Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments

2005 ◽  
Author(s):  
Pradeep Lall ◽  
Nokibul Islam ◽  
Prakriti Choudhary ◽  
Jeff Suhling
Keyword(s):  
Residual Life ◽  
Prognostic Indicators ◽  
Leading Indicators ◽  
Damage State ◽  
Solder Interconnects ◽  
Damage Progression ◽  
Plastic Ball ◽  
Phase Size ◽  
Electronic Assemblies

In this paper, a methodology for prognostication-of-electronics has been developed for accurate assessment of residual life in a deployed electronic components, and determination of damage-state in absence of macro-indicators of failure. Proxies for leading indicators-of-failure have been identified and correlated with damage progression under thermomechanical loads. Examples of proxies include — microstructural evolution characterized by average phase size and intermetallic growth rate in solder interconnects. Validity of damage proxies has been investigated for both 63Sn37Pb leaded and SnAgCu leadfree electronics. Structures examined include — plastic ball grid array format electronic and MEMS Packages and discrete devices assembled with FR4-06 laminates. Focus of the research presented in this paper is on interrogation of the aged material’s damage state and enhancing the understanding of damage progression. The research is aimed at development of damage relationships for determination of residual life of aged electronics and assessment of design margins instead of life prediction of new components. The prognostic indicators presented in this paper, can be used for health monitoring of electronic assemblies.

Methodologies for Prognostication and Health Monitoring of Leaded and Lead Free Electronics and MEMS Packages in Harsh Environments

2005 ◽  
Author(s):  
Pradeep Lall ◽  
Nokibul Islam ◽  
Prakriti Choudhary ◽  
Jeff Suhling
Keyword(s):  
Health Monitoring ◽  
Residual Life ◽  
Structural Evolution ◽  
Prognostic Indicators ◽  
Damage State ◽  
Solder Interconnects ◽  
Damage Progression ◽  
Plastic Ball ◽  
Phase Size

In this paper, a methodology for prognostication-of-electronics has been developed for accurate assessment of residual life in a deployed electronic components, and determination of damage-state in absence of macro-indicators of failure. Proxies for leading indicators-of-failure have been identified and correlated with damage progression under thermo-mechanical loads. Examples of proxies include — micro-structural evolution characterized by average phase size and intermetallic growth rate in solder interconnects. Validity of damage proxies has been investigated for both 63Sn37Pb leaded and SnAgCu leadfree electronics. Structures examined include — plastic ball grid array format electronic and MEMS Packages and discrete devices assembled with FR4-06 laminates. Focus of the research presented in this paper is on interrogation of the aged material’s damage state and enhancing the understanding of damage progression. The research is aimed at development of damage relationships for determination of residual life of aged electronics and assessment of design margins instead of life prediction of new components. The prognostic indicators presented in this paper, can be used for health monitoring of electronic assemblies.

Leading Indicators of Damage for Prognostication of Leadfree Electronics Subjected to Multiple Thermo-Mechanical Environments

2009 ◽  
Author(s):  
Pradeep Lall ◽  
Rahul Vaidya ◽  
Vikrant More ◽  
Jeff Suhling ◽  
Kai Goebel
Keyword(s):  
Residual Life ◽  
Thermal Environment ◽  
High Reliability ◽  
Damage State ◽  
Core System ◽  
Thermal Environments ◽  
Marquardt Algorithm ◽  
Tools And Techniques ◽  
Deployed Systems ◽  
Electronic Assemblies

Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantification of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system functionality. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. The presented PHM framework is targeted towards high reliability applications such as avionic and space systems. In this paper, Sn3.0Ag0.5Cu alloy packages have been subjected to multiple thermal cycling environments including −55 to 125C and 0 to 100C. Assemblies investigated include area-array packages soldered on FR4 printed circuit cards. The methodology involves the use of condition monitoring devices, for gathering data on damage pre-cursors at periodic intervals. Damage-state interrogation technique has been developed based on the Levenberg-Marquardt Algorithm in conjunction with the microstructural damage evolution proxies. The presented technique is applicable to electronic assemblies which have been deployed on one thermal environment, then withdrawn from service and targeted for redeployment in a different thermal environment. Test cases have been presented to demonstrate the viability of the technique for assessment of prior damage, operational readiness and residual life for assemblies exposed to multiple thermo-mechanical environments. Prognosticated prior damage and the residual life show good correlation with experimental data, demonstrating the validity of the presented technique for multiple thermo-mechanical environments.

Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments

2009 ◽  
Author(s):  
Pradeep Lall ◽  
Rahul Vaidya ◽  
Vikrant More ◽  
Jeff Suhling ◽  
Kai Goebel
Keyword(s):  
Residual Life ◽  
Thermal Environment ◽  
High Reliability ◽  
Remaining Useful Life ◽  
Damage State ◽  
Core System ◽  
Thermal Environments ◽  
Marquardt Algorithm ◽  
Tools And Techniques ◽  
Electronic Assemblies

Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantification of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system functionality. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. The presented PHM framework is targeted towards high reliability applications such as avionic and space systems. In this paper, Sn3.0Ag0.5Cu alloy packages have been subjected to multiple thermal cycling environments including −55 to 125C and 0 to 100C. Assemblies investigated include area-array packages soldered on FR4 printed circuit cards. The methodology involves the use of condition monitoring devices, for gathering data on damage pre-cursors at periodic intervals. Damage-state interrogation technique has been developed based on the Levenberg-Marquardt Algorithm in conjunction with the microstructural damage evolution proxies. The presented technique is applicable to electronic assemblies which have been deployed on one thermal environment, then withdrawn from service and targeted for redeployment in a different thermal environment. Test cases have been presented to demonstrate the viability of the technique for assessment of prior damage, operational readiness and residual life for assemblies exposed to multiple thermo-mechanical environments. Prognosticated prior damage and the residual life show good correlation with experimental data, demonstrating the validity of the presented technique for multiple thermo-mechanical environments.

Prognosis Methodologies for Health Management of Electronics and MEMS Packaging

2004 ◽  
Author(s):  
Pradeep Lall ◽  
Nokibul Islam ◽  
Kaysar Rahim ◽  
Jeff Suhling
Keyword(s):  
Printed Circuit Board ◽  
Prediction Models ◽  
Health Management ◽  
Residual Life ◽  
Structural Evolution ◽  
Remaining Useful Life ◽  
Circuit Board ◽  
Leading Indicators ◽  
Phase Size ◽  
Material State

The current state-of-art in managing system reliability is geared towards the development of life-prediction models for unaged pristine materials under known loading conditions based on relationships such as the Paris’s Power Law [Paris, et. al 1960, 1961], Coffin-Manson Relationship [Coffin 1954; Tavernelli, et. al. 1959; Smith, et. al. 1964; Manson, et. al. 1964] and the S-N Diagram. There is need for methods and processes which will allow interrogation of complex systems and sub-systems to determine the remaining useful life prior to repair or replacement. This capability of determination of material or system state is called “prognosis”. In this paper, a methodology for prognosis-of-electronics has been demonstrated with data of leading indicators of failure for accurate assessment of product damage significantly prior to appearance of any macro-indicators of damage. Proxies for leading indicators of failure have been developed including – micro-structural evolution characterized by average phase size and interfacial stresses at interface of silicon structures. Structures examined include – electronics package, MEMS Packages and interconnections on a metal backed printed circuit board typical of electronics deployed in harsh environments. Since, an aged material knows its state the research presented in this paper focuses on enhancing the understanding of material damage to facilitate proper interrogation of material state. Mathematical relationship has been developed between phase growth rate and time-to-1-percent failure to enable the computation of damage manifested and a forward estimate of residual life.

Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses

2007 ◽  
Author(s):  
Pradeep Lall ◽  
Madhura Hande ◽  
Chandan Bhat ◽  
Jeff Suhling
Keyword(s):  
Health Monitoring ◽  
Least Squares Method ◽  
Health Management ◽  
Residual Life ◽  
Electronic System ◽  
Prognostic Indicators ◽  
Minimal Risk ◽  
Leading Indicators ◽  
Mechanical Loads ◽  
Marquardt Algorithm

