Optimization and reliable analysis of selective inhibition sintering parameters to achieve reduced surface roughness of PA12 parts

2021 ◽  
Author(s):  
Sagar M. Baligidad
Keyword(s):  
Surface Roughness ◽  
Selective Inhibition ◽  
Selective Inhibition Sintering ◽  
Reliable Analysis ◽  
Reduced Surface

scholarly journals Effect of Various Infrared Heaters on Sintering Behavior of UHMWPE in Selective Inhibition Sintering Process

2019 ◽  
Vol 8 (6) ◽  
pp. 725-731 ◽  
Keyword(s):  
Surface Roughness ◽  
Computer Aided Design ◽  
Low Cost ◽  
Laser System ◽  
Selective Laser Sintering ◽  
Heating Surface ◽  
Selective Inhibition ◽  
Sintering Behavior ◽  
Layer By Layer ◽  
Selective Inhibition Sintering

Selective inhibition sintering (SIS) is an emerging powder-based additive manufacturing technology that creates polymer or metal based parts through adhesion of layer-by-layer from three-dimensional computer-aided design model. Replacement of costly laser system in selective laser sintering tremendously reduces the cost of manufacturing. SIS attempts to incorporate low cost heaters to achieve efficient sintering for production of high quality parts. However, SIS demands uniform heating of each layer for effective sintering. The present study focused on examining the heating characteristics of three different types of infrared heaters with respect to various layer thickness and determining the optimal distance between the heating surface and the powder bed. Experiments are conducted using the low-cost heaters to obtain uniform distribution of heat energy across the ultra-high molecular weight polyethylene (UHMWPE) powder surface. The thermal and optical images are captured to observe the temperature distribution on the powder and the surface roughness. Tensile and compressive specimens were fabricated and their corresponding strength was determined and surface roughness was measured to study the surface characteristics of the parts.

Reduced Surface Roughness of P3HT: PCBM Thin Films with Different Ratios by Electrospray Deposition Methods

2013 ◽  
Vol E96.C (3) ◽  
pp. 362-364
Author(s):  
Takeshi FUKUDA ◽  
Kenji TAKAGI ◽  
Norihiko KAMATA ◽  
Jungmyoung JU ◽  
Yutaka YAMAGATA
Keyword(s):  
Thin Films ◽  
Surface Roughness ◽  
Electrospray Deposition ◽  
Reduced Surface

4H-SiC Epitaxial Growth on Carbon-Face Substrates with Reduced Surface Roughness

2006 ◽  
pp. 153-158
Author(s):  
Takashi Aigo ◽  
M. Sawamura ◽  
Tatsuo Fujimoto ◽  
Masakazu Katsuno ◽  
Hirokatsu Yashiro ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Epitaxial Growth ◽  
Reduced Surface

scholarly journals Optimization of fatigue strength of selective inhibition sintered polyamide 12 parts using RSM

2020 ◽  
Vol 7 ◽  
pp. 23
Author(s):  
Mesfin Sisay ◽  
Esakki Balasubramanian
Keyword(s):  
Fatigue Strength ◽  
Fatigue Behavior ◽  
Selective Inhibition ◽  
Layer By Layer ◽  
Process Variables ◽  
Polyamide 12 ◽  
Selective Inhibition Sintering ◽  
Nylon 12 ◽  
Rate Optimization ◽  
Feed Rate Optimization

Selective inhibition sintering (SIS) is a powder based that fabricate functional parts through fusion of powder bed on a layer by layer basis. Being a new fabrication method, the correlation between process variables and part properties are not fully comprehended. Polyamide 12 (nylon 12) is one of the widely used materials in powder based AM processes including SIS. Therefore, in this work, the effect of critical SIS process parameters on the fatigue behavior of polyamide 12 parts was experimentally investigated, and the parameter settings were optimized to maximize fatigue strength. The number of experimental runs was determined based on Box-Behnken design, and specimens were fabricated as per ASTM D7791. Specimens were tested by subjected them to fluctuating loading at a frequency of 3 Hz. The test results were analyzed using Minitab statistical analysis software. From the ANOVA result, it was identified that the fatigue life of SIS parts is significantly influenced by layer thickness, heater temperature, and heater feed rate. Optimization of process variables settings was performed using the Minitab response optimizer and maximum fatigue strength of 17.43 MPa was obtained. The verification experiment resulted in 17.93 MPa fatigue strength which is comparable to the predicted value and with the result from the literatures.

