Modeling Grain Boundary Damage Evolution in As-Measured 3D Microstructure

Author(s):  
I. Simonovski ◽  
L. Cizelj

In recent years we have seen a development of novel experimental techniques that enable one to non-destructively characterize polycrystalline microstructures. These techniques hold significant advantages over approaches like serial sectioning since the specimen is not destroyed in the characterization process. This is of immense value in advancing our understanding of materials and multiscale computational models. In particular, processes at the small length scales like the initiation and early development of grain boundary damage can now be measured more closely while the resulting simulations can now be directly compared to the experimental data. The task is, however, far from being simple as extremely complex geometry needs to be coupled with advance constitutive models for the bulk grain material and the grain boundaries themselves need to be combined. In this work a model, based on a X-ray diffraction contrast tomography data of a stainless steel wire with a diameter of 0.4 mm is presented. 3D topology and crystallographic orientation of individual grains are directly transferred into a finite element model. Grain boundary damage initialization and early development is then explored for a number of cases, ranging from isotropic elasticity up to crystal plasticity constitutive laws for the bulk grain material. In all cases the grain boundaries are modeled using the cohesive zone approach. Also, the stability of the simulations and measures aimed at improving it are reported upon.

1995 ◽  
Vol 391 ◽  
Author(s):  
M. Hasunuma ◽  
H. Toyoda ◽  
T. Kawanoue ◽  
S. Ito ◽  
H. Kaneko ◽  
...  

AbstractIn order to clarify the relationship between Al line reliability and film microstructure, especially grain boundary structure and crystal texture, we have tested three kinds of highly textured Al lines, namely, single-crystal Al line, quasi-single-crystal Al line and hypertextured Al line, and two kinds of conventional Al lines deposited on TiN/Ti and on SiO2. Consequently, the empirical relation between the electromigration (EM) lifetime of Al line † and the (111) full width at half maximum (FWHM) value ω is described by † ∝ ω-2 [1]. This improvement of Al line reliability results from as following reasons; firstly, homogeneous microstructure and high activation energy of 1.28eV for the single-crystal Al line (ω=0.18°); secondly, sub-grain boundaries which consisted of dislocation arrays found in the quasi-single-crystal Al line (ω=0.26°) has turned out to be no more effective mass transport paths because dislocation lines are perpendicular to the direction of electron wind. Although there exist plural grain boundary diffusion paths in the newly developed hypertextured Al line (ω=0.5°) formed by using an amorphous Ta-Al underlayer {1], the vacancy flux along the line has been suppressed to the same order of magnitude of single crystal line. It has been clarified that the decrease of FWHM value has promoted the formation of sub-grain boundaries and low-angle boundaries with detailed orientation analysis of individual grains in the hypertextured film. The longer EM lifetime for the hypertextured Al line is considered to be due to the small grain boundary diffusivities for these stable grain boundaries, and this diffusivity reduction resulted in the suppression of void/hillock pair in the Al lines. These results have confirmed that controlling texture and/or grain boundary itself is a promising approach to develop reliable Al lines which withstand higher current densities required in future ULSIs.


2004 ◽  
Vol 467-470 ◽  
pp. 801-806 ◽  
Author(s):  
Vera G. Sursaeva

When a bicrystal or polycrystal are subjected to a change in temperature, the individual responses of the two adjoining crystals may differ in a manner, which tends to produce a dilatational mismatch along grain boundaries. If compatibility is to be retained along the interface, an additional set of stresses must then be generated in order to conserve this compatibility. ‘Compatibility stresses’ will also be generated whenever a polycrystal is heated or cooled and the thermal expansion coefficients of the individual grains are different due to thermal expansion anisotropy. In such cases adjacent grains will attempt to change dimensions and develop mismatches by amounts controlled by the parameter Δa*ΔΤ, where Δa is the difference between the thermal expansion coefficients in the appropriate directions, and ΔΤ is the temperature change. These ‘compatibility stresses’ may be relieves if grain boundary motion, triple junction migration and grain growth are possible. These ‘compatibility stresses’ may play important role in the kinetic behavior of the microstructure ranging from influencing the behavior of lattice dislocations near the grain boundaries to promoting grain boundary and triple junction dragging or moving. The motion of the ‘special’ grain boundaries, triple junctions with ‘special’ grain boundaries and twins under the influence of internal mechanical stresses is the main subject of this paper.


