A0.25 µmComplementary Metal Oxide Semiconductor Field Effect Transistor (CMOSFET) using Halo Implantation for 1 Gbit Dynamic Random Access Memory (DRAM)

1996 ◽  
Vol 35 (Part 1, No. 2B) ◽  
pp. 865-868 ◽  
Author(s):  
Dong Jin Jung ◽  
Jae Kwan Park ◽  
Kang Yoon Lee ◽  
Nam Soo Kang ◽  
Ki Nam Kim ◽  
...  
2020 ◽  
Vol 20 (11) ◽  
pp. 6596-6602
Author(s):  
Won Douk Jang ◽  
Young Jun Yoon ◽  
Min Su Cho ◽  
Jun Hyeok Jung ◽  
Sang Ho Lee ◽  
...  

In this work, a capacitorless one-transistor embedded dynamic random-access memory based on a metal-oxide-semiconductor field-effect transistor with a double-polysilicon layer structure has been proposed and investigated using technology computer-aided design simulation. By using the grain boundary for hole storage, a higher sensing margin of 4.35 /μA//μm is achieved compared to that without using the grain boundary. Furthermore, the proposed device achieves a superior retention time of 555.77 /μs, which is reasonable from the viewpoint of its application in embedded systems (>100 /μs), even at a high temperature of 358 K. For higher device reliability, the effect of the grain boundary on the capacitorless one-transistor embedded dynamic random-access memory is analyzed with different trap distributions. The proposed capacitorless one-transistor embedded dynamic random-access memory cell exhibited superior reliability in terms of retention time (>100 /μs).


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