Impact of gate line edge roughness on double-gate FinFET performance variability

Author(s):  
Kedar Patel ◽  
Tsu-Jae King Liu ◽  
Costas Spanos
2009 ◽  
Vol 56 (6) ◽  
pp. 1211-1219 ◽  
Author(s):  
Shimeng Yu ◽  
Yuning Zhao ◽  
Lang Zeng ◽  
Gang Du ◽  
Jinfeng Kang ◽  
...  

2021 ◽  
Author(s):  
Subba Rao Suddapalli ◽  
Bheema Rao Nistala

Abstract In this paper, variability analysis of graded channel dual material (GCDM) double gate (DG) strained-silicon (s-Si) MOSFET with fixed charges is analyzed with the help of Sentaurus TCAD. By varying the different device parameters, the variability analysis of the proposed GCDM-DG s-Si MOSFET is performed with respect to variations in threshold voltage and drain current as the line edge roughness and fluctuations in random dopant, contact resistance, and oxide thickness are considered. The results confirm that the effect of process variations is severe when the device has fixed charges at oxide interface. Moreover, the proposed GCDM-DG s-Si p-MOSFET has less vulnerable to the effects of line edge roughness, fluctuations in oxide thickness and random dopants in comparison with the proposed GCDM-DG s-Si n-MOSFET.


2011 ◽  
Vol 10 (2) ◽  
pp. 244-249 ◽  
Author(s):  
Yunxiang Yang ◽  
Shimeng Yu ◽  
Lang Zeng ◽  
Gang Du ◽  
Jinfeng Kang ◽  
...  

2009 ◽  
Vol 56 (12) ◽  
pp. 3055-3063 ◽  
Author(s):  
Kedar Patel ◽  
Tsu-Jae King Liu ◽  
Costas J. Spanos

2008 ◽  
Vol 47 (4) ◽  
pp. 2501-2505 ◽  
Author(s):  
Atsuko Yamaguchi ◽  
Daisuke Ryuzaki ◽  
Ken-ichi Takeda ◽  
Jiro Yamamoto ◽  
Hiroki Kawada ◽  
...  

Author(s):  
Y. Kurashima ◽  
H. Hiroshima ◽  
M. Komuro ◽  
N. Yamazaki ◽  
J. Taniguchi ◽  
...  

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