Maximum deceleration and negative dispersion of plasmons along a metal layer

Abstract Metal interconnect defects have become a more serious yield detractor as backend process complexity has increased from a single layer to about 10 layers. This paper introduces a test methodology to monitor and localize the metal defects based on FPGA products. The test patterns are generated for each metal layer. The results not only indicate the severity of defects for each metal layer, but also accurately isolate open/short defects.

Download Full-text

Investigation of High Frequency Failures on a 0.35μm CMOS IC

ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa1999p0359 ◽

1999 ◽

Author(s):

Alan Kennen ◽

John F. Guravage ◽

Lauren Foster ◽

John Kornblum

Keyword(s):

Failure Analysis ◽

Failure Mechanism ◽

Integrated Circuit ◽

Metal Layer ◽

Ion Beam ◽

Stress Test ◽

Design For Test ◽

Interface Failure ◽

Serial Interface ◽

High Impedance

Abstract Rapidly changing technology highlights the necessity of developing new failure analysis methodologies. This paper will discuss the combination of two techniques, Design for Test (DFT) and Focused Ion Beam (FIB) analysis, as a means for successfully isolating and identifying a series of high impedance failure sites in a 0.35 μm CMOS design. Although DFT was designed for production testing, the failure mechanism discussed in this paper may not have been isolated without this technique. The device of interest is a mixed signal integrated circuit that provides a digital up-convert function and quadrature modulation. The majority of the circuit functions are digital and as such the majority of the die area is digital. For this analysis, Built In Self Test (BIST) circuitry, an evaluation board for bench testing and FIB techniques were used to successfully identify an unusual failure mechanism. Samples were subjected to Highly Accelerated Stress Test (HAST) as part of the device qualification effort. Post-HAST electrical testing at 200MHz indicated that two units were non-functional. Several different functional blocks on the chip failed electrical testing. One part of the circuitry that failed was the serial interface. The failure analysis team decided to look at the serial interface failure mode first because of the simplicity of the test. After thorough analysis the FA team discovered increasing the data setup time at the serial port input allowed the device to work properly. SEM and FIB techniques were performed which identified a high impedance connection between a metal layer and the underlying via layer. The circuit was modified using a FIB edit, after which all vectors were read back correctly, without the additional set-up time.

Download Full-text

Circuit Tracing on Integrated Circuit Using FIB Passive Voltage Contrast Effect

ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2015p0092 ◽

2015 ◽

Author(s):

Alexander Sorkin ◽

Chris Pawlowicz ◽

Alex Krechmer ◽

Michael W. Phaneuf

Keyword(s):

Electron Microscope ◽

Integrated Circuits ◽

Integrated Circuit ◽

Metal Layer ◽

Database System ◽

Conventional Procedure ◽

Sem Imaging ◽

Voltage Contrast ◽

Scanning Electron ◽

Graphic Database

Abstract Competitive circuit analysis of Integrated Circuits (ICs) is one of the most challenging types of analysis. It involves multiple complex IC die de-processing/de-layering steps while keeping precise planarity from metal layer to metal layer. Each step is followed by Scanning Electron Microscope (SEM) imaging together with mosaicking that subsequently passes through an image recognition and Graphic Database System (GDS) conversion process. This conventional procedure is quite time and resource consuming. The current paper discusses and demonstrates a new inventive methodology of circuit tracing on an IC using known FIB Passive Voltage Contrast (PVC) effects [1]. This technique provides significant savings in time and resources.

Download Full-text

Plastics piping systems. Multilayer M (metal) pipes. Test method for strength of the weld line in the metal layer and bonding between layers by use of a cone

10.3403/30159612u ◽

2015 ◽

Keyword(s):

Metal Layer ◽

Weld Line ◽

Test Method ◽

Piping Systems ◽

Metal Pipes

Download Full-text

Structure and properties of gas-dynamic coatings and evaluation of their use in sliding friction pairs

10.36652/1813-1336-2020-16-6-260-266 ◽

2020 ◽

pp. 260-266

Author(s):

V.E. Arkhipov ◽

T.I. Murav’eva ◽

M.S. Pugachev ◽

O.O. Shcherbakova

Keyword(s):

Aluminum Oxide ◽

Sliding Friction ◽

Metal Layer ◽

Structural Phase ◽

Mechanical Mixture ◽

Structural Factors ◽

Coating Structure ◽

Corundum Structure ◽

Deposited Metal ◽

Copper Zinc

The problems of changes in the coating structure depending on the composition of the sprayed mechanical mixture using copper particles and mixture of copper and zinc particles (" brass") and the effect of structural factors on the tribological properties of the deposited metal layer are considered. The results of X-ray structural, phase, chemical and durometric analyzes, as well as tribological testing of coatings are presented. It is found that structure with hardness of ≈102.7 HV is formed in the coating from mechanical mixture of particles of copper and aluminum oxide (corundum). Numerous pores are observed in the structure of the deposited metal layer, the main size of which does not exceed 2 μm. In the coating from mechanical mixture of particles copper, zinc and aluminum oxide (corundum), structure is formed based on copper with hardness of ≈106.5 HV, zinc — ≈49.7 HV, intermetallic compounds (γ- and ε-phases) — ≈168.7 HV, the mass fraction of which is 62.0, 7.9 and 24.2 %, respectively. Both coatings can be used in sliding friction pairs.

Download Full-text

Applications of two dimensional material-MXene for proton exchange membrane fuel cells (PEMFCs) and water electrolysis

Current Nanoscience ◽

10.2174/1573413716999200614140513 ◽

2020 ◽

Vol 16 ◽

Author(s):

Chanchan Fan ◽

Peng Zhang ◽

Ranran Wang ◽

Yezhu Xu ◽

Xingrui Sun ◽

...

Keyword(s):

Fuel Cells ◽

Water Splitting ◽

Proton Exchange Membrane ◽

Layer Structure ◽

Metal Layer ◽

Water Electrolysis ◽

Proton Exchange ◽

Two Dimensional ◽

Max Phases ◽

Early Transition Metal

: A new kind of two-dimensional (2D) materials MXene (early transition metal carbides, nitrides and carbonitrides) is obtained by selective etching the A element from the MAX phases. MXene exhibits both the metallic conductivity and the hydrophilic nature due to its metal layer structure and hydroxyl or oxygen terminated surfaces. This review provides an overview of the MXene used in the electrolytes and electrodes for the fuel cells and water splitting. MXene with functional groups termination could construct ion channels that significantly benefits to the ion conductivity through the electrolyte. The metal supported by MXene interaction offers electronic, compositional, and geometric effects that could enhance the catalytic activity and stability. MXene have already shown promising performance for fuel cells and water electrolysis. Herein, the etching and intercalation methods of MXene in recent years are summarized. The applications of MXene for fuel cells electrolyte, catalyst and water splitting catalyst are revealed to provide more brief idea for MXene used as new energy materials.

Download Full-text