Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

2021 ◽  
Author(s):  
Ange-Christian Iradukunda ◽  
David Huitink ◽  
Tarek Gebrael ◽  
Nenad Miljkovic

Abstract Power densification and rising module heat losses cannot be managed by traditional “external-to-case” cooling solutions. This is especially pronounced in high voltage systems, where intervening layers of insulating material between the power devices and cooling solution need to be sufficiently thick to provide adequate voltage isolation. As operating voltages increase, the required thicknesses for these insulating layers become so large that they limit the ability to extract the heat. A direct cooling approach that addresses voltage separation issues represents a unique opportunity to deliver coolant to the hottest regions, while opening up the opportunity for increased scaling of power electronics modules. However technical concerns about long-term performance of coolants and their voltage isolation characteristics coupled with integration challenges impede adoption. Here, the reliability and performance of voltage blocking strategies, namely dielectric fluids and dielectric surface coatings, are examined to advance the feasibility of a direct cooling approach for improved thermal management of high-voltage, high-power module. The breakdown voltage of the dielectric fluid is characterized through relevant temperatures, flow, and electric fields with the ultimate goal of developing design rules for direct integrated cooling schemes. The development and electrical characterization of conformal dielectric surface coatings to provide further protection of the electronics is also undertaken. Results showed the ability for layers of Parylene C to maintain their insulating capacity when subject to E-fields as high as 33.5V/μm.

2020 ◽  
Vol 73 (3) ◽  
pp. 231-250
Author(s):  
A Doak ◽  
T Gao ◽  
J -M Vanden-Broeck ◽  
J J S Kandola

Summary In this article, we consider capillary-gravity waves propagating on the interface of two dielectric fluids under the influence of normal electric fields. The density of the upper fluid is assumed to be much smaller than the lower one. Linear and weakly nonlinear theories are studied. The connection to the results in other limit configurations is discussed. Fully nonlinear computations for travelling wave solutions are achieved via a boundary integral equation method. Periodic waves, solitary waves and generalised solitary waves are presented. The bifurcation of generalised solitary waves is discussed in detail.


2021 ◽  
Vol 9 ◽  
Author(s):  
Wenjie Zhao ◽  
Yuanyuan Jiang ◽  
Jianchao Wu ◽  
Yonghui Huang ◽  
Yan Zhu ◽  
...  

With the rapid development of the world’s aerospace technologies, a high-power and high-reliability space high-voltage power supply is significantly required by new generation of applications, including high-power electric propulsion, space welding, deep space exploration, and space solar power stations. However, it is quite difficult for space power supplies to directly achieve high-voltage output from the bus, because of the harshness of the space environment and the performance limitations of existing aerospace-grade electronic components. This paper proposes a high-voltage power supply module design for space welding applications, which outputs 1 kV and 200 W when the input is 100 V. This paper also improves the efficiency of the high-voltage converter with a phase-shifted full-bridge series resonant circuit, then simulates the optimized power module and the electric field distribution of the high-voltage circuit board.


Author(s):  
Trong Trung Le ◽  
Zarel Valdez-Nava ◽  
Guillaume Belijar ◽  
Sombel Diaham ◽  
Lionel Laudebat ◽  
...  

2021 ◽  
Vol 11 (9) ◽  
pp. 4170
Author(s):  
Jeong Eun Park ◽  
Won Seok Choi ◽  
Donggun Lim

Silicon wafers are crucial for determining the price of solar cell modules. To reduce the manufacturing cost of photovoltaic devices, the thicknesses of wafers are reduced. However, the conventional module manufacturing method using the tabbing process has a disadvantage in that the cell is damaged because of the high temperature and pressure of the soldering process, which is complicated, thus increasing the process cost. Consequently, when the wafer is thinned, the breakage rate increases during the module process, resulting in a lower yield; further, the module performance decreases owing to cracks and thermal stress. To solve this problem, a module manufacturing method is proposed in which cells and wires are bonded through the lamination process. This method minimizes the thermal damage and mechanical stress applied to solar cells during the tabbing process, thereby manufacturing high-power modules. When adopting this method, the front electrode should be customized because it requires busbarless solar cells different from the existing busbar solar cells. Accordingly, the front electrode was designed using various simulation programs such as Griddler 2.5 and MathCAD, and the effect of the diameter and number of wires in contact with the front finger line of the solar cell on the module characteristics was analyzed. Consequently, the efficiency of the module manufactured with 12 wires and a wire diameter of 0.36 mm exhibited the highest efficiency at 20.28%. This is because even if the optical loss increases with the diameter of the wire, the series resistance considerably decreases rather than the loss of the short-circuit current, thereby improving the fill factor. The characteristics of the wire-embedded ethylene vinyl acetate (EVA) sheet module were confirmed to be better than those of the five busbar tabbing modules manufactured by the tabbing process; further, a high-power module that sufficiently compensated for the disadvantages of the tabbing module was manufactured.


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