Possibility of raising the deposition rate of nickel coatings from a chloride electrolyte

2009 ◽  
Vol 82 (2) ◽  
pp. 255-261 ◽  
Author(s):  
V. I. Balakai ◽  
N. Yu. Kurnakova ◽  
A. V. Arzumanova ◽  
K. V. Balakai ◽  
I. V. Balakai
2011 ◽  
Vol 84 (10) ◽  
pp. 1732-1737
Author(s):  
V. I. Balakai ◽  
N. Yu. Kurnakova ◽  
K. V. Murzenko ◽  
I. F. Byrylov ◽  
D. N. Kuznetsov

Author(s):  
Ruslan F. Shekhanov

The calculation of the corrosion current of the steel – plating allowed us to estimate the protective properties and the porosity of the Tin-Nickel coatings. Measured in 3% NaCl solution the potential of steel electrode covered by tin alloy-Nickel thickness of 5, 10, 15 µm, respectively, has values of -277 mV, -314 mV, -355 mV, and the potential of steel 0.8 KP was 440 mV relative to the standard hydrogen electrode. At a thickness of 15 µm and at the mentioned potential the current density of corrosion for system steel – coating from tin-Nickel oxalate electrolyte was 2.3 µa/cm2, and for the coating from fluoride-chloride electrolyte was 7.5 µA/cm2. Therefore, the protective ability of tin-Nickel coatings obtained from oxalate-sulfate electrolytes is 3 times higher than similar coatings from fluoride-chloride electrolyte. Corrosion tests in salt spray chamber for Sn-Ni coatings obtained from oxalate-ammonium electrolyte confirmed the high corrosion resistance of tin-Nickel coatings when the ratio of the metals in the electrolyte was Ni/Sn = 5/1. The coatings obtained from oxalate electrolytes, distinguished by small size grains, in contrast to the coatings deposited from fluoride-chloride electrolyte. The increase in the microhardness of the coatings contributes a more microcrystalline surface topography of the alloy tin-Nickel deposited from oxalate-sulfate electrolytes, as it was evidenced by the results of crystallographic calculations. The test of specimens for microhardness showed that the samples obtained from oxalate-sulfate electrolytes are a bit harder (255 MPa) than samples obtained from fluoride-chloride electrolyte (245 MPa). The study of the structure of the coatings was performed using scanning electron microscope.  SEM data showed that coatings obtained from the fluoride-chloride electrolyte have the pores, whereas poros are practically absent for caotings obtained from oxalate-ammonium. Probably, for these reasons the tin-Nickel coating obtained from oxalate-ammonium electrolyte better resists to corrosion in comparison with similar coating prepared from fluoride-chloride electrolyte. The technological process of depositing tin-nickel alloy from said weakly acid electrolyte is twice as effective and high-speed as compared to alkaline tinning, since the electrochemical equivalent of tin (II) is twice as high as for tin (IV) deposited from the alkaline electrolyte. It has been established that coatings obtained from oxalate-ammonium electrolytes, due to increased polarization during electrodeposition, are finer-grained, corrosion-resistant in comparison with coatings obtained from fluoride-chloride electrolytes. High dissipation ability of oxalate-ammonium electrolytes makes it possible to deposit tin-nickel coatings on composite products. The new technological processes studied in the result of the work made it possible to improve the physical and chemical properties of the coatings, to reduce material costs and to reduce environmental pollutionForcitation:Shekhanov R.F. Protective ability of tin-nickel coatings. Izv. Vyssh. Uchebn. Zaved. Khim. Khim. Tekhnol. 2017. V. 60. N 10. P. 75-81


Author(s):  
T.E. Pratt ◽  
R.W. Vook

(111) oriented thin monocrystalline Ni films have been prepared by vacuum evaporation and examined by transmission electron microscopy and electron diffraction. In high vacuum, at room temperature, a layer of NaCl was first evaporated onto a freshly air-cleaved muscovite substrate clamped to a copper block with attached heater and thermocouple. Then, at various substrate temperatures, with other parameters held within a narrow range, Ni was evaporated from a tungsten filament. It had been shown previously that similar procedures would yield monocrystalline films of CU, Ag, and Au.For the films examined with respect to temperature dependent effects, typical deposition parameters were: Ni film thickness, 500-800 A; Ni deposition rate, 10 A/sec.; residual pressure, 10-6 torr; NaCl film thickness, 250 A; and NaCl deposition rate, 10 A/sec. Some additional evaporations involved higher deposition rates and lower film thicknesses.Monocrystalline films were obtained with substrate temperatures above 500° C. Below 450° C, the films were polycrystalline with a strong (111) preferred orientation.


Author(s):  
R. W. Vook ◽  
R. Cook ◽  
R. Ziemer

During recent experiments on Au films, a qualitative correlation between hole formation and deposition rate was observed. These early studies were concerned with films 80 to 1000A thick deposited on glass at -185°C and annealed at 170°C. In the present studies this earlier work was made quantitative. Deposition rates varying between 5 and 700 A/min were used. The effects of deposition rate on hole density for two films 300 and 700A thick were investigated.Au was evaporated from an outgassed W filament located 10 cm from a glass microscope slide substrate and a quartz crystal film thickness monitor. A shutter separating the filament from the substrate and monitor made it possible to obtain a constant evaporation rate before initiating deposition. The pressure was reduced to less than 1 x 10-6 torr prior to cooling the substrate with liquid nitrogen. The substrate was cooled in 15 minutes during which the pressure continued to drop to the mid 10-7 torr range, where deposition was begun.


2002 ◽  
Vol 715 ◽  
Author(s):  
Zhi-Feng Huang ◽  
Rashmi C. Desai

AbstractThe morphological and compositional instabilities in the heteroepitaxial strained alloy films have attracted intense interest from both experimentalists and theorists. To understand the mechanisms and properties for the generation of instabilities, we have developed a nonequilibrium, continuum model for the dislocation-free and coherent film systems. The early evolution processes of surface pro.les for both growing and postdeposition (non-growing) thin alloy films are studied through a linear stability analysis. We consider the coupling between top surface of the film and the underlying bulk, as well as the combination and interplay of different elastic effects. These e.ects are caused by filmsubstrate lattice misfit, composition dependence of film lattice constant (compositional stress), and composition dependence of both Young's and shear elastic moduli. The interplay of these factors as well as the growth temperature and deposition rate leads to rich and complicated stability results. For both the growing.lm and non-growing alloy free surface, we determine the stability conditions and diagrams for the system. These show the joint stability or instability for film morphology and compositional pro.les, as well as the asymmetry between tensile and compressive layers. The kinetic critical thickness for the onset of instability during.lm growth is also calculated, and its scaling behavior with respect to misfit strain and deposition rate determined. Our results have implications for real alloy growth systems such as SiGe and InGaAs, which agree with qualitative trends seen in recent experimental observations.


2003 ◽  
Vol 766 ◽  
Author(s):  
Kosuke Takenaka ◽  
Masao Onishi ◽  
Manabu Takenshita ◽  
Toshio Kinoshita ◽  
Kazunori Koga ◽  
...  

AbstractAn ion-assisted chemical vapor deposition method by which Cu is deposited preferentially from the bottom of trenches (anisotropic CVD) has been proposed in order to fill small via holes and trenches. By using Ar + H2 + C2H5OH[Cu(hfac)2] discharges with a ratio H2 / (H2 + Ar) = 83%, Cu is filled preferentially from the bottom of trenches without deposition on the sidewall and top surfaces. The deposition rate on the bottom surface of trenches is experimentally found to increase with decreasing its width.


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