Amide-containing Bismaleimide Resins and their Copper Foil Composite Materials

2005 ◽  
Vol 13 (1) ◽  
pp. 37-52
Author(s):  
Meng-Shun Huang ◽  
Ming-Chien Yang ◽  
Shen Chou
Keyword(s):  
Dielectric Constant ◽  
Copper Foil ◽  
Chemical Resistance ◽  
Dissipation Factor ◽  
Peel Strength ◽  
Aminobenzoic Acid ◽  
Hot Press ◽  
Trimellitic Anhydride ◽  
Chemical Structures ◽  
Bismaleimide Resins

Amide-containing bismaleimide (ACBI) resins were prepared using four monomeric reactants: 3,4'-oxydianiline (3,4'-ODA), trimellitic anhydride (TMA), maleic anhydride (MA), and 4-aminobenzoic acid. Their chemical structures were characterized using elemental analysis and FTIR. The peel strength, dielectric constant, dissipation factor, heat resistance, and chemical resistance were studied. The experimental results show that the optimal hot-press conditions for ACBI/copper foil laminates was 320 °C and 4.9 MPa. The ACBI laminates treating with 0.2% NZ97 coupling agent had the highest peel strength of 2.097 kN/m. The peel strength was 1.568 kN/m after 24 h at 300 °C. The 1 MHz dielectric constant of ACBI was 3.48, and the dissipation factor was 0.0082. After a hot/wet treatment (steam at 100 °C) for 72h, ACBI laminates maintained 76% of their original peel strength. After treating in 10% H2SO4 solution at 60°C for 30 minutes, ACBI laminates maintained 88% of their original peel strength.

Synthesis and Properties of Amide-containing Bisnadimide Copper Foil Composites

2003 ◽  
Vol 11 (3) ◽  
pp. 197-212 ◽  
Author(s):  
Shen Chou ◽  
Ker-Sen Lee
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Copper Foil ◽  
Chemical Resistance ◽  
Dissipation Factor ◽  
Peel Strength ◽  
Aminobenzoic Acid ◽  
Adhesive Properties ◽  
X Ray ◽  
Chemical Structures

Amide-containing bisnadimide (ACBI) resins were synthesized from nadic anhydride, 4-aminobenzoic acid, 4,4'-oxydianiline, and 4-nitro benzylchloride. The chemical structures were characterized using elemental analysis, FTIR and X-ray, and the thermal properties were determined using TGA. The adhesive properties of copper / ACBI composites were examined by SEM. The peel strength, heat resistance, chemical resistance, dielectric constant, and dissipation factor were measured and fund to be promising.

Preparation and Properties of Thermoplastic Polyamide-imide and Polyurea-amide-imide/Copper Foil Composites

2005 ◽  
Vol 13 (8) ◽  
pp. 777-794 ◽  
Author(s):  
Meng-Shun Huang ◽  
Ming-Chien Yang ◽  
Shen Chou
Keyword(s):  
Copper Foil ◽  
Chemical Resistance ◽  
Dissipation Factor ◽  
Peel Strength ◽  
Hot Press ◽  
Adhesive Properties ◽  
H Nmr ◽  
Chemical Structures ◽  
Tetracarboxylic Dianhydride ◽  
Strength Retention

Polyamide-imide (PAI) and polyurea-amide-imide (PUAI) resins were polymerized from five reactants: 4,4'-oxydianiline, 4-nitrobenzoyl chloride, 4,4'-diphenylmethane diisocyanate, 1,2,4,5-benzenetetracarboxylic dianhydride, and 3,3'-4,4'-benzophenone tetracarboxylic dianhydride. Their chemical structures were characterized using elemental analysis, FTIR and 1H NMR spectroscopy. Their thermal properties, adhesive properties, electrical properties, heat resistance, and chemical resistance were studied. The experimental results show that the glass transition temperatures of PAI and PUAI films occurred respectively at 360 °C and 229 °C, and the 10% weight loss occurred respectively at approximately 481 °C and 420 °C. The optimal hot-press conditions for PAI/copper foil (CU) composite were 380°C and 4.90 MPa, whereas those for PUAI/copper foil (CU) composites were 250 °C and 4.90 MPa. Values of the peel strength, dielectric constant, and dissipation factor were obtained and the peel strength was re-measured after a thermal stability test. The chemical resistance tests showed that the peel strength retention values of the PAI/CU and PUAI/CU composites were respectively more than 95% and more than 94% after immersing in 10% H2SO4 solution at 70 °C for 1 h.