Methodologies for prognostication and health monitoring can significantly impact electronic reliability for applications in which even minimal risk of failure may be unbearable. Presently, health monitoring approaches such as the built-in self-test (BIST) are based on reactive failure diagnostics and unable to determine residual-life or estimate residual-reliability [Allen 2003, Drees 2004, Gao 2002, Rosenthal 1990]. Prognostics health-monitoring (PHM) approach presented in this paper is different from state-of-art diagnostics and resides in the pre-failure-space of the electronic-system, in which no macro-indicators such as cracks or delamination exist. Applications for the presented PHM framework include, consumer applications such as automotive safety systems including front and rear impact protection system, chassis-control systems, x-by-wire systems; and defense applications such as avionics systems, naval electronic warfare systems. The presented PHM methodologies enable the estimation of prior damage in deployed electronics by interrogation of the system state. The presented methodologies will trigger repair or replacement, significantly prior to failure. The approach involves the use of condition monitoring devices which can be interrogated for damage proxies at finite time-intervals. The system’s residual life is computed based on residual-life computation algorithms. Previously, Lall, et. al. [2004, 2005, 2006] have developed several leading indicators of failure. In this paper a mathematical approach has been presented to calculate the prior damage in electronics subjected to cyclic and isothermal thermo-mechanical loads. Electronic components operating in a harsh environment may be subjected to both temperature variations in addition to thermal aging during use-life. Data has been collected for leading indicators of failure for 95.5Sn4Ag0.5Cu first-level interconnects under both single and sequential application of cyclic and isothermal thermo-mechanical loads. Methodology for the determination of prior damage history has been presented using non-linear least-squares method based interrogation techniques. The methodology presented used the Levenberg-Marquardt Algorithm. Test vehicle includes various area-array packaging architectures soldered on Immersion Ag finish, subjected to thermal cycling in the range of −40°C to 125°C and isothermal aging at 125°C.

Condition-Based Assessment of Damage Progression During Mechanical Shock in Electronic Assemblies

2006 ◽  
Author(s):  
Pradeep Lall ◽  
Prakriti Choudhary ◽  
Sameed Gupta ◽  
Jeff Suhling
Keyword(s):  
Pattern Recognition ◽  
Boundary Conditions ◽  
Closed Form ◽  
Damage Index ◽  
Statistical Pattern Recognition ◽  
Leading Indicators ◽  
Damage Progression ◽  
Statistical Pattern ◽  
Damage Monitoring ◽  
Electronic Assemblies

Electronic products may be subjected shock and vibration during shipping, normal usage and accidental drop. High-strain rate transient bending produced by such loads may result in failure of fine-pitch electronics. Current experimental techniques rely on electrical resistance for determination of failure. Significant advantage can be gained by prior knowledge of impending failure for applications where the consequences of system-failure may be catastrophic. This research effort focuses on an alternate approach to damage-quantification in electronic assemblies subjected to shock and vibration, without testing for electrical continuity. The proposed approach can be extended to monitor product-level damage. In this paper, statistical pattern recognition and leading indicators of shock-damage have been used to study the damage initiation and progression in shock and drop of electronic assemblies. Statistical pattern recognition is currently being employed in a variety of engineering and scientific disciplines such as biology, psychology, medicine, marketing, artificial intelligence, computer vision and remote sensing [Jain, et. al. 2000]. The application quantification of shock damage in electronic assemblies is new. Previously, free vibration of rectangular plates has been studied by various researchers [Leissa 1969, Young 1950, Gorman 1982, Gurgoze 1984, Wu 2003] for development of analytical closed-form models. In this paper, closed-form models have been developed for the eigen-frequencies and mode-shapes of electronic assemblies with various boundary conditions and component placement configurations. Model predictions have been validated with experimental data from modal analysis. Pristine configurations have been perturbed to quantify the degradation in confidence values with progression of damage. Sensitivity of leading indicators of shock-damage to subtle changes in boundary conditions, effective flexural rigidity, and transient strain response have been quantified. A damage index for Experimental Damage Monitoring has been developed using the failure indicators. The above damage monitoring approach is not based on electrical continuity and hence can be applied to any electronic assembly structure irrespective of the interconnections. The damage index developed provides parametric damage progression data, thus removing the limitation of current failure testing, where the damage progression can not be monitored. Hence the proposed method does not require the assumption that the failure occurs abruptly after some number of drops and can be extended to product level drops.

Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

2018 ◽  
Author(s):  
Pradeep Lall ◽  
Tony Thomas
Keyword(s):  
Instantaneous Frequency ◽  
Low Frequency ◽  
Principal Component ◽  
Large Data ◽  
Data Sets ◽  
Automotive Electronics ◽  
Damage Progression ◽  
Mode Decomposition ◽  
Electronic Assemblies ◽  
Strain Signal

Electronics in automotive underhood environments is used for a number of safety critical functions. Reliable continued operation of electronic safety systems without catastrophic failure is important for safe operation of the vehicle. There is need for prognostication methods, which can be integrated, with on-board sensors for assessment of accrued damage and impending failure. In this paper, leadfree electronic assemblies consisting of daisy-chained parts have been subjected to high temperature vibration at 5g and 155°C. Spectrogram has been used to identify the emergence of new low frequency components with damage progression in electronic assemblies. Principal component analysis has been used to reduce the dimensionality of large data-sets and identify patterns without the loss of features that signify damage progression and impending failure. Variance of the principal components of the instantaneous frequency has been shown to exhibit an increasing trend during the initial damage progression, attaining a maximum value and decreasing prior to failure. The unique behavior of the instantaneous frequency over the period of vibration can be used as a health-monitoring feature for identifying the impending failures in automotive electronics. Further, damage progression has been studied using Empirical Mode Decomposition (EMD) technique in order to decompose the signals into Independent Mode Functions (IMF). The IMF’s were investigated based on their kurtosis values and a reconstructed strain signal was formulated with all IMF’s greater than a kurtosis value of three. PCA analysis on the reconstructed strain signal gave better patterns that can be used for prognostication of the life of the components.

Examination of State of the Cable Insulation by the Return Voltage

2018 ◽  
Vol 19 (6) ◽  
Author(s):  
Dmitry Semenov ◽  
Anna Sidorova ◽  
Pavel Romanov ◽  
Aleksey Kuvshinov
Keyword(s):  
Residual Life ◽  
Technical Condition ◽  
Actual State ◽  
Power Cables ◽  
Insulation Resistance ◽  
Cable Lines ◽  
P Factor ◽  
Paper Insulation ◽  
New System

Abstract The relevance of the study is conditioned by the need to determine the state and residual life duration of high-voltage cable lines to identify faulty and maintainable cables. The aim of the article is to determine a reliable scientifically grounded criterion for assessment of insulation characteristics of the cables in use and to perform a comparative analysis of the results obtained by the traditional method of diagnosing insulation with the results of a new method of assessment by the return voltage. In this regard, the article deals with the issues related to the testing of cables having oil-impregnated paper insulation, as well as with the issue of switching from planned replacement of cables to assessment of their actual state and period of residual life. The authors propose to use the method of examining the cables by the return voltage using the device for testing electrical insulation “UDEI-1” developed at the department of Electrification and Automation of the Nizhny Novgorod State University of Engineering and Economics. The article presents the results of measuring the return voltage of three cables that operated under different conditions. The cables had different technical state. The analysis of the estimation of the residual life of cables by the return voltage was carried out using such criteria as the PIRV polarization index, the LIRV electrical conductivity index, and the P-factor. The P-factor is the physical criterion demonstrating the aging of paper-oil insulation by the shape of the return voltage curve. It represents such characteristics of insulation aging as moistening. To compare the results of testing the cables by the return voltage with the conventional methods of diagnostics and to determine the actual technical condition of power cables, the authors applied the method of spatiotemporal reflectometry and the method of measuring insulation resistance with the determination of such indicators of state as insulation resistance normalized per one kilometer, absorption coefficient, and polarization index. The results of this article confirm that the return voltage gives a qualitative assessment of the state and degree of aging of cables with impregnated paper insulation. The authors proposed a new system for evaluation of cable condition by weighting coefficients. In this approach, the determination of residual life of cables with impregnated paper insulation is based on the values of the return voltage. Application of the new system gives opportunity to improve reliability of the power lines. Recommendations for the further operation of the studied cables are given. The materials of the article are of practical value for carrying out complex assessment of the technical condition of power cables by the return voltage and can be useful for drawing up a schedule for replacement or repair of cable lines depending on their actual state.

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