A 6-Wire Plug and Play Clockless Distributed On-Chip-Sensor Network in 28 nm UTBB FD-SOI

2018 ◽  
Vol 14 (3) ◽  
pp. 404-413
Author(s):  
Marc Renaudin ◽  
Aymane Bouzafour ◽  
Sylvain Engels ◽  
Robin Wilson
Keyword(s):  
On Chip ◽  
Electronics ◽  
2021 ◽  
Vol 10 (1) ◽  
pp. 68
Author(s):  
Woorham Bae ◽  
Sung-Yong Cho ◽  
Deog-Kyoon Jeong

This paper presents a fully integrated Peripheral Component Interconnect (PCI) Express (PCIe) Gen4 physical layer (PHY) transmitter. The prototype chip is fabricated in a 28 nm low-power CMOS process, and the active area of the proposed transmitter is 0.23 mm2. To enable voltage scaling across wide operating rates from 2.5 Gb/s to 16 Gb/s, two on-chip supply regulators are included in the transmitter. At the same time, the regulators maintain the output impedance of the transmitter to meet the return loss specification of the PCIe, by including replica segments of the output driver and reference resistance in the regulator loop. A three-tap finite-impulse-response (FIR) equalization is implemented and, therefore, the transmitter provides more than 9.5 dB equalization which is required in the PCIe specification. At 16 Gb/s, the prototype chip achieves energy efficiency of 1.93 pJ/bit including all the interface, bias, and built-in self-test circuits.


Author(s):  
Xicheng Jiang ◽  
Narayan Prasad Ramachandran ◽  
Dae Woon Kang ◽  
Chee Kiong Chen ◽  
Mark Rutherford ◽  
...  

2020 ◽  
Vol 29 (10) ◽  
pp. 108504
Author(s):  
Wei-Tao Yang ◽  
Yong-Hong Li ◽  
Ya-Xin Guo ◽  
Hao-Yu Zhao ◽  
Yang Li ◽  
...  

Author(s):  
Xicheng Jiang ◽  
Xinyu Yu ◽  
Fang Lin ◽  
Felix Cheung ◽  
Mike Inerfield ◽  
...  

2013 ◽  
Vol 431 ◽  
pp. 318-324 ◽  
Author(s):  
Chau Chung Song ◽  
Chen Fu Feng ◽  
Chieh Yao Lin ◽  
Bo Hao Yan

In this paper, an application-layer networking system is analyzed and implemented for wireless sensor network. We focus on studying the binding connection methods on the applicationlayer network to implement the universal plug in/out capability on ZigBee networks. The proposed application-layer network provides a cluster-based and plug-and-play communication functions to dynamically and automatically connect in/out the ZigBee nodes on wireless sensor networks. Moreover, the network planning and connection mechanism is achieved by the Binding link objects of ZigBee application-layer functions. By means of Binding connection method, ZigBee nodes in sensor network can obtain the real-time messages and valid information each other. In this study, the various parameters setting and system firmware program are designed to analyze and evaluate the binding methods and data packets of application-layer communication for ZigBee network. Finally, the profile cluster IDs of application-layer network are applied to build up the specific ZigBee sensor systems with Cluster In/Out functions.


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