Preparation and Properties of Thermoplastic Polyamide-imide and Polyurea-amide-imide/Copper Foil Composites

2005 ◽  
Vol 13 (8) ◽  
pp. 777-794 ◽  
Author(s):  
Meng-Shun Huang ◽  
Ming-Chien Yang ◽  
Shen Chou
Keyword(s):  
Copper Foil ◽  
Chemical Resistance ◽  
Dissipation Factor ◽  
Peel Strength ◽  
Hot Press ◽  
Adhesive Properties ◽  
H Nmr ◽  
Chemical Structures ◽  
Tetracarboxylic Dianhydride ◽  
Strength Retention

Polyamide-imide (PAI) and polyurea-amide-imide (PUAI) resins were polymerized from five reactants: 4,4'-oxydianiline, 4-nitrobenzoyl chloride, 4,4'-diphenylmethane diisocyanate, 1,2,4,5-benzenetetracarboxylic dianhydride, and 3,3'-4,4'-benzophenone tetracarboxylic dianhydride. Their chemical structures were characterized using elemental analysis, FTIR and 1H NMR spectroscopy. Their thermal properties, adhesive properties, electrical properties, heat resistance, and chemical resistance were studied. The experimental results show that the glass transition temperatures of PAI and PUAI films occurred respectively at 360 °C and 229 °C, and the 10% weight loss occurred respectively at approximately 481 °C and 420 °C. The optimal hot-press conditions for PAI/copper foil (CU) composite were 380°C and 4.90 MPa, whereas those for PUAI/copper foil (CU) composites were 250 °C and 4.90 MPa. Values of the peel strength, dielectric constant, and dissipation factor were obtained and the peel strength was re-measured after a thermal stability test. The chemical resistance tests showed that the peel strength retention values of the PAI/CU and PUAI/CU composites were respectively more than 95% and more than 94% after immersing in 10% H2SO4 solution at 70 °C for 1 h.

Amide-containing Bismaleimide Resins and their Copper Foil Composite Materials

2005 ◽  
Vol 13 (1) ◽  
pp. 37-52
Author(s):  
Meng-Shun Huang ◽  
Ming-Chien Yang ◽  
Shen Chou
Keyword(s):  
Dielectric Constant ◽  
Copper Foil ◽  
Chemical Resistance ◽  
Dissipation Factor ◽  
Peel Strength ◽  
Aminobenzoic Acid ◽  
Hot Press ◽  
Trimellitic Anhydride ◽  
Chemical Structures ◽  
Bismaleimide Resins

Amide-containing bismaleimide (ACBI) resins were prepared using four monomeric reactants: 3,4'-oxydianiline (3,4'-ODA), trimellitic anhydride (TMA), maleic anhydride (MA), and 4-aminobenzoic acid. Their chemical structures were characterized using elemental analysis and FTIR. The peel strength, dielectric constant, dissipation factor, heat resistance, and chemical resistance were studied. The experimental results show that the optimal hot-press conditions for ACBI/copper foil laminates was 320 °C and 4.9 MPa. The ACBI laminates treating with 0.2% NZ97 coupling agent had the highest peel strength of 2.097 kN/m. The peel strength was 1.568 kN/m after 24 h at 300 °C. The 1 MHz dielectric constant of ACBI was 3.48, and the dissipation factor was 0.0082. After a hot/wet treatment (steam at 100 °C) for 72h, ACBI laminates maintained 76% of their original peel strength. After treating in 10% H2SO4 solution at 60°C for 30 minutes, ACBI laminates maintained 88% of their original peel strength.

Synthesis and Properties of Amide-containing Bisnadimide Copper Foil Composites

2003 ◽  
Vol 11 (3) ◽  
pp. 197-212 ◽  
Author(s):  
Shen Chou ◽  
Ker-Sen Lee
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Copper Foil ◽  
Chemical Resistance ◽  
Dissipation Factor ◽  
Peel Strength ◽  
Aminobenzoic Acid ◽  
Adhesive Properties ◽  
X Ray ◽  
Chemical Structures

Amide-containing bisnadimide (ACBI) resins were synthesized from nadic anhydride, 4-aminobenzoic acid, 4,4'-oxydianiline, and 4-nitro benzylchloride. The chemical structures were characterized using elemental analysis, FTIR and X-ray, and the thermal properties were determined using TGA. The adhesive properties of copper / ACBI composites were examined by SEM. The peel strength, heat resistance, chemical resistance, dielectric constant, and dissipation factor were measured and fund to be promising.

