽  
James F. Klausner ◽  
Renwei Mei
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Heat Removal ◽  
Jet Impingement ◽  
Impinging Jet ◽  
High Heat Flux ◽  
Two Phase ◽  
Air Jet

The experimental heat transfer rates from a supersonic two-phase impinging air jet with disperse droplets is presented. The experimental configuration consists of an expanding disperse mixture of air and water through a converging-diverging nozzle, designed for Mach 3.26 with a liquid to air mass flow ratio ranging from 1.28 to 3.83%, impinging upon a thin film heater constructed of nichrome. The spatially varying heat transfer coefficient was measured, and peak values are on the order of 200,000 W/m2 − K. Two distinct regions of heat transfer are identified, one dominated by the jet impingement flow and another dominated by thin film heat transfer. The heat transfer coefficient of an impinging jet with dry air and no droplets was measured during the investigation as well. The heat transfer results are compared, and it is demonstrated that the addition of disperse water droplets to the jet significantly increases the heat removal capability of the jet as well as smoothing the spatial temperature distribution of the heater surface. As much as a ten fold increase in heat transfer rate is observed. These results demonstrate the usefulness of supersonic two-phase jets for high heat flux thermal management applications.

A Compact Nanostructure Enhanced Heat Sink With Flow in a Rectangular Channel

2010 ◽  
Author(s):  
Muhsincan Sesen ◽  
Berkay Arda Kosar ◽  
Ali Kosar ◽  
Wisam Khudhayer ◽  
Berk Ahmet Ahishalioglu ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Constant Pressure ◽  
Rectangular Channel ◽  
Constant Heat Flux ◽  
Nanorod Arrays ◽  
Constant Heat ◽  
Copper Thin Film

This paper reports a compact nanostructure based heat sink. The system has an inlet and an outlet valve similar to a conventional heat sink. From the inlet valve, pressurized deionized-water is propelled into a rectangular channel (of dimensions 24mm×59mm×8mm). This rectangular channel houses a nanostructured plate, on which ∼600 nm long copper nanorod arrays with an average nanorod diameter of 150 nm are integrated to copper thin film coated on silicon wafer surface. Forced convective heat transfer characteristics of the nanostructured plate are investigated using the experimental setup and compared to the results from a flat plate of copper thin film deposited on silicon substrate. Nanorod arrays act as fins over the plate which enhances the heat transfer from the plate. Excess heat generating small devices are mimicked through a small heat generator placed below the nanostructured plate. Constant heat flux is provided through the heat generator. Thermocouples placed on the heater surface are utilized to gather the surface temperature data. Constant pressure drop across the heat sink and constant heat flux values are varied in order to obtain the correlation between heat removal rate and input power. Volumetric flow rate was measured as a function of the constant pressure drop. In this study, it was proved that nanostructured surfaces have the potential to be a useful in cooling of small and excessive heat generating devices such as MEMS (Micro Electro Mechanical Systems) and microprocessors.

Heat Transfer Characteristics of Downward Facing Hot Horizontal Surfaces Using Mist Jet Impingement

2017 ◽  
Author(s):  
Ashutosh Kumar Yadav ◽  
Parantak Sharma ◽  
Avadhesh Kumar Sharma ◽  
Mayank Modak ◽  
Vishal Nirgude ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Surface Heat Flux ◽  
Cooling System ◽  
Water Pressure ◽  
Jet Impingement ◽  
Surface Heat ◽  
Heat Transfer Characteristics ◽  
Impingement Cooling ◽  
Transfer Characteristics

Impinging jet cooling technique has been widely used extensively in various industrial processes, namely, cooling and drying of films and papers, processing of metals and glasses, cooling of gas turbine blades and most recently cooling of various components of electronic devices. Due to high heat removal rate the jet impingement cooling of the hot surfaces is being used in nuclear industries. During the loss of coolant accidents (LOCA) in nuclear power plant, an emergency core cooling system (ECCS) cool the cluster of clad tubes using consisting of fuel rods. Controlled cooling, as an important procedure of thermal-mechanical control processing technology, is helpful to improve the microstructure and mechanical properties of steel. In industries for heat transfer efficiency and homogeneous cooling performance which usually requires a jet impingement with improved heat transfer capacity and controllability. It provides better cooling in comparison to air. Rapid quenching by water jet, sometimes, may lead to formation of cracks and poor ductility to the quenched surface. Spray and mist jet impingement offers an alternative method to uncontrolled rapid cooling, particularly in steel and electronics industries. Mist jet impingement cooling of downward facing hot surface has not been extensively studied in the literature. The present experimental study analyzes the heat transfer characteristics a 0.15mm thick hot horizontal stainless steel (SS-304) foil using Internal mixing full cone (spray angle 20 deg) mist nozzle from the bottom side. Experiments have been performed for the varied range of water pressure (0.7–4.0 bar) and air pressure (0.4–5.8 bar). The effect of water and air inlet pressures, on the surface heat flux has been examined in this study. The maximum surface heat flux is achieved at stagnation point and is not affected by the change in nozzle to plate distance, Air and Water flow rates.

scholarly journals Capillary-Limited Evaporation From Well-Defined Microstructured Surfaces

2013 ◽  
Author(s):  
Solomon Adera ◽  
Rishi Raj ◽  
Evelyn N. Wang
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Thermal Management ◽  
Latent Heat ◽  
Thin Film Evaporation ◽  
Film Evaporation ◽  
Microstructured Surfaces ◽  
Latent Heat Of Vaporization

