Scaling Challenges for Advanced CMOS Devices

2017 ◽  
Vol 26 (01n02) ◽  
pp. 1740001 ◽  
Author(s):  
Ajey P. Jacob ◽  
Ruilong Xie ◽  
Min Gyu Sung ◽  
Lars Liebmann ◽  
Rinus T. P. Lee ◽  
...  

The economic health of the semiconductor industry requires substantial scaling of chip power, performance, and area with every new technology node that is ramped into manufacturing in two year intervals. With no direct physical link to any particular design dimensions, industry wide the technology node names are chosen to reflect the roughly 70% scaling of linear dimensions necessary to enable the doubling of transistor density predicted by Moore’s law and typically progress as 22nm, 14nm, 10nm, 7nm, 5nm, 3nm etc. At the time of this writing, the most advanced technology node in volume manufacturing is the 14nm node with the 7nm node in advanced development and 5nm in early exploration. The technology challenges to reach thus far have not been trivial. This review addresses the past innovation in response to the device challenges and discusses in-depth the integration challenges associated with the sub-22nm non-planar finFET technologies that are either in advanced technology development or in manufacturing. It discusses the integration challenges in patterning for both the front-end-of-line and back-end-of-line elements in the CMOS transistor. In addition, this article also gives a brief review of integrating an alternate channel material into the finFET technology, as well as next generation device architectures such as nanowire and vertical FETs. Lastly, it also discusses challenges dictated by the need to interconnect the ever-increasing density of transistors.

2008 ◽  
Vol 14 (5) ◽  
pp. 455-457 ◽  
Author(s):  
V.K. Arora ◽  
M. Kempkes

Partnership between government agencies and academic institutions is of paramount significance in the early stages of technology development. Industry should play only an advisory role in the initial screening and selection process for research proposals competing for federal grants and support. Industry engagement is critical during the advanced development and pre-commercialization phase of an emerging food processing technology because manufacturers in industry are the end-users of the technology. They have the knowledge of consumer needs and food trends. They are eager to embrace a technology if it can deliver what consumers want. At the same time, industry needs to balance its involvement against the perceived market potential for a new technology — which can be very low until the technology is both proven and scaled to reasonable size. Partnerships and consortia provide an ideal means to accelerate advanced development and commercialization of an emerging technology, allowing the industrial partners to balance their investment with the technology's promise to fulfill a business or consumer need in the marketplace.


Author(s):  
Jianwei Zhou ◽  
Wei Zheng ◽  
Taekoo Lee

Abstract Multi-Chip Package (MCP) decapsulation is now becoming a rising problem. Because for traditional decapsulation method, acid can’t dissolve the top silicon die to expose the bottom die surface in MCP. It makes inspecting the bottom die in MCP is difficult. In this paper, a new MCP decapsulation technology combining mechanical polishing with chemical etching is introduced. This new technology can remove the top die quickly without damaging the bottom die using KOH and Tetra-Methyl Ammonium Hydroxide (TMAH). The technology process and relative application are presented. The factors that affect the KOH and TMAH etch rate are studied. The usage difference between the two etchant is discussed.


Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.


Electronics ◽  
2021 ◽  
Vol 10 (4) ◽  
pp. 443
Author(s):  
Mihaela-Daniela Dobre ◽  
Philippe Coll ◽  
Gheorghe Brezeanu

This paper proposes an investigation of a CDM (charge device model) electrostatic discharge (ESD) protection method used in submicronic input–output (I/O) structures. The modeling of the commonly used ESD protection devices as well as the modeling of the breakdown caused by ESD is not accurate using traditional commercial tools, hence the need for test-chip implementation, whenever a new technology node is used in production. The proposed method involves defining, implementing, testing, and concluding on one test-chip structure named generically “CDM ground resistance”. The structure assesses the maximum ground resistance allowed for the considered technology for which CDM protection is assured. The findings are important because they will be actively used as CDM protection for all I/O structures developed in the considered submicronic technology node. The paper will conclude on the constraints in terms of maximum resistance of ground metal track allowed to be CDM protected.


