Plasma enhanced chemically vapor deposited thin films for microelectromechanical systems applications with tailored optical, thermal, and mechanical properties

1999 ◽  
Vol 17 (3) ◽  
pp. 1045 ◽  
Author(s):  
M. W. Horn ◽  
R. B. Goodman ◽  
M. Rothschild
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Microelectromechanical Systems ◽  
Thermal And Mechanical Properties ◽  
Chemically Vapor Deposited

Ge-Chalcogenide Glasses – Properties and Application as Optical Material

2013 ◽  
Vol 538 ◽  
pp. 316-319 ◽  
Author(s):  
Tamara Petkova ◽  
Vania Ilcheva ◽  
P. Ilchev ◽  
P. Petkov
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Chalcogenide Glasses ◽  
Optical Storage ◽  
Thermal And Mechanical Properties ◽  
Optical Elements ◽  
Storage Media ◽  
Simple Technology ◽  
Chalcogenide Materials ◽  
The Impact

The great interest toward chalcogenide materials is due to the simple technology of preparation in bulk forms and thin films; good thermal and mechanical properties; transparency and photo-sensibility in the IR spectral range. These advantages determine the possibilities for potential application of these materials like optical storage media, memory devices, optical elements (lenses, waveguides, gratings, etc). The idea of present study is to trace the impact of gallium or indium as metal introduction on the behaviors of the glasses from germanium - chalcogenide system.

Influence of Chain Stiffness on Thermal and Mechanical Properties of Polymer Thin Films

2011 ◽  
Vol 44 (22) ◽  
pp. 9040-9045 ◽  
Author(s):  
Jessica M. Torres ◽  
Chengqing Wang ◽  
E. Bryan Coughlin ◽  
John P. Bishop ◽  
Richard A. Register ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Polymer Thin Films ◽  
Thermal And Mechanical Properties ◽  
Chain Stiffness

Size effect on the mechanical properties of microfabricated polysilicon thin films

2001 ◽  
Vol 16 (8) ◽  
pp. 2223-2228 ◽  
Author(s):  
J. N. Ding ◽  
Y. G. Meng ◽  
S. Z. Wen
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Size Effect ◽  
Surface Area ◽  
Fracture Strength ◽  
Size Effects ◽  
Microelectromechanical Systems ◽  
Governing Parameter ◽  
Average Value ◽  
Microtensile Test

A new microtensile test device using a magnetic-solenoid force actuator was developed to evaluate the mechanical properties of microfabricated polysilicon thin films that were 100–660 mm long, 20–200 μm wide, and 2.4-μm thick. It was found that the measured average value of Young's modulus, 164 GPa ± 1.2 GPa, falls within the theoretical bounds. The average fracture strength is 1.36 GPa with a standard deviation of 0.14 GPa, and the Weibull modulus is 10.4–11.7. Statistical analysis of the specimen size effects on the tensile strength predicated the size effects on the length, the surface area, and the volume of the specimens. The fracture strength increases with an increase of the ratio of surface area to volume. In such cases, the size effect can be corrected to the ratio of the surface area to volume as the governing parameter. The test data accounts for the uncertainties in mechanical properties and may be used to enhance the reliability and design of polysilicon microelectromechanical systems devices.

Thermal and mechanical properties of UV irradiated collagen/chitosan thin films

2006 ◽  
Vol 91 (12) ◽  
pp. 3026-3032 ◽  
Author(s):  
A. Sionkowska ◽  
M. Wisniewski ◽  
J. Skopinska ◽  
G.F. Poggi ◽  
E. Marsano ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Thermal And Mechanical Properties

Hrtem Study of Interface Structure Of Heteroepitaxially Grown GaAs Thin Films on GaAs(l00)

1998 ◽  
Vol 4 (S2) ◽  
pp. 624-625
Author(s):  
Z.R. Dai ◽  
S.R. Chegwidden ◽  
F.S. Ohuchi
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Second Harmonic ◽  
Interface Structure ◽  
Thermal And Mechanical Properties ◽  
Surface And Interface ◽  
Device Structures ◽  
New Generation ◽  
Related Compounds

