Effects of insulator surface roughness on Al-alloy film properties and electromigration performance in Al-alloy/Ti insulator layered interconnects

Titanium nitride (TiN) films are used as anti-reflection coatings (ARC) on aluminum (Al) films to facilitate lithography processes during multilevel metallization for the manufacture of integrated circuits on silicon-based (Si) semiconductor devices. It is generally accepted in the literature that the microstructure of multilevel metal stacks is influenced by the texture of the substrate. For the case of interconnect materials used in the semiconductor industry, a typical metal stack is as follows: Titanium/Titanium Nitride/Al-alloy/ARC-Titanium Nitride. The Ti/TiN layer underneath the Al-alloy film is used as a barrier stack to prevent junction spiking. The Ti/TiN underlayer also determines the growth conditions (crystallography and orientation relationships) of the subsequent Al-alloy film.This study focuses on the microstructural characterization of the ARC-TiN layer on Si-oxide and Ti/TiN/Al-alloy substrates that are fabricated under similar conditions using conventional physical vapor deposition (PVD - sputtering) techniques. The ARC-TiN microstructure was investigated by transmission electron microscopy (TEM) using a Philips EM430 operating at 300 kV.

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Strategy of Residual Stress Determination on Selective Laser Melted Al Alloy Using XRD

Materials ◽

10.3390/ma13020451 ◽

2020 ◽

Vol 13 (2) ◽

pp. 451 ◽

Cited By ~ 3

Author(s):

Yujiong Chen ◽

Hua Sun ◽

Zechen Li ◽

Yi Wu ◽

Yakai Xiao ◽

...

Keyword(s):

Residual Stress ◽

Surface Roughness ◽

Residual Stresses ◽

High Surface ◽

Al Alloy ◽

X Ray Diffraction ◽

Scanning Strategy ◽

Surface Distribution ◽

Finished Surface ◽

Microstructural Morphology

Selective laser melting (SLM) is known to generate large and anisotropic residual stresses in the samples. Accurate measurement of residual stresses on SLM-produced samples is essential for understanding the residual stress build-up mechanism during SLM, while a dramatic fluctuation can be observed in the residual stress values reported in the literature. On the basis of studying the influence of surface roughness on residual stress measured using X-ray diffraction (XRD), we propose a procedure coupling XRD technique with pretreatment consisting of mechanical polishing and chemical etching. The results highlight that residual stresses measured using XRD on as-built SLM-produced samples with high surface roughness are significantly lower than those measured on samples with finished surface, which is due to the stress relaxation on the spiked surface of as-built samples. Surface distribution of residual stresses and the effect of scanning strategy were systematically investigated for SLM-produced AlSi10Mg samples. Microstructural morphology was observed at the interface between sample and building platform and was linked to the surface distribution of residual stresses. This procedure can help us accurately measure the residual stresses in SLM-produced samples and thus better understand its build-up mechanism during the SLM process.

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Influence of Deposition and Processing Parameters on the TCR of Ni-Cr-Cu-Al ALloy Film Resistors

IEEE Transactions on Parts Materials and Packaging ◽

10.1109/tpmp.1969.1136070 ◽

1969 ◽

Vol 5 (3) ◽

pp. 139-146 ◽

Cited By ~ 4

Author(s):

W. Isler ◽

L. Kitchman

Keyword(s):

Processing Parameters ◽

Alloy Film ◽

Al Alloy

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Preparation of Thin-Film Capacitor with High Reliability by Anodization of Zr–Al Alloy Film

Japanese Journal of Applied Physics ◽

10.1143/jjap.46.5249 ◽

2007 ◽

Vol 46 (8A) ◽

pp. 5249-5253 ◽

Cited By ~ 3

Author(s):

Naohiro Mikuni ◽

Tomoharu Shibata ◽

Satoko Shinkai ◽

Katsutaka Sasaki ◽

Hideto Yanagisawa ◽

...

Keyword(s):

Thin Film ◽

High Reliability ◽

Alloy Film ◽

Al Alloy ◽

Film Capacitor ◽

Thin Film Capacitor

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Crystal Orientation, Order Degree, and Surface Roughness of FePd-Alloy Film Formed on MgO(001) Substrate

IEEE Transactions on Magnetics ◽

10.1109/tmag.2015.2434883 ◽

2015 ◽

Vol 51 (11) ◽

pp. 1-4 ◽

Cited By ~ 8

Author(s):

Mitsuru Ohtake ◽

Akira Itabashi ◽

Masaaki Futamoto ◽

Fumiyoshi Kirino ◽

Nobuyuki Inaba

Keyword(s):

Surface Roughness ◽

Crystal Orientation ◽

Alloy Film ◽

Orientation Order ◽

Order Degree

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Surface Roughness Models and Their Experimental Validation in Micro Milling of 6061-T6 Al Alloy by Response Surface Methodology

Mathematical Problems in Engineering ◽

10.1155/2015/702186 ◽

2015 ◽

Vol 2015 ◽

pp. 1-9 ◽

Cited By ~ 3

Author(s):

Jie Yi ◽

Li Jiao ◽

Xibin Wang ◽

Junfeng Xiang ◽

Meixia Yuan ◽

...

Keyword(s):

Surface Roughness ◽

Response Surface ◽

Removal Rate ◽

Micro Milling ◽

Al Alloy ◽

Machined Surface ◽

Contour Map ◽

Good Surface ◽

Micro Features ◽

Good Surface Roughness

Due to the widespread use of high-accuracy miniature and micro features or components, it is required to predict the machined surface performance of the micro milling processes. In this paper, a new predictive model of the surface roughness is established by response surface method (RSM) according to the micro milling experiment of 6061-T6 aluminum alloy which is carried out based on the central composite circumscribed (CCC) design. Then the model is used to analyze the effects of parameters on the surface roughness, and it can be concluded that the surface roughness increases with the increasing of the feed rate and the decreasing of the spindle speed. At last, based on the model the contour map of the surface roughness and material removal rate is established for optimizing the process parameters to improve the cutting efficiency with good surface roughness. The prediction results from the model have good agreement with the experimental results.

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