A Study of Polyamide-imide Resin / Copper Foil Composite Materials

2003 ◽  
Vol 11 (1) ◽  
pp. 57-67 ◽  
Author(s):  
Shen Chou ◽  
Ker-Sen Lee
Keyword(s):  
Dielectric Constant ◽  
Composite Materials ◽  
Coupling Agent ◽  
Copper Foil ◽  
Chemical Resistance ◽  
Dissipation Factor ◽  
Peel Strength ◽  
Dielectric Constants ◽  
Aminobenzoic Acid ◽  
Pai 1

Polyamideimide resins were prepared using three monomeric reactants: 5-norbornene-2,3'dicarboxylic anhydride (NA), 4-aminobenzoic acid, and 3,4'-oxydianiline (3,4'-ODA). The characteristics of the resins were analyzed by FTIR and elemental analysis. The PAI / Copper composites were prepared at 320°C and a pressure of 30Kg/cm2 (2.9Mpa). The heat resistance, chemical resistance, dielectric constant and dissipation factor were studied. The experimental results show that the peel strength of the composites with no coupling agent was 1.69Kgf/cm (1657N/m) and with 0.6% LICA97 coupling agent was 2.27Kgf/cm (2225N/m) After 24h at 300°C, the dielectric constants of PAI.1 (0.6% LICA97) were 2.46 and 2.47 (1MHz), and their dissipation factors were 0.0101 and 0.0110. After immersian in 10% H2SO4 solution, the peel strength retentions of the laminates were greater than 90%.

A Study of the Properties of PMR Polyimide Resin/Copper Foil Composites

2003 ◽  
Vol 11 (4) ◽  
pp. 327-339 ◽  
Author(s):  
Shen Chou ◽  
Ker-Sen Lee
Keyword(s):  
Dielectric Constant ◽  
Coupling Agent ◽  
Copper Foil ◽  
Room Temperature ◽  
Chemical Resistance ◽  
Dissipation Factor ◽  
Peel Strength ◽  
Tetracarboxylic Dianhydride ◽  
Composite Properties ◽  
Treatment Water

A PMR (polymerization of monomer reactants) polyimide resin was prepared from three monomer reactants: 5-norbornene-2,3'-dicarboxylic anhydride (NA),3,4'-oxydianiline(3,4'-ODA), and 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA). The polyimide resin and the copper foil were used to fabricate composites. Composite properties were tested for heat resistance and chemical resistance, and the dielectric constant and dissipation factor were also examined. After 24 h at 300oC the composites still had 73% retention of peel strength, the 1 MHz dielectric constant was 3.5, and the dissipation factor was 0.0160. After a hot/wet treatment (water at 50oC) for 72 h, the dielectric constant increased by 0.3%, while the dissipation factor increased by 33.9% from 0.0056 to 0.0075. After exposure to steam for 72 h, the polyimide laminates maintained 85% of their peel strength. A PEI resin laminate had a peel strength of only 872.2 N/m, but after a zirco-aluminate coupling agent surface treatment, a peel strength of 1519 N/m was obtained. The dielectric constant of the PEI resin was the lowest value (3.3678), and the dissipation factor was 0.0024. Commercialized epoxy resin laminate had a peel strength of 2450 N/m. At room temperature, the dielectric constant was 3.4793, and the dissipation factor was 0.0199.

Low Dielectric Constant Materials for IC Intermetal Dielectric Applications: A Status Report on the Leading Candidates

1996 ◽  
Vol 443 ◽  
Author(s):  
Neil H. Hendricks
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Process Integration ◽  
Electrical Performance ◽  
Low Dielectric Constant ◽  
Status Report ◽  
Structure Property ◽  
Chemical Structures ◽  
Low Dielectric ◽  
Low Dielectric Constant Materials