GaSe, a member of the III-VI compound semiconductors, and its related compounds have recently gained an considerable attention because of their high non-linear optical coefficients in the infrared ranges, making them candidates for second harmonic generation (SHG) materials[l,2]. While the optical properties of those materials in bulk form are quite promising, poor thermal and mechanical properties preclude their easy applications. In thin film devices, the thermal and mechanical properties are dominated by those of the substrate, therefore, heteroepitaxially grown thin films of GaSe and related materials on substrates such as GaAs, Si and A12O3 should enable their application in device structures. Development of such new generation of materials, however, require fundamental knowledge about the surface and interface structure that play decisive roles in the thin film crystallinity and materials properties.

Mechanical Properties of Ultrananocrystalline Diamond Thin Films for MEMS Applications

2002 ◽  
Vol 741 ◽  
Author(s):  
H.D. Espinosa ◽  
B. Peng ◽  
K.-H. Kim ◽  
B.C. Prorok ◽  
N. Moldovan ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Elastic Moduli ◽  
Microelectromechanical Systems ◽  
Nanosized Particles ◽  
Good Reproducibility ◽  
Fracture Properties ◽  
Ultrananocrystalline Diamond ◽  
Mems Fabrication ◽  
Membrane Deflection

ABSTRACTMicrocantilever deflection and the membrane deflection experiment (MDE) were used to examine the elastic and fracture properties of ultrananocrystalline diamond (UNCD) thin films in relation to their application to microelectromechanical systems (MEMS). Freestanding microcantilevers and membranes were fabricated using standard MEMS fabrication techniques adapted to our UNCD film technology. Elastic moduli measured by both methods described above are in agreement, with the values being in the range 930 and 970 GPa with both techniques showing good reproducibility. The MDE test showed fracture strength to vary from 3.95 to 5.03 GPa when seeding was performed with ultrasonic agitation of nanosized particles.

scholarly journals Nanoscale Mapping of Thermal and Mechanical Properties of Bare and Metal-Covered Self-Assembled Block Copolymer Thin Films

2019 ◽  
Vol 2 (2) ◽  
pp. 487-496 ◽  
Author(s):  
Alexandros El Sachat ◽  
Jean Spièce ◽  
Charalambos Evangeli ◽  
Alexander James Robson ◽  
Martin Kreuzer ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Block Copolymer ◽  
Thermal And Mechanical Properties ◽  
Self Assembled

Nanoindentation Measurements on Low-k Porous Silica Thin Films Spin Coated on Silicon Substrates

2003 ◽  
Vol 125 (4) ◽  
pp. 361-367 ◽  
Author(s):  
Xiaoqin Huang ◽  
Assimina A. Pelegri
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Microelectromechanical Systems ◽  
Young's Modulus ◽  
Porous Silica ◽  
Silicon Substrates ◽  
Silica Thin Films ◽  
Low K

MEMS (MicroElectroMechanical Systems) are composed of thin films and composite nanomaterials. Although the mechanical properties of their constituent materials play an important role in controlling their quality, reliability, and lifetime, they are often found to be different from their bulk counterparts. In this paper, low-k porous silica thin films spin coated on silicon substrates are studied. The roughness of spin-on coated porous silica films is analyzed with in-situ imaging and their mechanical properties are determined using nanoindentation. A Berkovich type nanoindenter, of a 142.3 deg total included angle, is used and continuous measurements of force and displacements are acquired. It is shown, that the measured results of hardness and Young’s modulus of these films depend on penetration depth. Furthermore, the film’s mechanical properties are influenced by the properties of the substrate, and the reproduction of the force versus displacement curves depends on the quality of the thin film. The hardness of the studied low-k spin coated silica thin film is measured as 0.35∼0.41 GPa and the Young’s modulus is determined as 2.74∼2.94 GPa.

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