Pool Boiling of FC-87 Over Microchannel Surfaces at Atmospheric Pressure
Advances in technology and trends towards higher processing speeds have generated a greater need for thermal management. Two-phase cooling (boiling) has the ability to dissipate large amounts of heat and is attractive because of lower mass flow requirement and uniform substrate temperature. Further improvements can be obtained through passive surface enhancements. The objective of this work is to investigate the effect of microchannel surfaces on pool boiling performance at atmospheric pressure with FC-87. Being a dielectric fluid with a low normal boiling point, FC-87 has desirable characteristics for an electronics cooling fluid. A maximum heat flux of 550 kW/m2 at a wall superheat of 37°C was obtained with the microchannel surface. Surface area increase is noted as the primary reason for the enhanced performance for FC-87 on microchannel surfaces.