Thermal Buckling in CWR Tracks: Critical Aspects of Experimental Techniques for Lateral Track Resistance Evaluation

Author(s):  
Giovanni Pio Pucillo

Abstract After the introduction of continuous welded rail, thermal track buckling has been recognized to be one of the unsolved problem caused by this technological railroad improvement. In general, both weak ballast strength in the lateral direction and large alignment defects are the principal causes of such phenomenon. In the UIC 720 Leaflet, which is the reference standard for the realization and maintenance of continuous welded rail tracks, two safety criteria against thermal track buckling are described: one is based on the maximum (ΔTmax) and minimum (ΔTmin) buckling temperatures, the other only on the minimum buckling temperature. In the literature, it is found that a correlation exists between ΔTmax and the maximum (or peak, FP) lateral resistance value of the tie-ballast system, and, analogously, between ΔTmin and the minimum (or limit, FL) lateral resistance. For this reason, railway technicians had to paid special attention in the assessment of FP and FL. Because FP concerns lateral displacements equal to 5÷10 mm, and FL occurs for lateral displacements greater than 80÷100 mm, some researchers have proposed to measure FP with a quasi-non-destructive experimental technique, the Single Tie Push Test (STPT), and, successively, to evaluate FL as a function of FP by empirical formulas, in place of the experimental evaluation of the full lateral resistance curve of the tie-ballast system. Based on these considerations, a concerning issue arises whether it is sufficient, and above all safe, to use the simpler, less destructive, and less expensive STPT technique, which requires that only one tie is detached from the rails, or if it is necessary to perform lateral resistance tests on track panels composed by 4 to 6 ties, as in the case of the Discrete Cut Panel Pull Test (DCPPT). For this purpose, in this paper the experimental results obtained in situ in full scale conditions with the two testing techniques are reported, and the differences obtained by performing tests with one, two, and four ties are analyzed with the aim of ensuring a safe evaluation of the main input parameters required for buckling temperatures calculation. It is found that the limit lateral resistance depends neither on the chosen experimental technique, nor on the compaction level of the ballast bed, whereas the peak lateral resistance appears to be dramatically altered if it is evaluated by mean of the STPT, with serious risks of an unsafe evaluation of the buckling temperatures.

Author(s):  
Jabbar Ali Zakeri ◽  
Milad Alizadeh Galdiani ◽  
Seyed Ali Mosayebi

Lateral movements of the ballasted railway track especially in the continuous welded rail (CWR) occur in sharp curves because of high lateral forces. Several strategies have been proposed to increase the track lateral resistance which most of them related to track curves with small radii. In this paper, track lateral supports as a new method have been utilized and a series of field tests have been conducted by using the Single Tie Push Tests (STPT) and Multi Tie Push Tests (MTPT) and their results are compared with the numerical modeling. The results of numerical modeling and field tests show that the track lateral resistance significantly increases in the railway with lateral supports, so that the lateral displacements of track are as a bilinear form.


Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Ingrid DeWolf ◽  
Ahmad Khaled ◽  
...  

Abstract Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.


2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Marc Thelen ◽  
Nicolas Bochud ◽  
Manuel Brinker ◽  
Claire Prada ◽  
Patrick Huber

AbstractNanoporosity in silicon leads to completely new functionalities of this mainstream semiconductor. A difficult to assess mechanics has however significantly limited its application in fields ranging from nanofluidics and biosensorics to drug delivery, energy storage and photonics. Here, we present a study on laser-excited elastic guided waves detected contactless and non-destructively in dry and liquid-infused single-crystalline porous silicon. These experiments reveal that the self-organised formation of 100 billions of parallel nanopores per square centimetre cross section results in a nearly isotropic elasticity perpendicular to the pore axes and an 80% effective stiffness reduction, altogether leading to significant deviations from the cubic anisotropy observed in bulk silicon. Our thorough assessment of the wafer-scale mechanics of nanoporous silicon provides the base for predictive applications in robust on-chip devices and evidences that recent breakthroughs in laser ultrasonics open up entirely new frontiers for in-situ, non-destructive mechanical characterisation of dry and liquid-functionalised porous materials.


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