A Study of the Properties of PMR Polyimide Resin/Copper Foil Composites

2003 ◽  
Vol 11 (4) ◽  
pp. 327-339 ◽  
Author(s):  
Shen Chou ◽  
Ker-Sen Lee
Keyword(s):  
Dielectric Constant ◽  
Coupling Agent ◽  
Copper Foil ◽  
Room Temperature ◽  
Chemical Resistance ◽  
Dissipation Factor ◽  
Peel Strength ◽  
Tetracarboxylic Dianhydride ◽  
Composite Properties ◽  
Treatment Water

A PMR (polymerization of monomer reactants) polyimide resin was prepared from three monomer reactants: 5-norbornene-2,3'-dicarboxylic anhydride (NA),3,4'-oxydianiline(3,4'-ODA), and 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA). The polyimide resin and the copper foil were used to fabricate composites. Composite properties were tested for heat resistance and chemical resistance, and the dielectric constant and dissipation factor were also examined. After 24 h at 300oC the composites still had 73% retention of peel strength, the 1 MHz dielectric constant was 3.5, and the dissipation factor was 0.0160. After a hot/wet treatment (water at 50oC) for 72 h, the dielectric constant increased by 0.3%, while the dissipation factor increased by 33.9% from 0.0056 to 0.0075. After exposure to steam for 72 h, the polyimide laminates maintained 85% of their peel strength. A PEI resin laminate had a peel strength of only 872.2 N/m, but after a zirco-aluminate coupling agent surface treatment, a peel strength of 1519 N/m was obtained. The dielectric constant of the PEI resin was the lowest value (3.3678), and the dissipation factor was 0.0024. Commercialized epoxy resin laminate had a peel strength of 2450 N/m. At room temperature, the dielectric constant was 3.4793, and the dissipation factor was 0.0199.

A Study of Polyamide-imide Resin / Copper Foil Composite Materials

2003 ◽  
Vol 11 (1) ◽  
pp. 57-67 ◽  
Author(s):  
Shen Chou ◽  
Ker-Sen Lee
Keyword(s):  
Dielectric Constant ◽  
Composite Materials ◽  
Coupling Agent ◽  
Copper Foil ◽  
Chemical Resistance ◽  
Dissipation Factor ◽  
Peel Strength ◽  
Dielectric Constants ◽  
Aminobenzoic Acid ◽  
Pai 1

Polyamideimide resins were prepared using three monomeric reactants: 5-norbornene-2,3'dicarboxylic anhydride (NA), 4-aminobenzoic acid, and 3,4'-oxydianiline (3,4'-ODA). The characteristics of the resins were analyzed by FTIR and elemental analysis. The PAI / Copper composites were prepared at 320°C and a pressure of 30Kg/cm2 (2.9Mpa). The heat resistance, chemical resistance, dielectric constant and dissipation factor were studied. The experimental results show that the peel strength of the composites with no coupling agent was 1.69Kgf/cm (1657N/m) and with 0.6% LICA97 coupling agent was 2.27Kgf/cm (2225N/m) After 24h at 300°C, the dielectric constants of PAI.1 (0.6% LICA97) were 2.46 and 2.47 (1MHz), and their dissipation factors were 0.0101 and 0.0110. After immersian in 10% H2SO4 solution, the peel strength retentions of the laminates were greater than 90%.

scholarly journals Polyhedral oligomeric silsesquioxane (POSS)-modified phenolic resin: Synthesis and anti-oxidation properties

e-Polymers ◽  
2021 ◽  
Vol 21 (1) ◽  
pp. 316-326
Author(s):  
Bing Wang ◽  
Minxian Shi ◽  
Jie Ding ◽  
Zhixiong Huang
Keyword(s):  
Phenolic Resin ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Synthesis Process ◽  
H Nmr ◽  
Chemical Structures ◽  
Carbon Fiber Fabric ◽  
Oxidation Properties ◽  
Tg And Dtg ◽  
Oligomeric Silsesquioxane ◽  
Fiber Fabric

