Dynamic performance for piezoelectric bi-materials with an interfacial crack near an eccentric elliptical hole under anti-plane shearing

2021 ◽  
pp. 108128652110149
Author(s):  
Ni An ◽  
Tianshu Song ◽  
Gangling Hou
Keyword(s):  
Stress Concentration ◽  
Dynamic Performance ◽  
Crack Problem ◽  
Interfacial Crack ◽  
Elliptical Hole ◽  
Mapping Method ◽  
Dynamic Stress Intensity Factors ◽  
Interfacial Cracks ◽  
Conformal Mapping Method ◽  
Plane Shearing

The purpose of this paper is to evaluate the stress concentration at the tip of a permeable interfacial crack near an eccentric elliptical hole in piezoelectric bi-materials under anti-plane shearing. Fracture analysis is performed by Green’s function method and the conformal mapping method, which are used to solve the boundary conditions problem. The mechanical model of the interfacial crack is constructed by interface-conjunction and crack-deviation techniques so that the crack problem is simplified as solving a series of the first kind of Fredholm’s integral equations, from which the dynamic stress intensity factors (DSIFs) at the inner and the outer crack-tips can be derived. The validity of the present method is verified by comparing with a crack emerging from the edge of a circular hole as a reference. Numerical cases reveal parametric dependence of DSIFs on the geometry of eccentric elliptical holes and interfacial cracks, the characteristics of the incident wave, the equivalent piezoelectric elastic modulus and piezoelectric parameters. The results illustrate that the eccentric distance has a great effect on the stress concentration at the crack tip, which may be harmful to the normal service of piezoelectric devices and materials. In addition, the method proposed in this paper can also deal with non-eccentric problems and has wider applicability.

Dynamic Performance Analysis of Interfacial Cracks Near an Eccentric Elliptical Hole in Piezoelectric Bi-Materials Under Incident SH-Waves

2020 ◽  
Author(s):  
Ni An ◽  
Tian-shu Song ◽  
Ming Zhao ◽  
Yu Liu ◽  
Gangling Hou
Keyword(s):  
Piezoelectric Materials ◽  
Dynamic Stress Intensity Factor ◽  
Modern Science ◽  
Elliptical Hole ◽  
Mapping Method ◽  
Wave Number ◽  
Mechanical Coupling ◽  
Interfacial Cracks ◽  
The Impact ◽  
Dynamic Performance Analysis

Abstract Piezoelectric materials have been widely used in modern science and technology due to their electro-mechanical coupling response. Sometimes, because of the stiff and brittle nature of some piezoelectric materials, the piezoelectric devices with defects may face fracture or failure during their service procedures. Therefore, it has become important to investigate the failure behaviors caused by defects, such as cracks and holes. Based on the study of the dynamic anti-plane characteristics for radial crack emanating from a circular cavity in piezoelectric bi-materials, this paper aims to analyzes the dynamic incident anti-plane shearing (SH-wave) in piezoelectric bi-materials, which contains two interfacial cracks, near an eccentric elliptical hole. Green’s function method, the conformal mapping method, the interface conjunction techniques and the crack-deviation techniques are utilized to obtain a series of first kind Fredholm’s equations, based on which the dynamic stress intensity factor (DSIF) at the outer and the inner cracks’ tips are theoretically expressed. Numerical examples were graphically presented to illustrate the effects of the piezoelectric parameter, the effective piezoelectric elastic modulus, the dimensionless incident wave number and geometric parameters on the DSIF at both of the tips. Previous studies are not comprehensive, especially when the center of the hole deviates from the interface. Therefore, the impact of eccentric distance on DSIF is considered in this paper. The solution of this problem provides a more accurate and efficient method for the investigation of dynamic fracture properties of piezoelectric materials and has an important theoretical significance in engineering design.

Collinear and Periodic Electrode-Ceramic Interfacial Cracks in Piezoelectric Bimaterials

2004 ◽  
Vol 71 (4) ◽  
pp. 486-492 ◽  
Author(s):  
Christoph Ha¨usler ◽  
Cun-Fa Gao ◽  
Herbert Balke
Keyword(s):  
Mixed Boundary ◽  
Piezoelectric Materials ◽  
Crack Problem ◽  
Interfacial Crack ◽  
Mixed Boundary Conditions ◽  
Interfacial Cracks ◽  
Field Intensity Factors ◽  
Work Done ◽  
Electric Loads ◽  
Relevant Work

Field singularities of collinear and collinear periodic interface cracks between an electrode and a piezoelectric matrix are studied in terms of the Stroh formalism for mixed boundary conditions. In contrast to the relevant work done previously on this subject, the problem is solved based on the assumption that the upper and lower planes embedding the electrode consist of two arbitrary piezoelectric materials, and the cracks are assumed to be permeable. The problem is reduced to an interfacial crack problem equivalent to that in purely elastic media. Explicit expressions are presented for the complex potentials and field intensity factors. All the field variables exhibit oscillatory singularities, and their intensities are dependent on the material properties and the applied mechanical loads, but not on the applied electric loads.