2004 ◽  
Vol 467-470 ◽  
pp. 763-770 ◽  
Author(s):  
P.J. Konijnenberg ◽  
Dmitri A. Molodov ◽  
Günter Gottstein

In magnetically anisotropic materials a driving force for grain boundary migration can be induced by an external magnetic ¯eld. It is experimentally shown that annealing of locally deformed Zn single crystals in a suitably directed high magnetic ¯eld results in a growth of new individual grains. Velocities of some solitary moving grain boundaries were measured and their absolute mobilities were estimated at a single temperature. Results are discussed in terms of preferential grain orientation and boundary character.


Author(s):  
M.D. Caul ◽  
V. Randle

Grain boundaries are an active area of research interest due to their effect on material property and structure relationships. In order to discuss material properties with regard to grain boundaries it is necessary to know the boundary type. The optimum technique for performing this task is Electron Backscatter Diflfraction (EBSD) in concert with the Scanning Electron Microscope (SEM). By collecting texture measurements in the form of individual orientations from grains it is possible to obtain misorientation measurements from grain boundaries. These measurements are three of the five degrees of freedom necessary to geometrically describe a grain boundary. The other two can be obtained by a serial sectioning technique.Grain boundaries in austenitic steel specimens, isothermally aged at either 700°C or 800°C, have been evaluated with the aim of relating boundary geometry to Cr2N precipitate formation. Samples were analysed using SEM and EBSD in order to obtain orientation measurements of individual grains to misorientations at grain boundaries and to Cr2N precipitates. These precipitates are detrimental to room temperature properties of high nitrogen stainless steels, so a reduction in their formation at grain boundaries would be advantageous. The steel is therefore an ideal candidate material for relating boundaries to material properties. The 700°C isothermally aged sample induces precipitate formation at grain boundaries whereas precipitation by cellular decomposition of austenite occurs in the 800 CC sample. The 700°C sample was used to categorise boundary types using the CSL model and relate this to Cr2N formation. The 800°C sample was used to examine the effect of aging temperature on boundary inclination. Therefore all five degrees of freedom in grain boundary geometry were obtained.


2020 ◽  
Author(s):  
Fatemeh Rouhani ◽  
Behrooz Fereidoonnezhad ◽  
Mohammad Reza Zakerzadeh ◽  
Mostafa Baghani

Although some inelastic phenomena such as stress softening and permanent deformation likely occur due to the supra-physiological loading of arterial tissue during the stenting procedure, hyperelastic constitutive models have been employed in most of the previously developed computational models. This study presents a finite element model for stent deployment into a patient-specific stenosed artery while inelastic arterial behaviors due to supra-physiological loading of the tissue have been considered.


2021 ◽  
Vol 897 ◽  
pp. 21-28
Author(s):  
Jun Yuan Zheng ◽  
M.W. Fu

The properties of individual grains affect the mechanical behaviors and response of materials in micro-scaled deformation, viz., microforming, and there are unknown phenomena and deformation behaviors existing and limiting the wide application of microforming due to size effect. In this paper, a composite model combining crystal plasticity and grain boundary strengthening theories was developed for numerical investigation into the effect of grain boundaries on the plastic deformation of copper micro-upsetting. By comparing the results with and without grain-boundary structure, it is revealed that grain boundaries, which act as the barriers of crystal slip, result in the enhanced flow stress and the discontinuous distribution of stress and strain. The grain size effect is also considered in this research, and the results show the coarse-grained material reduces the flow stress and enhances the inhomogeneous deformation.