Abstract In this work, octamercapto polyhedral oligomeric silsesquioxane (POSS-8SH) and octaphenol polyhedral oligomeric silsesquioxane (POSS-8Phenol) were successfully synthetized. POSS-8Phenol was added into the synthesis process of liquid thermoset phenolic resin (PR) to obtain POSS-modified phenolic resin (POSS-PR). Chemical structures of POSS-8SH, POSS-8Phenol, and POSS-PR were confirmed by FTIR and 1H-NMR. TG and DTG analysis under different atmosphere showed that char yield of POSS-PR at 1,000°C increased from 58.6% to 65.2% in N2, which in air increased from 2.3% to 26.9% at 700°C. The maximum pyrolysis temperature in air increased from 543°C to 680°C, which meant better anti-oxidation properties. XRD results confirmed both POSS-8Phenol and POSS-PR-generated crystalline SiO2 in air, which could explain the improvement of anti-oxidation properties. SEM showed that the POSS-PR had phase separation during curing process. Finally, carbon fiber fabric-reinforced POSS-PR (C-POSS-PR) was prepared to verify the anti-oxidation properties of POSS-PR.

scholarly journals Synthesis, Characterization, and Antimicrobial Activity of Methyl-2-aminopyridine-4-carboxylate Derivatives

2013 ◽  
Vol 2013 ◽  
pp. 1-5 ◽  
Author(s):  
S. Nagashree ◽  
P. Mallu ◽  
L. Mallesha ◽  
S. Bindya
Keyword(s):  
Antimicrobial Activity ◽  
Spectral Studies ◽  
H Nmr ◽  
Chemical Structures ◽  
Elemental Analyses ◽  
Ft Ir

A series of methyl-2-aminopyridine-4-carboxylate derivatives,3a–f,were synthesized in order to determine theirin vitroantimicrobial activity. The chemical structures of the synthesized compounds were confirmed by elemental analyses, FT-IR, and1H NMR spectral studies. Among the synthesized compounds,3cand3dshowed good antimicrobial activity compared to other compounds in the series.

scholarly journals Synthesis and biological evaluation of 4-substituted aryl-piperazine derivatives of 1,7,8,9-tetrachloro-10,10-dimethoxy-4-azatricyclo [5.2.1.02,6] dec-8-ene-3,5-dione as anti-cancer and anti-angiogenesis agents

2020 ◽  
Author(s):  
Lifang Guo ◽  
Benshan Xu ◽  
Zirui Wan ◽  
Lulu Ren ◽  
Jie Zhang ◽  
...  
Keyword(s):  
Biological Evaluation ◽  
Cytotoxic Activities ◽  
H Nmr ◽  
Chemical Structures ◽  
Piperazine Derivatives ◽  
Anti Cancer ◽  
And Migration ◽  
Anti Tumor Activity ◽  
Synthesis And Biological Evaluation ◽  
Derivatives Of

Abstract Background: A series of aryl-piperazine derivatives of 1,7,8,9-tetrachloro-10,10-dimethoxy-4-azatricyclo [5.2.1.0 2,6 ] dec-8-ene-3,5-dione were synthesized. The chemical structures of the desired compounds were identified by 1 H NMR, ESI-MS and elementary analytical. The anti-cancer and anti-angiogenesis activities of the newly synthesized compounds were evaluated by proliferation and migration assays, respectively. Results: The screening results demonstrated that compounds 2 and 5 showed potent anti-tumor activity (IC 50 values ranging from 7.1 to 15.9μM) with low cytotoxic activities (IC 50 ＞ 79.3μM). Although compound 5 showed little effects on endothelia proliferation (IC 50 =65.3μM), it indeed significantly abrogated endothelia cell migration (IC 50 =6.7μM). Conclusions: This work may impart new direction for the investigations of aryl-piperazine derivatives and lead to the development of potent novel anti-tumor and anti-angiogenesis agents.

