On the impact bending test technique for high-strength pipe steels

2015 ◽  
Vol 2015 (10) ◽  
pp. 851-860
Author(s):  
A. M. Arsenkin ◽  
P. D. Odesskii ◽  
I. P. Shabalov ◽  
M. V. Likhachev
Keyword(s):  
High Strength ◽  
Bending Test ◽  
Pipe Steels ◽  
Test Technique ◽  
Impact Bending ◽  
The Impact

scholarly journals The Spread of Corrosion in Cast Iron and its Effect on the Life Cycle of Transportation Vehicles

2017 ◽  
Vol 65 (2) ◽  
pp. 383-389 ◽  
Author(s):  
Tomáš Binar ◽  
Jiří Švarc ◽  
Petr Dostál ◽  
Michal Šustr ◽  
Jan Tippner
Keyword(s):  
Impact Strength ◽  
Fractographic Analysis ◽  
Bending Test ◽  
Material Surface ◽  
Bending Tests ◽  
Corrosion Tests ◽  
Fracture Surfaces ◽  
Impact Bending ◽  
Notch Impact Strength ◽  
The Impact

This article deals with the spread of corrosion in material at different exposure times, and its effect on the measured brittle fracture and notch impact strength under different temperature conditions. To assess the degradational effect of corrosion on the material characteristics represented by the measured impact strength, we conducted a fractographic analysis of fracture surfaces, the aim of which was to evaluate the spread of corrosion in the material. In the first part of the experiment, two corrosion tests are simulated with a duration time of 432 and 648 hours, to compare the degradation effect of corrosion on the notch impact strength, depending on the duration of the corrosion tests. The following part shows the results of the impact bending test, where the experiment was conducted in an area of reduced and increased temperatures. The final part summarizes the results of the fractographic analysis of sample fracture surfaces from the impact bending tests. Based on the measured the length of the corrosion cracks, we analyzed the sample at the notch and from the material surface after the impact bending test.

Impact Resistance of SM Joints Formed With ICA

2002 ◽  
Vol 124 (4) ◽  
pp. 374-378 ◽  
Author(s):  
C. M. Lawrence Wu ◽  
Robert K. Y. Li ◽  
N. H. Yeung
Keyword(s):  
Impact Damage ◽  
Impact Resistance ◽  
High Energy ◽  
Bending Test ◽  
Conductive Adhesives ◽  
Energy Impact ◽  
Split Hopkinson ◽  
Post Impact ◽  
Impact Bending ◽  
The Impact

Isotropic conductive adhesives (ICA) have been considered as replacement materials for lead-tin solder alloys. In this paper, the post-impact shear strength of ICA surface mount (SM) joints was obtained experimentally and compared with that of SM lead-tin joints. The dynamic impact energy was provided in the form of three-point bending on the PCB using equipment called the split Hopkinson bar. Strain rates of over 4000/s were used for the impact bending test. The action of impact bending was used to simulate the effect on the PCB and the interconnection as a result of high energy impact on an electronic equipment. Shear test was then performed to examine the change in strength of the ICA joints as a result of impact damage. It was found that the SM ICA joints failed due to impact at a strain rate just over 4000/s. Microstructural examination carried out using a scanning electron microscope revealed that the interface between the ICA and copper pad on the PCB was the weakest region of the joint.

Impact Toughness Influence on the Bending Properties of Rock Bolt

2014 ◽  
Vol 664 ◽  
pp. 94-97
Author(s):  
Zhong Wei Li
Keyword(s):  
Impact Toughness ◽  
High Strength ◽  
Rock Bolt ◽  
Bending Test ◽  
Absorbed Energy ◽  
Bending Properties ◽  
Energy Value ◽  
Cold Bending ◽  
Strength Rock ◽  
The Impact