1989 ◽  
Vol 153 ◽  
Author(s):  
G. J. Thomas ◽  
R. W. Siegel ◽  
J. A. Eastman

AbstractUsing high resolution electron microscopy, consolidated nanophase palladium samples were examined following electrolytic thinning after a hydriding - dehydriding cycle at 310 K. Due to the small size and random orientations of the individual grains, a large number of grain boundaries were available for examination. Some of these yielded adequate imaging conditions to allow observation of the lattice structure in the grain boundary regions. Image simulations were performed to determine the sensitivity of the technique to lattice disorder. The results of these studies suggest that grain boundary structures in nanophase palladium are similar to those in conventional coarse-grained polycrystals.


2020 ◽  
Vol 12 (09) ◽  
pp. 2050101
Author(s):  
Fatemeh Rouhani ◽  
Behrooz Fereidoonnezhad ◽  
Mohammad Reza Zakerzadeh ◽  
Mostafa Baghani

Computational models provide a powerful tool for pre-clinical assessment of medical devices and early evaluation of potential risks to the patient in terms of plaque fragmentation and in-stent restenosis (ISR). Using a suitable constitutive model for arterial tissue is key for the development of a reliable computational model. Although some inelastic phenomena such as stress softening and permanent deformation likely occur due to the supra-physiological loading of arterial tissue during the stenting procedure, hyperelastic constitutive models have been employed in most of the previously developed computational models. This study presents a finite element model for stent deployment into a patient-specific stenosed artery while inelastic arterial behaviors due to supra-physiological loading of the tissue have been considered. Specifically, the maximum stress in the plaque and the arterial layers which is the main cause of plaque fracture during stent deployment and the surgically-induced injury (damage) in the arterial wall, as the main cause of ISR, are presented. The results are compared with the commonly-used hyperelastic behavior for arterial layers. Furthermore, the effects of arterial material parameter variation, analogues to different patients, are investigated. A higher amount of damage is predicted for the artery which shows a higher stress in a specific strain.


MRS Bulletin ◽  
1990 ◽  
Vol 15 (10) ◽  
pp. 26-32 ◽  
Author(s):  
C.L. Briant

An interface can be defined as a surface that serves as a common boundary between two phases. Examples include the boundaries between two solids, two immiscible liquids, a solid and a liquid, a solid and a gas, and a liquid and a gas. Interfaces have been studied for decades by scientists of many different disciplines. One reason for this interest is that the atomic structure and the chemical composition at the interface can differ from that of the bulk material on either side of it. Consequently, the properties of the interface can differ greatly from those of either bulk phase, and chemical reactions can occur more readily at the interface than in the bulk.All the interfaces listed in the previous paragraph are of interest to materials scientists. However, this article will only consider the grain boundary because it has received the most attention by researchers in materials science. Furthermore, we will only consider grain boundaries in metals; nonmetallic systems will be covered in other articles in this issue.A grain boundary is an interface that exists where two single crystals are joined in such a way that their crystallographic orientations are not completely matched. Thus, any polycrystalline material contains many grain boundaries. They occur wherever the individual grains meet one another and can usually be observed by etching a polished cross section of the surface as shown in Figure 1. Grain boundaries first form in a metal as a result of the multiple nucleation sites that occur during solidification.


Author(s):  
J. W. Matthews ◽  
W. M. Stobbs

Many high-angle grain boundaries in cubic crystals are thought to be either coincidence boundaries (1) or coincidence boundaries to which grain boundary dislocations have been added (1,2). Calculations of the arrangement of atoms inside coincidence boundaries suggest that the coincidence lattice will usually not be continuous across a coincidence boundary (3). There will usually be a rigid displacement of the lattice on one side of the boundary relative to that on the other. This displacement gives rise to a stacking fault in the coincidence lattice.Recently, Pond (4) and Smith (5) have measured the lattice displacement at coincidence boundaries in aluminum. We have developed (6) an alternative to the measuring technique used by them, and have used it to find two of the three components of the displacement at {112} lateral twin boundaries in gold. This paper describes our method and presents a brief account of the results we have obtained.


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