Fluorinated s-Triazinyl Piperazines as Antimicrobial Agents

2011 ◽  
Vol 66 (7-8) ◽  
pp. 345-352 ◽  
Author(s):  
Rahul V. Patel ◽  
Premlata Kumari ◽  
Kishor H. Chikhalia
Keyword(s):  
Antimicrobial Agents ◽  
Inhibitory Concentration ◽  
Salmonella Typhi ◽  
The Novel ◽  
Proteus Vulgaris ◽  
Aspergillus Clavatus ◽  
H Nmr ◽  
Chemical Structures ◽  
Triazine Derivatives ◽  
C Nmr

A series of 1,3,5-triazine derivatives that contain 4-amino-2-trifl uoromethyl-benzonitrile, 8-hydroxyquinoline, and different piperazines as substituents at the carbon atoms of the triazine ring have been synthesized by a simple and efficient synthetic protocol. The chemical structures of the compounds were elucidated with the aid of IR, 1H NMR and 13C NMR spectroscopy, and elemental analysis. The antimicrobial activity of the compounds was tested against seven bacteria (Staphylococcus aureus MTCC 96, Bacillus cereus MTCC 619, Escherichia coli MTCC 739, Pseudomonas aeruginosa MTCC 741, Klebsiella pneumoniae MTCC 109, Salmonella typhi MTCC 733, Proteus vulgaris MTCC 1771) and four fungi (Aspergillus niger MTCC 282, Aspergillus fumigatus MTCC 343, Aspergillus clavatus MTCC 1323, Candida albicans MTCC 183). The results indicate that some of the novel s-triazines have noteworthy activity in minimum inhibitory concentration as well as agar diffusion tests.

A Study on Adhesive Properties of a Damascene Electroplated Cu Composite Sheet

2011 ◽  
Vol 695 ◽  
pp. 577-580
Author(s):  
Hyung Kwon Moon ◽  
Seung Boo Jung ◽  
Je Sik Shin
Keyword(s):  
High Strength ◽  
Film Coating ◽  
Peel Strength ◽  
Alloy Sheet ◽  
Composite Sheet ◽  
Adhesive Properties ◽  
Thin Film Coating ◽  
Cu Alloy ◽  
Wedge Bonding ◽  
Interconnect Material

In this paper, it was aimed to develop a new interconnect material having high electrical conductivity and strength simultaneously. The Cu composite sheet, possessing mesh type Ag conduction paths on the surface of a high strength Cu alloy sheet, was manufactured by damascene electroplating. The peel strength of Cu composite sheet prepared by damascene electroplating increased by above 50 times compared to Cu composite sheet by conventional electroplating. Al wire wedge bonding was able to be successfully conducted without extra metal thin film coating.

scholarly journals Synthesis and Characterization of Polycarbonate Copolymers Containing Benzoyl Groups on the Side Chain for Scratch Resistance

2016 ◽  
Vol 2016 ◽  
pp. 1-6 ◽  
Author(s):  
Hohyoun Jang ◽  
Jaeseong Ha ◽  
Jiho Yoo ◽  
Jaeseung Pyo ◽  
Kunyoung Choi ◽  
...  
Keyword(s):  
Methylene Chloride ◽  
Water Drop ◽  
Scratch Resistance ◽  
Scanning Calorimetry ◽  
Force Microscopy ◽  
H Nmr ◽  
Chemical Structures ◽  
Atomic Force ◽  
Rearrangement Reaction ◽  
Surface Morphologies

The purpose of this study was to enhance the scratch resistance of polycarbonate copolymer by using 3,3′-dibenzoyl-4,4′-dihydroxybiphenyl (DBHP) monomer, containing benzoyl moieties on the ortho positions. DBHP monomer was synthesized from 4,4′-dihydroxybiphenyl and benzoyl chloride, followed by the Friedel-Craft rearrangement reaction with AlCl3. The polymerizations were conducted following the low-temperature procedure, which is carried out in methylene chloride by using triphosgene, triethylamine, bisphenol-A, and DBHP. The chemical structures of the polycarbonate copolymers were confirmed by1H-NMR. The thermal properties of copolymers were investigated by thermogravimetric analysis and differential scanning calorimetry, and also surface morphologies were assessed by atomic force microscopy. The scratch resistance of homopolymer film (100 μm) changed from 6B to 1B, and the contact angle of a sessile water drop onto the homopolymer film also increased.

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