scholarly journals Wideband Rectangular Foldable and Non-foldable Antenna for Internet of Things Applications

2019 ◽  
Vol 2019 ◽  
pp. 1-5 ◽  
Author(s):  
Steve W. Y. Mung ◽  
Cheuk Yin Cheung ◽  
Ka Ming Wu ◽  
Joseph S. M. Yuen
Keyword(s):  
Internet Of Things ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Design Parameters ◽  
Multiple Frequency ◽  
Wireless Applications ◽  
Printed Circuit ◽  
Iot Applications ◽  
Trade Offs ◽  
The Cost

This article presents a simple wideband rectangular antenna in foldable and non-foldable (printed circuit board (PCB)) structures for Internet of Things (IoT) applications. Both are simple structures with two similar rectangular metal planes which cover multiple frequency bands such as GPS, WCDMA/LTE, and 2.4 GHz industrial, scientific, and medical (ISM) bands. This wideband antenna is suitable to integrate into the short- and long-range wireless applications such as the short-range 2.4 GHz ISM band and standard cellular bands. This lowers the overall size of the product as well as the cost in the applications. In this article, the configuration and operation principle are presented as well as its trade-offs on the design parameters. Simulated and experimental results of foldable and non-foldable (PCB) structures show that the antenna is suited for IoT applications.

scholarly journals Miniaturized Printed Inverted-F Antenna for Internet of Things: A Design on PCB with a Meandering Line and Shorting Strip

2018 ◽  
Vol 2018 ◽  
pp. 1-5 ◽  
Author(s):  
Cheuk Yin Cheung ◽  
Joseph S. M. Yuen ◽  
Steve W. Y. Mung
Keyword(s):  
Internet Of Things ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Ism Band ◽  
Printed Circuit ◽  
Iot Applications ◽  
Low Profile ◽  
Measurement Results

This paper focuses on a printed inverted-F antenna (PIFA) with meandering line and meandering shorting strip under 2.4 GHz industrial, scientific, and medical (ISM) band for Internet of things (IoT) applications. Bluetooth Low Energy (BLE) technology is one of potential platforms and technologies for IoT applications under ISM band. Printed circuit board (PCB) antenna commonly used in commercial and medical applications because of its small size, low profile, and low cost compared to low temperature cofired ceramic (LTCC) technology. The proposed structure of PIFA is implemented on PCB to gain all these advantages. Replacing conventional PCB line in PIFA by the meandering line and meandering shorting strip improves the efficiency of the PIFA as well as the bandwidth. As a case study, design and measurement results of the proposed PIFA are presented.

Dynamic Modeling of Tape Head Actuator Lateral Motion With Elastica Suspension

2011 ◽  
Author(s):  
Jen-Yuan James Chang
Keyword(s):  
Printed Circuit Board ◽  
High Capacity ◽  
Voice Coil Motor ◽  
Dynamic Effect ◽  
Magnetic Suspension ◽  
Circuit Board ◽  
Design Parameters ◽  
Lateral Motion ◽  
Printed Circuit ◽  
Flexible Printed Circuit

A combined elastica and magnetic modeling is presented in this paper with focus given to understanding effect of flexible printed circuit cable and voice coil motor’s dynamic effect on tape head actuator’s lateral motion in advanced, high capacity tape drives. The flexible printed circuit cable which connects the actuator to printed circuit board is first examined through establishment of analytical model to predict its profile with considerations of boundary conditions and mechanical design parameters. Secondly, equivalent stiffness produced by the flexible printed circuit cable when the linear tape head actuator is positioned along its lateral positions is examined. Finally, effect of tape head actuator’s voice coil motor is studied and modeled as a magnetic suspension, contributing to stability and controllability of the actuator lateral motion dynamics. Validated by calibrated laboratory experiments, the work presented in this paper can add to the literature regarding dynamics and control of LTM in modern LTO drives.

scholarly journals Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

2016 ◽  
Vol 20 (5) ◽  
pp. 1633-1647 ◽  
Author(s):  
Eric Monier-Vinard ◽  
Najib Laraqi ◽  
Cheikh Dia ◽  
Minh-Nhat Nguyen ◽  
Valentin Bissuel
Keyword(s):  
Analytical Model ◽  
Printed Circuit Board ◽  
Electronics Cooling ◽  
Circuit Board ◽  
Design Parameters ◽  
Board Structure ◽  
Printed Circuit ◽  
Fourier Series Method ◽  
Potential Gain ◽  
Local Modification

In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.

The Use of Polymer Thick Film for Making Printed Circuit Boards

1982 ◽  
Vol 1 (1) ◽  
pp. 22-23 ◽  
Author(s):  
F.W. Martin
Keyword(s):  
Thick Film ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Electronics Industry ◽  
Circuit Board ◽  
Technical Knowledge ◽  
Circuit Boards ◽  
Printed Circuit ◽  
The Cost

The electronics industry is facing a situation in which the cost of electronic functions is dropping continuously while the cost of interconnecting the functions by traditional means, especially through the use of printed circuit boards, continues to rise. Polymer thick film is one proven approach to reversing the trend of rising interconnection costs. It is relatively easy for the typical printed circuit board manufacturer to convert to or adapt polymer thick film because he has most of the necessary equipment, technical knowledge and personnel.