Thermal and Vapor Smoothing of Thermoplastic for Reduced Surface Roughness of Additive Manufactured RF Electronics

2019 ◽  
Vol 9 (6) ◽  
pp. 1151-1160
Author(s):  
Clayton Neff ◽  
Eduardo A. Rojas-Nastrucci ◽  
Justin Nussbaum ◽  
Darrell Griffin ◽  
Thomas M. Weller ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Rf Electronics ◽  
Reduced Surface

Thermo Mechanical Modeling of Selective Inhibition Sintered Thermoplastic Parts

2015 ◽  
Vol 813-814 ◽  
pp. 791-795 ◽  
Author(s):  
P. Arunkumar ◽  
Esakki Balasubramanian ◽  
U. Chandrasekhar
Keyword(s):  
Selective Inhibition ◽  
Spot Size ◽  
Powdered Material ◽  
Thin Layers ◽  
Digital Data ◽  
Thermal Gradients ◽  
Selective Inhibition Sintering ◽  
Engineering Organizations ◽  
Near Net Shape

Contemporary product design and development efforts of various engineering organizations have experienced the emergence of Additive Manufacturing (AM) or 3D printing technology as a competent fabrication option for converting digital data into physical parts without using part-specific tools or fixtures. This paper presents the results of coupled field structural thermal analysis carried out on an innovative variant of AM technology called selective inhibition sintering wherein near net shape parts are fabricated through sintering of thin layers of powdered material while inhibiting the boundaries. Thermal gradients that are inherent to the process cause significant residual stresses affecting the part stability. Hence this study evaluates the effect of layer thickness and heater spot size on temperature gradient, displacement and thermal stress of two different polymers is assessed by numerical analysis. Results of the current study are relevant to enhancing the quality of sintered polymer parts with reference to dimensional fidelity and stability.

4H-SiC Epitaxial Growth on Carbon-Face Substrates with Reduced Surface Roughness

2006 ◽  
Vol 527-529 ◽  
pp. 153-158 ◽  
Author(s):  
Takashi Aigo ◽  
M. Sawamura ◽  
Tatsuo Fujimoto ◽  
Masakazu Katsuno ◽  
Hirokatsu Yashiro ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Substrate Temperature ◽  
Epitaxial Layer ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Semiconductor Interface ◽  
Surface Morphologies ◽  
Reduced Surface ◽  
Quality Metal

4H-SiC epitaxial layers on Carbon-face (C-face) substrates were grown by a low-pressure hot-wall type chemical vapor deposition system. The C-face substrates were prepared by fine mechanical polishing using diamond abrasives with the grit size of 0.25 %m and in-situ HCl etching at 1400°C, which produced surface roughness of 0.27 nm. The use of the smooth substrates made it possible to decrease the substrate temperature and specular surface morphologies were realized at C/Si ratios of 1.5 or less both for a substrate temperature of 1550°C and for that of 1500°C. Surface roughness of 0.26 nm and the residual donor concentration of 6.7×1014 cm-3 were obtained for a C-face epitaxial layer grown at a C/Si ratio of 1.5 and at a substrate temperature of 1550°C. Schottky barrier diodes were fabricated on a non-doped C-face epitaxial layer grown at 1500°C and it was verified that a high quality metal-semiconductor interface was formed on the epitaxial layer.

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