—Abstract: The use of high-strength rock bolt in the underground often occured brittle fracture in the threaded section, this is closely related to bolt material impact toughness. Tested the impact absorbed energy of four manufacturers of the yield strength of 500MPa rock bolt and the impact absorbed energy value ranging from 19J to 165J. Tested bending test of the bolt rod and threaded section that has a different impact absorbed energy, the results showed that: the impact toughness affects the cold bending of the rock bolt thread segment, when the impact absorbed energy value is less than 30J rock bolt thread segment cold bending poor; impact toughness has no obvious affect on the cold bending of rod.

scholarly journals Biological Resistance of Elm (Ulmus carpinifolia var. Umbelifera) Trees against Fungal Endophytes and White Rot Decay Fungi

2020 ◽  
Vol 3 (1) ◽  
pp. 1
Author(s):  
Huijun Dong ◽  
Mina Raiesi ◽  
Mohsen Bahmani ◽  
Ali Jafari ◽  
Hamed Aghajani
Keyword(s):  
Abiotic Factors ◽  
Fungal Endophytes ◽  
Wood Properties ◽  
Urban Trees ◽  
White Rot ◽  
Bending Test ◽  
Decay Fungi ◽  
Impact Bending ◽  
Decay Tests ◽  
The Impact

Urban trees are one of the valuable storage in metropolitan areas. Nowadays, a particular attention is paid to the trees and spends million dollars per year to their maintenance. Trees are often subjected to abiotic factors, such as fungi, bacteria, and insects, which lead to decline mechanical strength and wood properties. The objective of this study was to determine the potential degradation of Elm tree wood by Phellinus pomaceus fungi, and Biscogniauxia mediteranae endophyte. Biological decay tests were done according to EN 113 standard and impact bending test in accordance with ASTM-D256-04 standard. The results indicated that with longer incubation time, weight loss increased for both sapwood and heartwood. Fungal deterioration leads to changes in the impact bending. In order to manage street trees, knowing tree characteristics is very important and should be regularly monitored and evaluated in order to identify defects in the trees.

Impact Resistance of SM Joints Formed With ICA

2003 ◽  
Vol 125 (1) ◽  
pp. 93-97 ◽  
Author(s):  
C. M. Lawrence Wu ◽  
Robert K. Y. Li ◽  
N. H. Yeung
Keyword(s):  
Impact Damage ◽  
Impact Resistance ◽  
High Energy ◽  
Bending Test ◽  
Conductive Adhesives ◽  
Energy Impact ◽  
Split Hopkinson ◽  
Post Impact ◽  
Impact Bending ◽  
The Impact

Isotropic conductive adhesives (ICA) have been considered as replacement materials for lead-tin solder alloys. In this paper, the post-impact shear strength of ICA surface mount (SM) joints was obtained experimentally and compared with that of SM lead-tin joints. The dynamic impact energy was provided in the form of three-point bending on the PCB using equipment called the split Hopkinson bar. Strain rates of over 4000/s were used for the impact bending test. The action of impact bending was used to simulate the effect on the PCB and the interconnection as a result of high energy impact on an electronic equipment. Shear test was then performed to examine the change in strength of the ICA joints as a result of impact damage. It was found that the SM ICA joints failed due to impact at a strain rate just over 4000/s. Microstructural examination carried out using a scanning electron microscope revealed that the interface between the ICA and copper pad on the PCB was the weakest region of the joint.

Evaluation of Impact Bending Strength of Ceramic Composites at Ultra-High Temperatures from 1500-2000 °C in Air

2013 ◽  
Vol 591 ◽  
pp. 145-149 ◽  
Author(s):  
De Tian Wan ◽  
Yi Wang Bao ◽  
Hua Zhao ◽  
Yuan Tian
Keyword(s):  
High Temperatures ◽  
Bending Strength ◽  
Impact Load ◽  
Ceramic Composites ◽  
Test Method ◽  
Bending Test ◽  
Dynamic Force ◽  
Maximal Load ◽  
Impact Bending ◽  
The Impact