AbstractFor over two years, intensive efforts at SEMATECH and elsewhere have focused on identifying low dielectric constant (low ε) materials which possess all of the required properties and processing characteristics needed for integration into standard IC fabrication lines. To date, no material candidate has been shown to satisfy this impressive list of requirements. For some candidates, drawbacks related to material properties such as poor thermal stability or electrical performance have been identified; in other cases, problems in process integration, for example difficulties in patterning have stalled progress.In this paper, most of the current leading candidates for the low ε IC IMC application are identified and discussed. An attempt is made to correlate structure/property relationships in these materials with their relative attributes and deficiencies as they relate to the IMD application. Key differences in chemistry and property/processing characteristics are contrasted for low c silicon-oxygen polymers and for purely organic polymers. Novel dielectrics such as porous organic and inorganic thin films are also discussed in terms of their properties and associated process integration challenges. Since the needs for global planarization and low c IMD are occurring within roughly the same generation of minimum feature size (˜ 0.25 μm), the chemical mechanical polishing (CMP) of low dielectric constant thin films and/or of SiO2 layers deposited above them is briefly discussed. Both subtractive metalization and damascene processes are included, and the required low dielectric constant film properties and processing characteristics are contrasted for each process. Finally, the author's views on future trends in low dielectric constant materials development are presented, with an emphasis on identifying the types of chemical structures which may prove viable for this most demanding of all polymer film applications.

Investigation of the Properties of Alumina-Zirconia Ceramics

2014 ◽  
Vol 1040 ◽  
pp. 245-249
Author(s):  
Aleksander S. Ivashutenko ◽  
Alexandr V. Kabyshev ◽  
Nikita Martyushev ◽  
Igor G. Vidayev
Keyword(s):  
Dielectric Constant ◽  
Electric Conductivity ◽  
High Temperatures ◽  
Electrostatic Field ◽  
Mechanical Characteristics ◽  
Ferroelectric Properties ◽  
Dissipation Factor ◽  
Zirconia Ceramics ◽  
Measurement Results ◽  
Dielectric Dissipation Factor

The article focuses on the investigation of the properties of alumina-zirconia ceramics possessing high mechanical characteristics and good conductivity at high temperatures. Measurement results of the dielectric dissipation factor, dielectric constant, electric conductivity when using direct and alternating current for the ceramics samples of 80%(ZrO2-3%Y2O3)-20% Al2O3 composition are presented in the paper. Measurements were conducted simultaneously in the electrostatic field in vacuum while heating the samples to the temperatures ranging from 300 to 1700K. Investigations showed that alumina-zirconia ceramics at high temperatures obtains ferroelectric properties not typical of these structures.

scholarly journals The effects of additive on microstructure and electrical properties of batio3 ceramics

2004 ◽  
Vol 1 (3) ◽  
pp. 89-98 ◽  
Author(s):  
Vesna Paunovic ◽  
Ljiljana Zivkovic ◽  
Ljubomir Vracar ◽  
Vojislav Mitic ◽  
Miroslav Miljkovic
Keyword(s):  
Dielectric Constant ◽  
Curie Temperature ◽  
Room Temperature ◽  
Low Frequency ◽  
Dissipation Factor ◽  
The Other ◽  
Uniform Microstructure ◽  
Average Grain Size ◽  
Solid State Sintering ◽  
Curie Temperatures

In this paper comparative investigations of microstructure and dielectric properties of BaTiO3 ceramics doped with 1.0 wt% of Nb2O5, MnCO3 and CaZrO3 have been done. BaTiO3 samples were prepared using conventional method of solid state sintering at 13000C for two hours. Two distinguish micro structural regions can be observed in sample doped with Nb2O5. The first one, with a very small grained microstructure and the other one, with a rod like grains. In MnCO3 and CaZrO3 doped ceramics the uniform microstructure is formed with average grain size about 0.5- 2?m and 3-5?m respectively. The highest value of dielectric permittivity at room temperature and the greatest change of permittivity in function of temperature were observed in MnCO3/BaTiO3. In all investigated samples dielectric constant after initially large value at low frequency attains a constant value at f = 6kHz. A dissipation factor is independent of frequency greater than 10 kHz and, depending of systems, lies in the range from 0.035 to 0.25. At temperatures above Curie temperatures, the permittivity of all investigated samples follows a Curie- Weiss law. A slight shift of Curie temperature to the lower temperatures, in respect of Curie temperature for undoped BaTiO3, was observed in all investigated samples.

scholarly journals Electrical Dielectric Authorship of Polyvinyl-Acetate and Toluene Diisocyanate (PVA-TDI) with Manufactured Sulfonated Phenol-formaldehyde (SPF) Viscous Mass Material Composite

