Characterization of GaSb thin films with excess Ga grown by RF magnetron sputtering

2020 ◽  
Vol 34 (10) ◽  
pp. 2050097 ◽  
Author(s):  
Naoki Nishimoto ◽  
Junko Fujihara

Understanding the behavior of excess Ga is important for fabrication methods that employ the sputtering of GaSb-based materials. This is due to the comparatively low vapor pressure of Ga, which can result in GaSb becoming Ga-rich under experimental conditions. In this study, the growth and characterization of nonstoichiometric polycrystalline GaSb thin films with excess Ga, grown by RF magnetron sputtering, are reported. Ga content was adjusted by mixing N2 in the Ar sputtering gas. The structural properties indicate that the grown thin films maintain the zinc blend structure of GaSb, and have an induced tensile strain along a direction parallel to the substrate. Excess Ga segregates towards the film surface and forms micro/nanoclusters. The internal tensile strain and the Ga cluster formation have little effect on the intrinsic properties of GaSb. These findings could lead to the fabrication of GaSb-based thin films using sputtering with excellent mass productivity.

2010 ◽  
Vol 1245 ◽  
Author(s):  
Reza Anvari ◽  
Qi Cheng ◽  
Muhammad Lutful Hai ◽  
Truc Phan Bui ◽  
A. J. Syllaios ◽  
...  

AbstractThis paper presents the formation and the characterization of silicon germanium oxide (SixGeyO1-x-y) infrared sensitive material for uncooled microbolometers. RF magnetron sputtering was used to simultaneously deposit Si and Ge thin films in an Ar/O2 environment at room temperature. The effects of varying Si and O composition on the thin film's electrical properties which include temperature coefficient of resistance (TCR) and resistivity were investigated. The highest achieved TCR and the corresponding resistivity at room temperature were -5.41 %/K and 3.16×103 ohm cm using Si0.039Ge0.875O0.086 for films deposited at room temperature.


Author(s):  
Thyago Santos Braga ◽  
Marcos Massi ◽  
Argemiro Soares Silva Sobrinho ◽  
Fabio Dondeo Origo ◽  
Choyu Otani

2019 ◽  
Vol 33 (15) ◽  
pp. 1950152 ◽  
Author(s):  
Jing Wu ◽  
Xiaofeng Zhao ◽  
Chunpeng Ai ◽  
Zhipeng Yu ◽  
Dianzhong Wen

To research the piezoresistive properties of SiC thin films, a testing structure consisting of a cantilever beam, SiC thin films piezoresistors and a Cr/Pt electrode is proposed in this paper. The chips of testing structure were fabricated by micro-electro-mechanical system (MEMS) technology on a silicon wafer with [Formula: see text]100[Formula: see text] orientation, in which SiC thin films were deposited by using radio-frequency (13.56 MHz) magnetron sputtering method. The effect of sputtering power, annealing temperature and time on the microstructure and morphology of the SiC thin films were investigated by the X-ray diffraction (XRD) and scanning electron microscopy (SEM). It indicates that a good continuity and uniform particles on the SiC thin film surface can be achieved at sputtering power of 160 W after annealing. To verify the existence of Si–C bonds in the thin films, X-ray photoelectron spectroscopy (XPS) was used. Meanwhile, the piezoresistive properties of SiC thin films piezoresistors were measured using the proposed cantilever beam. The test result shows that it is possible to achieve a gauge factor of 35.1.


2010 ◽  
Author(s):  
K. Yamaki ◽  
S. Sekino ◽  
T. Tai ◽  
S. Nakamura ◽  
T. Yoshitake ◽  
...  

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