A Multi-Objective-Driven Placement Technique for Digital Microfluidic Biochips

2019 ◽  
Vol 28 (05) ◽  
pp. 1950076
Author(s):  
Chaowei Wan ◽  
Xiaodao Chen ◽  
Dongbo Liu
Keyword(s):  
Computer Aided Design ◽  
High Performance ◽  
Low Cost ◽  
Operation Time ◽  
Physical Design ◽  
Multi Objective ◽  
Total Operation Time ◽  
Microfluidic Biochips ◽  
Chip Size ◽  
Digital Microfluidic

Microfluidic biochips are extensively utilized in biochemistry procedures due to their low cost, high precision and efficiency when compared to traditional laboratory procedures. Recent, computer-aided design (CAD) techniques enable a high performance in digital microfluidic biochip design. A key part in digital microfluidic biochip CAD design is the biochip placement procedure which determines the physical location for biological reactions during the physical design. For the biochip physical design, multiple objects need to be considered, such as the size of the chip and the total operation time. In this paper, a multi-objective optimization is proposed based on Markov decision processes (MDPs). The proposed method is evaluated on a set of standard biochip benchmarks. Compared to existing works, experimental results show that the total operation time, the capacity for routing and the chip size can be optimized simultaneously.

Design and Calibration of MIMU Based on Chip Size Micro Inertial Sensors

2013 ◽  
Vol 849 ◽  
pp. 302-309
Author(s):  
Yun Xu ◽  
Xin Hua Zhu ◽  
Yu Wang
Keyword(s):  
High Performance ◽  
Inertial Sensors ◽  
Low Cost ◽  
Rapid Development ◽  
Experimental Result ◽  
Integrated Navigation ◽  
Bias Stability ◽  
Chip Size ◽  
Order Of Magnitude ◽  
On Chip

With rapid development of micro fabrication technology, the performance of MIMU has gradually improved. The MIMU introduced in this paper is based on the silicon micro machined gyroscope of type MSG7000D and accelerometer of type MSA6000. The volume of it is 3×3×3cm3, the mass is 68.5g and the power consumption is less than 1w. The experimental result shows that the bias stability of the gyroscope and accelerometer for each axis of the designed MIMU is less than 10°/h and 0.5mg respectively. For the non orthogonality in three axes of the structure, MIMU needs to be calibrated. After calibration, the measurement accuracy has improved by an order of magnitude. The designed MIMU can satisfy the requirement of high performance, low cost, light weight and small size for strap-down navigation system, thus it can be widely applied not only to the field of vehicles integrated navigation, attitude measurement but also to the fields of personal goods such as mobile, game consoles and so on.

The Multi-Objective Optimization under Random Loads

2012 ◽  
Vol 166-169 ◽  
pp. 548-552
Author(s):  
Xian Jie Wang ◽  
Xun An Zhang ◽  
Yeda Lian
Keyword(s):  
High Performance ◽  
Low Cost ◽  
Structure Optimization ◽  
Extreme Value Distribution ◽  
Random Excitation ◽  
Probability Method ◽  
Multi Objective Optimization ◽  
Multi Objective ◽  
Structure Reliability ◽  
Random Loads

Structure optimization seeks to achieve the best performance for a structure while satisfying various constrains such as a given probability. In the traditional mathematical model of structure optimization, the goal and the restraint functions are given without considering the randomness of the structural system. In this paper, the random loads and strength are described by probability method, the structure reliability is considered as objective function. Using the genetic algorithm, the mega-sub controlled structural systems is multi-objective optimization designed based on the structure reliability under random excitation, combined with the probability density evolution method for evaluation of extreme value distribution. A low-cost and high-performance structure is getting.

Testing of Low-cost Digital Microfluidic Biochips with Non-Regular Array Layouts

2011 ◽  
Vol 28 (2) ◽  
pp. 243-255 ◽  
Author(s):  
Yang Zhao ◽  
Krishnendu Chakrabarty ◽  
Bhargab B. Bhattacharya
Keyword(s):  
Low Cost ◽  
Regular Array ◽  
Microfluidic Biochips ◽  
Digital Microfluidic

SiP(System in Package) Solutions with Wafer Level Packaging Technology

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 002226-002253 ◽  
Author(s):  
In Soo Kang ◽  
Jong Heon (Jay) Kim
Keyword(s):  
Embedded System ◽  
High Performance ◽  
Low Cost ◽  
Wafer Level ◽  
Molding Compound ◽  
Wafer Level Packaging ◽  
Ic Packaging ◽  
Chip Size ◽  
Bonding Technology ◽  
Small Form Factor

In mobile application, the WLP technology has been developing to make whole package size almost same as chip size. However, the I/O per chip unit area has increased so that it gets difficult to realize ideal pad pitch for better reliability. Recently, to achieve the thin and small size, high performance and low cost semiconductor package, Embedding Die and Fanout Technologies have been suggested and developed based on wafer level processing. In this work, as a solution of system in package, wafer level embedded package and fanout technology will be reviewed. Firstly, Wafer level embedded System in Package (WL-eSiP) which has daughter chip (small chip) embedded inside mother chip (bigger chip) without any special substrate has been suggested and developed. To realize wafer level embedded system in package (WL-eSiP), wafer level based new processes like wafer level molding for underfilling and encapsulation by molding compound without any special substrate have been applied and developed, including high aspect ratio Cu bumping, mold thinning and chip-to-wafer flipchip bonding. Secondly, Fan-out Package is considered as alternative package structure which means merged package structure of WLCSP (wafer level chip size package) and PCB process. We can make IC packaging widen area for SIP(System in Package) or 3D package. In addition, TSV and IPD are key enabling technology to meet market demands because TSV interconnection can provide wider bandwidth and high transmission speed due to vertical one compared to wire bonding technology and IPD can provide higher performance, more area saving to be assembled and small form factor compared to discrete passive components.

Digital Microfluidics: Connecting Biochemistry to Electronic System Design

2007 ◽  
Author(s):  
Krishnendu Chakrabarty
Keyword(s):  
Computer Aided Design ◽  
High Throughput Sequencing ◽  
Digital Microfluidics ◽  
Electronic System ◽  
Blood Chemistry ◽  
Clinical Diagnostics ◽  
System Level ◽  
Assay Optimization ◽  
Microfluidic Biochips ◽  
Digital Microfluidic

Microfluidics-based biochips are revolutionizing high-throughput sequencing, parallel immunoassays, blood chemistry for clinical diagnostics, DNA sequencing, and environmental sensing. The complexity of microfluidic devices, also referred to as lab-on-a-chip, is expected to become significant in the near future due to the need for multiple and concurrent biochemical assays on multifunctional and reconfigurable platforms. This paper provides an overview of droplet-based “digital” microfluidic biochips. It presents early work on top-down system-level computer-aided design (CAD) tools for the synthesis, testing and reconfiguration of microfluidic biochips. These CAD techniques allow the biochip to concentrate on the development of the nano- and micro-scale bioassays, leaving assay optimization and implementation details to design automation tools.

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