In this work, a new and novel test method was developed to determine the impact bending strength of ceramic composites at ultra-high temperature from 1500-2000 °C in air. Three-point impact bending test was carried out through a SiC pressure head with a dynamic force sensor fixed on a slider and movable along a guide rail. The impact load was adjusted by different saving energy and the impact speed was lower than 0.5 m/s. The center of the sample was heated up to about 1500-2000°C by oxygen-assisted spray combustion. An impact load was put on the specimen and the impact force was recorded automatically. The impact bending strength can be calculated from the maximal load and the sample size. To check the availability and reliability for this method, several ceramics including SiC, ZrB2/SiC and C/C fiber reinforced composite without coating, were used as the testing samples. The results indicate that this method is a good and feasible method for evaluating the mechanical properties of the ceramic composite at ultra-high temperatures.

scholarly journals Impact Bending Test Simulations of FH32 High-strength Steel for Arctic Marine Structures

2016 ◽  
Vol 2 (1) ◽  
pp. 28-39
Author(s):  
Joonmo Choung ◽  
Donghwa Han ◽  
Myung-Hyun Noh ◽  
Jae-Yik Lee ◽  
Sanghoon Shim
Keyword(s):  
High Strength Steel ◽  
High Strength ◽  
Bending Test ◽  
Marine Structures ◽  
Impact Bending

Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball

2011 ◽  
Author(s):  
Hisashi Tanie ◽  
Nobuhiko Chiwata ◽  
Motoki Wakano ◽  
Masaru Fujiyoshi ◽  
Shinichi Fujiwara
Keyword(s):  
Fatigue Life ◽  
Impact Strength ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Flip Chip ◽  
Bending Test ◽  
Insulating Layer ◽  
Thermal Fatigue Life ◽  
Impact Bending ◽  
The Impact

A Cu-cored solder joint is a micro-joint structure in which a Cu sphere is encased in solder. It results in a more accurate height and has low thermal and electrical resistance. In a previous paper, we examined the thermal fatigue life of a Cu-cored solder ball grid array (BGA) joint through actual measurements and crack propagation analysis. As a result, we found that the thermal fatigue life of a Cu-cored solder BGA joint is about twice as long as that of a conventional joint. In this paper, we describe the impact strength of a Cu-cored solder BGA joint determined by conducting an impact bending test. This test is a technique to measure the impact strength of a micro-solder joint. This method was developed by Yaguchi et al., and they confirmed that it is an easier and more accurate method of measuring impact strength than the board level drop test. First, we simulated the impact bending test by finite element analysis (FEA) and calculated solder strains of both Cu-cored solder joints and conventional joints. The results indicated that the maximum solder strain of a Cu-cored solder joint during the impact bending test was slightly smaller than that of a conventional joint. The solder volume of the Cu-cored solder joint was also smaller than that of a conventional joint. On the other hand, joint stiffness of the Cu-cored solder joint was larger than in a conventional joint. The former increases the solder strain of the Cu-cored solder joint, and the latter decreases it. By balancing these phenomena, it is possible to obtain a maximum solder strain in the Cu-cored solder joint that is slightly smaller than in a conventional joint. Based on these phenomena, the impact strength of the Cu-cored solder joint is predicted to be the same as or higher than that of a conventional joint. Therefore, we measured the impact strengths of a Cu-cored solder joint and a conventional joint using the impact bending test. As a result, we confirmed that the impact strength of the Cu-cored solder joint was the same as or higher than that of a conventional joint. Accordingly, a Cu-cored solder BGA joint is a micro-joint structure that makes it possible to improve thermal fatigue life without decreasing impact strength. Moreover, we investigated whether the use of Cu-cored solder in a flip-chip (FC) joint improved its reliability. As a result, we found that the stress of an insulating layer on a Si die surface was reduced by using a Cu-cored solder FC joint. This is because bending deformation of the Cu land occurs, and the difference in thermal deformation between the Si chip and the Cu land becomes small. Accordingly, the Cu-cored solder FC joint is a suitable structure for improving reliability of a low-strength insulating layer.

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