2017 ◽  
Vol 14 (2) ◽  
pp. 418-426
Author(s):  
Baghdad Science Journal
Keyword(s):  
Dielectric Constant ◽  
Dielectric Loss ◽  
Polyvinyl Acetate ◽  
Phenol Formaldehyde ◽  
Dissipation Factor ◽  
Toluene Diisocyanate ◽  
Total Conductivity ◽  
Viscous Mass ◽  
The Fourier Transform ◽  
Quality Factor Q

The electrical insulation of the manufacture sulfonated phenol-formaldehyde viscous material (product) has been studied with Polyvinyl-acetate (PVA) and toluene diisocyanate (TDI) blend has been prepared by fixing percentage by weight 3:1 and mixed with different percentages by weight of the product sulfonated phenol formaldehyde viscous mass (SPF). The Fourier transform infrared (FTIR) spectroscopy is done on (SPF) resin powder and prepared film of PVA-TDI-SPF viscous mass. The quality factor (Q), dissipation factor (D), parallel resistance (Rp), series resistance (Rs), parallel capacitance (Cp), series capacitance (Cs) and phase shift (?) are measured. The calculated maximum dielectric constant (??) is 3.49x107 at sample (1) wt.1% SPF viscous mass to the weight of (PVA-TDI), the minimum dielectric constant is 1.12x106 at sample (3) wt.3% of SPF viscous mass to PVA-TDI weight. The maximum dielectric loss factor (??) is 3.68x107 at sample (1) and the minimum dielectric loss is 2.04x106 for sample (3). The maximum conductance is 1.06x10-4 S at sample (1) and minimum conductance is 6.64x10-6 at sample (3). The maximum frequency dependent ac. conductivity (?ac) is 2.048 S m-1 for sample (1) and the minimum is 0.113 S m-1 at sample (3). The maximum total conductivity (?t) is 126.2 S m-1 for sample (1) and minimum (?t) is 1.129 S m-1 for sample (3). The maximum independent conductivity (?dc) is 124 S m-1 for sample (1) and minimum value is 1.015 S m-1 for sample (3). The maximum capacitive reactance (Xs) is 0.83 M? at sample (5) wt.5% SPF viscous mass to PVA-TDI weight and the minimum is 0.14 M? for sample (3).

Effect the Ratio and Particle Size of Glass Powder from Fluorescent Tubes Waste on Electrical Properties of PVA-Glass Composites

2021 ◽  
Vol 19 (10) ◽  
pp. 106-114
Author(s):  
Hani M Hussien
Keyword(s):  
Electrical Conductivity ◽  
Particle Size ◽  
Dielectric Constant ◽  
Glass Powder ◽  
Dissipation Factor ◽  
Powder Particle Size ◽  
Casting Method ◽  
Glass Composites ◽  
Mixing Ratios ◽  
Solution Casting Method

The polymer composites used in the present study were made of polyvinyl alcohol (PVA) as a matrix and glass powder as a filler. The glass powder was obtained from fluorescent tubes waste. The solution casting method was used to fabricate PVA/glass powder composite. Three groups of samples were prepared. The first was prepared by using PVA with the addition of glass powder (sieved less than 20 μm) in proportions 10, 20, 30, 40, and 50 %. The second: the mixing ratios of PVA and glass powder were 80% and 20%, respectively. The third: The mixing ratios of PVA and glass powder were 60% and 40%, respectively. In Both previous groups, the added glass powder used was sieved with sizes less than 20, 45, 105, and 125 μm. For all samples, the following properties were measured at room temperature: DC electrical conductivity, dielectric constant, electrical conductivity, and dissipation factor. The last three properties were measured with a range of frequencies from 1kHz to 5MHz. DC conductivity increases with increasing of glass powder. It was found that the highest conductivity values are for samples composed of glass powder with a particle size of less than 45 μm for both ratios of glass 20% and 40%. It is also noticed that within most frequencies, the sample with 30% glass has the largest dissipation factor. At 20% filler of glass powder, it is noted that the highest values of the dielectric constant are for samples composed of glass powder with a particle size of less than 45 μm and 125 μm. Below 1 MHz, the effect of glass powder particle size on the AC conductivity is minimal. It is found that the samples containing glass powder (less than 125 μm and 105 μm), have similar and lowest dissipation factor. At 40% filler of glass powder, it is noted that the lowest values of the dielectric constant are for samples composed of glass powder with a particle size little than 105 μm.

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