Thermal management is increasingly becoming a bottleneck for a variety of high power density applications such as integrated circuits, solar cells, microprocessors, and energy conversion devices. The performance and reliability of these devices are usually limited by the rate at which heat can be removed from the device footprint, which averages well above 100 W/cm2 (locally this heat flux can exceed 1000 W/cm2). State-of-the-art air cooling strategies which utilize the sensible heat are insufficient at these large heat fluxes. As a result, novel thermal management solutions such as via thin-film evaporation that utilize the latent heat of vaporization of a fluid are needed. The high latent heat of vaporization associated with typical liquid-vapor phase change phenomena allows significant heat transfer with small temperature rise. In this work, we demonstrate a promising thermal management approach where square arrays of cylindrical micropillar arrays are used for thin-film evaporation. The microstructures control the liquid film thickness and the associated thermal resistance in addition to maintaining a continuous liquid supply via the capillary pumping mechanism. When the capillary-induced liquid supply mechanism cannot deliver sufficient liquid for phase change heat transfer, the critical heat flux is reached and dryout occurs. This capillary limitation on thin-film evaporation was experimentally investigated by fabricating well-defined silicon micropillar arrays using standard contact photolithography and deep reactive ion etching. A thin film resistive heater and thermal sensors were integrated on the back side of the test sample using e-beam evaporation and acetone lift-off. The experiments were carried out in a controlled environmental chamber maintained at the water saturation pressure of ≈3.5 kPa and ≈25 °C. We demonstrated significantly higher heat dissipation capability in excess of 100 W/cm2. These preliminary results suggest the potential of thin-film evaporation from microstructured surfaces for advanced thermal management applications.

Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement

1996 ◽  
Vol 118 (1) ◽  
pp. 21-26 ◽  
Author(s):  
David Copeland
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Critical Heat Flux ◽  
Single Phase ◽  
Jet Impingement ◽  
Transfer Coefficients ◽  
Pin Fin ◽  
Heat Transfer Coefficients ◽  
Aspect Ratios ◽  
Pin Fin Arrays

Experimental measurements of multiple nozzle submerged jet array impingement single-phase and boiling heat transfer were made using FC-72 and 1 cm square copper pin fin arrays, having equal width and spacing of 0.1 and 0.2 mm, with aspect ratios from 1 to 5. Arrays of 25 and 100 nozzles were used, with diameters of 0.25 to 1.0 mm providing nozzle area from 5 to 20 mm2 (5 to 20% of the heat source base area). Flow rates of 2.5 to 10 cm3/s (0.15 to 0.6 l/min) were studied, with nozzle velocities from 0.125 to 2 m/s. Single nozzles and smooth surfaces were also evaluated for comparison. Single-phase heat transfer coefficients (based on planform area) from 2.4 to 49.3 kW/m2 K were measured, while critical heat flux varied from 45 to 395 W/cm2. Correlations of the single-phase heat transfer coefficient and critical heat flux as functions of pin fin dimensions, number of nozzles, nozzle area and liquid flow rate are provided.

scholarly journals Thermal analysis in thin-film fluid regions of rectangular microgroove

2018 ◽  
Vol 22 (2) ◽  
pp. 899-897
Author(s):  
Xiaohong Gui ◽  
Xiange Song ◽  
Baisheng Nie
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Contact Angle ◽  
Film Thickness ◽  
Flux Distribution ◽  
Total Heat ◽  
Heat Flux Distribution ◽  
Total Heat Transfer ◽  
Thin Film Thickness

The effects of contact angle and superheat on thin-film thickness and heat flux distribution occurring in a rectangle microgroove are numerically simulated. Accordingly, physical, and mathematical models are built in detail. Numerical results indicate that meniscus radius and thin-film thickness increase with the improvement of contact angle. The heat flux distribution in the thin-film region increases non-linearly as the contact angle decreases. The total heat transfer through the thin-film region increases with the improvement of superheat, and decreases as the contact angle increases. When the contact angle is equal to zero, the heat transfer in the thin-film region accounts for more than 80% of the total heat transfer. Intensive evaporation in the thin-film region plays a key role in heat transfer for the rectangle capillary microgroove. The liquid with higher wetting performance is more capable of playing the advantages of higher intensity heat transfer in thin- film region. The current investigation will result in a better understanding of thin- -film evaporation and its effect on the effective thermal conductivity in the rectangle microgroove.

Microstructured Surfaces for Enhanced Pool Boiling Heat Transfer

2011 ◽  
Author(s):  
Kuang-Han Chu ◽  
Ryan Enright ◽  
Evelyn N. Wang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boiling Heat Transfer ◽  
Pool Boiling ◽  
Heat Removal ◽  
Design Guidelines ◽  
Complete Wetting ◽  
Structured Surfaces ◽  
Microstructured Surfaces ◽  
Wide Range

We experimentally investigated pool boiling on microstructured surfaces which demonstrate high critical heat flux (CHF) by enhancing wettability. The microstructures were designed to provide a wide range of well-defined surface roughness to study roughness-augmented wettability on CHF. A maximum CHF of 196 W/cm2 and heat transfer coefficient (h) greater than 80 kW/m2K were achieved. To explain the experimental results, a model extended from a correlation developed by Kandlikar was developed, which well predicts CHF in the complete wetting regime where the apparent liquid contact angle is zero. The model offers a first step towards understanding complex pool boiling processes and developing models to accurately predict CHF on structured surfaces. The insights gained from this work provide design guidelines for new surface technologies with higher heat removal capability that can be effectively used by industry.

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