Dynamic Performance at Inner Tip of an Interfacial Crack near a Circular Cavity in Piezoelectric Bi-Materials

2014 ◽  
Vol 665 ◽  
pp. 30-36
Author(s):  
Tian Shu Song ◽  
Ahmed Hassan
Keyword(s):  
Dynamic Performance ◽  
Interfacial Crack ◽  
Transversely Isotropic ◽  
Physical Parameters ◽  
Circular Cavity ◽  
Dynamic Stress Intensity Factors ◽  
Language Program ◽  
Simulation Techniques ◽  
Fortran Language ◽  
Piezoelectric Devices

In transversely isotropic piezoelectric bi-materials, a theoretical analysis is followed to calculate the dynamic stress intensity factors (DSIFs) due to existence of a permeable interfacial crack, near the edge of a circular cavity. The model is subjected to dynamic incident anti-plane shearing (SH-wave) and Green's function method is the base of formulation. Conjunction and crack-simulation techniques are applied to obtain DSIFs at the crack’s inner tip. Calculations are prepared based on FORTRAN language program. For calibration of program, a comparison is accomplished between the present model and another with a crack emerging from the cavity edge. Calculating results clarified the influences of the physical parameters, the structural geometry and the wave frequencies on the dimensionless DSIFs and how those affected the efficiency of piezoelectric devices and materials.

The Model for Calculation the Hall Effect Parameter

2004 ◽  
Vol 9 (2) ◽  
pp. 129-138
Author(s):  
J. Kleiza ◽  
V. Kleiza
Keyword(s):  
Magnetic Field ◽  
Field Effect ◽  
Magnetic Field Effect ◽  
Mapping Method ◽  
Sample Thickness ◽  
System Of Nonlinear Equations ◽  
Specific Resistivity ◽  
Conformal Mapping Method ◽  
Effect Parameter ◽  
The Magnetic Field

A method for calculating the values of specific resistivity ρ as well as the product µHB of the Hall mobility and magnetic induction on a conductive sample of an arbitrary geometric configuration with two arbitrary fitted current electrodes of nonzero length and has been proposed an grounded. During the experiment, under the constant value U of voltage and in the absence of the magnetic field effect (B = 0) on the sample, the current intensities I(0), IE(0) are measured as well as the mentioned parameters under the effect of magnetic fields B1, B2 (B1 ≠ B2), i.e.: IE(β(i)), I(β(i)), i = 1, 2. It has been proved that under the constant difference of potentials U and sample thickness d, the parameters I(0), IE(0) and IE(β(i)), I(β(i)), i = 1, 2 uniquely determines the values of the product µHB and specific resistivity ρ of the sample. Basing on the conformal mapping method and Hall’s tensor properties, a relation (a system of nonlinear equations) between the above mentioned quantities has been found.

scholarly journals Stress analysis of infinite laminated composite plate with elliptical cutout under different in plane loadings in hygrothermal environment

2021 ◽  
Vol 8 (1) ◽  
pp. 1-12
Author(s):  
Ashok Magar ◽  
Achchhe Lal
Keyword(s):  
Stress Concentration ◽  
Stress Distribution ◽  
Composite Plate ◽  
Volume Fraction ◽  
Elliptical Hole ◽  
Laminated Composite ◽  
Laminated Composite Plate ◽  
Concentration Changes ◽  
Hygrothermal Environment ◽  
Plate Analysis

Abstract This paper presents the solution of stress distribution around elliptical cutout in an infinite laminated composite plate. Analysis is done for in plane loading under hygrothermal environment. The formulation to obtain stresses around elliptical hole is based on Muskhelishvili’s complex variable method. The effect of fibre angle, type of in plane loading, volume fraction of fibre, change in temperature, fibre materials, stacking sequence and environmental conditions on stress distribution around elliptical hole is presented. The study revealed, these factors have significant effect on stress concentration in hygrothermal environment and stress concentration changes are significant with change in temperature.

A conformal-mapping method for predicting the thermal properties of U-shaped borehole heat-exchangers

Geothermics ◽  
2014 ◽  
Vol 50 ◽  
pp. 66-75 ◽  
Author(s):  
Nai-Wen Liang ◽  
Ching-Hsien Lai ◽  
Chien-Yeh Hsu ◽  
Yuan-Ching Chiang ◽  
Chih-Chung Chang ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Conformal Mapping ◽  
Heat Exchangers ◽  
Mapping Method ◽  
Conformal Mapping Method ◽  
Borehole Heat Exchangers

Dynamic Anti-Plane Characteristics at Outer Tip of an Interfacial Crack near a Circular Cavity in Piezoelectric Bi-Materials

2014 ◽  
Vol 684 ◽  
pp. 88-93
Author(s):  
Tian Shu Song ◽  
Ahmed Hassan
Keyword(s):  
Present Model ◽  
Interfacial Crack ◽  
Transversely Isotropic ◽  
Physical Parameters ◽  
Circular Cavity ◽  
Dynamic Stress Intensity Factors ◽  
Language Program ◽  
Simulation Techniques ◽  
Fortran Language ◽  
Piezoelectric Devices

A theoretical analysis is followed to calculate the dynamic stress intensity factors (DSIFs) in transversely isotropic piezoelectric bi-materials, due to existence of a permeable interfacial crack, near the edge of a circular cavity. The model is subjected to dynamic incident anti-plane shearing (SH-wave) and the formulation based on Green's function method. Conjunction and crack-simulation techniques are applied to obtain DSIFs at the crack’s outer tip. Calculations are prepared based on FORTRAN language program. A comparison is accomplished between the present model and another model with a crack emerging from the cavity edge to calibrate the program. Calculating results showed the influences of the physical parameters, the structural geometry and the wave frequencies on the dimensionless DSIFs and how those affected the efficiency of piezoelectric devices and materials.

Sign in / Sign up

Export Citation Format

Share Document