Author(s):  
Pablo Cazenave ◽  
Ming Gao ◽  
Hans Deeb ◽  
Sean Black

The project “Development of an Industry Test Facility and Qualification Processes for in-line inspection (ILI) technology Evaluation and Enhancements” aims to expand knowledge of ILI technology performance and identify gaps where new technology is needed. Additionally, this project also aims to provide ILI technology developers, researchers and pipeline operators a continuing resource for accessing test samples with a range of pipeline integrity threats and vintages; and inline technology test facilities at the Technology Development Center (TDC) of Pipeline Research Council International, Inc. (PRCI), a PRCI managed facility available for future industry and PHMSA research projects. An ILI pull test facility was designed and constructed as part of this project based on industry state-of-the-art and opportunities for capability improvement. The major ILI technology providers, together with pipeline operator team members, reviewed the TDC sample inventory and developed a series of ILI performance tests illustrating one of multiple possible research objectives, culminating in 16-inch and 24-inch nominal diameter test strings. The ILI technology providers proposed appropriate inspection tools based on the types of the integrity threats in the test strings, a series of pull tests of the provided ILI tools were performed, and the technology providers delivered reports of integrity anomaly location and dimensions for performance evaluation. Quantitative measures of detection and sizing performance were confidentially disclosed to the individual ILI technology providers. For instances where ILI predictions were outside of claimed performance, the vendors were given a limited sample of actual defect data to enable re-analysis, thus demonstrating the potential for improved integrity assessment with validation measurements. In this paper, an evaluation of the ILI data obtained from repeated pull-through testing on the 16 and 24-inch pipeline strings at the TDC is performed. The resulting data was aligned, analyzed, and compared to truth data and the findings of the evaluation are presented.


2014 ◽  
Vol 16 (3) ◽  
pp. 263-280 ◽  
Author(s):  
Elisabeth E. Bennett

The Problem Initial explorations of virtual human resource development (VHRD) were published in the 12(6) issue of Advances, but these articles were only an initial step toward conceptualization. New perspectives on VHRD have developed over the past 4 years, particularly about human resource development’s (HRD) role in the development of new technology. The Solution This article provides a brief overview of existing published literature on VHRD, offers new conceptualizations of HRD’s role with technology development, and introduces the articles in this issue that advance their own new perspectives. This article argues that HRD must adopt new skills and develop explanatory models for growing organizational learning capacity in virtual work. The Stakeholders This article is of interest to practitioners and managers who lead technology projects and work within technology-enabled professional environments, as well as scholars interested in studying VHRD.


2016 ◽  
Vol 14 (2) ◽  
pp. 152-166 ◽  
Author(s):  
Joanne E. McNeish ◽  
Anthony Francescucci ◽  
Ummaha Hazra

Purpose The next phase of hardware technology development is focused on alternative ways to manage and store consumers’ personal content. However, even consumers who have adopted Cloud-based services have demonstrated a reluctance to move all of their personal content into the Cloud and continue to resist giving up local hard drives. This paper aims to investigate the characteristics of local hard drives and the Cloud that lead to simultaneous use. Design/methodology/approach This paper uses content analysis of online comments and ten depth interviews with simultaneous users of local hard drives and the Cloud. Findings Three factors influence the resistance to giving up local hard drives. Simultaneous users utilize local hard drives as a redundancy system and as a way to ensure the permanence of their digital content. They are unsure of the Cloud’s ability to support their content creation, management and storage activities (task-technology fit). Research limitations/implications Study findings are based on qualitative methods and thus the results cannot be considered conclusive. Practical implications The authors speculate that it is unlikely that Cloud-only will fully replace hard drives until these factors are understood and addressed by information technology developers. Cloud service providers may not be aware of how little that users understand the Cloud. In contrast to their certainty and confidence in local hard drives, simultaneous users are confused as to what the Cloud is and how it functions. This uncertainty exacerbates their risk perception and need for control. Originality/value This is the first study exploring simultaneous use of local hard drives and the Cloud with a view to understanding this behaviour in terms of the relative advantage of the incumbent technology over the new technology.


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