Reducing Material Waste Using Six Sigma in Printed Circuit Board Assembly

2007 ◽  
Author(s):  
Naji E. Gebara ◽  
Badih Jawad
Keyword(s):  
Six Sigma ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit Board Assembly ◽  
Printed Circuit ◽  
Circuit Board Assembly ◽  
Project Controlling ◽  
Key Steps ◽  
The Cost ◽  
And Control

Material waste in the Printed Circuit Board Assembly consist of parts and components that are purchased above and beyond what is required to complete a project. Controlling such material waste identified in this paper as Quantity Variance is in a direct relationship to minimizing the cost of variance that increases the profitability of each job in a low volume high mix production. This Quantity Variance occurs as defects at key steps of the manufacturing process. Six sigma is used to define, measure, analyze and control occurrences resulting in the need to purchase additional components for the completion of the order.

scholarly journals Design and Fabrication of Printed Circuit Board for IoT Applications

2021 ◽  
Vol 1916 (1) ◽  
pp. 012234
Author(s):  
K Ram Prasanna ◽  
R Seetharaman ◽  
H Mani Lakshmanan ◽  
G Karthik ◽  
K Anandan
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Iot Applications

Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
Wataru Nakayama
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Design Parameters ◽  
Internal Layers ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Covered Area ◽  
Bga Package ◽  
Cooling Air

An analytical model is developed to estimate the heat transfer performance of printed circuit board (PCBs). The PCB under study is the substrate for a ball-grid-array (BGA) package. Under the BGA, the PCB has a belt of densely populated through-vias that penetrate the laminate of horizontal copper and resin; outside the BGA-covered area the board is a copper/resin laminate and its surfaces are exposed to cooling air. Calculations are performed on a sample board having the dimensions 11×11 cm2 (footprint)×1.26 mm (thickness). The model of the board has two internal layers of continuous copper (0.03 mm thick) and through-vias under a 4.4×4.4 cm2 BGA package. The impacts of board design parameters on the temperature and the heat flow are presented; the parameters are the width of the insulation gap around the via, the area of copper coverage at the via bottom, and the population of vias.

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

2006 ◽  
Vol 128 (4) ◽  
pp. 449-455 ◽  
Author(s):  
Kun-Nan Chen
Keyword(s):  
Finite Element ◽  
Fundamental Frequency ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Element Model ◽  
Modal Testing ◽  
Circuit Board ◽  
Design Parameters ◽  
Printed Circuit ◽  
Design Variables

In the design of printed circuit boards (PCBs), it is preferable to increase their fundamental frequency so as to reduce the effects of the dynamic loading on them. The dynamic characteristics of a PCB carrying various electronic components and modules are most significantly affected by the geometrical and material properties of the bare board and by the boundary conditions supporting the loaded PCB. In this research, a PCB carrying a heavy CPU cooling fan and supported by six fastening screws is investigated by the modal testing and analyzed by the finite element method. After the finite element model of the PCB is verified by the experimental results, the locations of the six supporting screws are optimized to achieve a maximum fundamental frequency for the loaded PCB. The position of each fastening screw can be determined by two design variables, i.e., x and y coordinates. Two cases are studied: the symmetric case (six design parameters) with the symmetric constraint on the support locations imposed, and the asymmetric case (12 design parameters) without the constraint imposed. Finally, verification experiments are performed on the two PCBs supported by screws located at the optimal positions. Although relatively large differences between the calculated, optimized fundamental frequencies and the experimental values are observed, the experiments confirm a very significant improvement in frequency for both cases.

scholarly journals Compact planar ultrawideband MIMO antenna for wireless applications

2019 ◽  
Vol 8 (3) ◽  
pp. 243
Author(s):  
P. Pavithra ◽  
A. Sriram ◽  
K. Kalimuthu
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Single Chip ◽  
Electronic Components ◽  
Mimo Antenna ◽  
Mimo Antennas ◽  
Wireless Applications ◽  
Printed Circuit ◽  
Printed Monopole ◽  
Compact Planar

<p>A compact microstrip fed printed monopole MIMO antenna with ultrawideband (UWB) frequency response (S11&lt; -10 dB for 3.1-10.6 GHz) is proposed in this paper. The proposed antenna is miniaturized and has a high isolation of &gt; 23 dB between the ports compared to the existing UWB multiinput multi output (MIMO) antennas in the literature. The proposed antenna is built on FR4 substrate with thickness of 1.6 mm using all-digital single chip architecture and it is planar in geometry to be easily integrated with the other electronic components in the printed circuit board (PCB). The UWBMIMO antenna is analyzed using simulation and measurements and its performance is investigated. The antenna is extremely useful for low power short range communications and it provides high multipath immunity due  to diversity.</p>

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