scholarly journals Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect

2019 ◽  
Vol 14 (1) ◽  
Author(s):  
Wenkun Xie ◽  
Fengzhou Fang
Keyword(s):  
Material Removal ◽  
Chip Thickness ◽  
Atomic Layer ◽  
Atomic Scale ◽  
Removal Mechanism ◽  
Minimum Chip Thickness ◽  
Layer Removal ◽  
Edge Radius ◽  
Mechanical Cutting ◽  
Cutting Model

AbstractThe ultimate objective of mechanical cutting is to down minimum chip thickness to single atomic layer. In this study, the cutting-based single atomic layer removal mechanism on monocrystalline copper is investigated by a series of molecular dynamics analysis. The research findings report that when cutting depth decreases to atomic scale, minimum chip thickness could be down to single atomic layer by mechanical cutting using rounded edge tool. The material removal behaviour during cutting-based single atomic layer removal exhibits four characteristics, including chip formation by shearing-stress driven dislocation motion, elastic deformation on the processed surface, atomic sizing effect, and cutting-edge radius effect. Based on this understanding, a new cutting model is proposed to study the material removal behaviour in cutting-based single atomic layer removal process, significantly different from those for nanocutting and conventional cutting. The outcomes provide theoretical support for the research and development of the atomic and close-to-atomic scale manufacturing technology.

Investigation of effect of uncut chip thickness to edge radius ratio on nanoscale cutting behavior of single crystal copper: MD simulation approach

2020 ◽  
pp. 251659842093763
Author(s):  
A. Sharma ◽  
P. Ranjan ◽  
R. Balasubramaniam
Keyword(s):  
Molecular Dynamics ◽  
Single Crystal ◽  
Material Removal ◽  
Chip Thickness ◽  
Cutting Process ◽  
Uncut Chip Thickness ◽  
Edge Radius ◽  
Nanoscale Cutting ◽  
Cutting Behavior ◽  
Subsurface Defects

Extremely small cutting depths in nanoscale cutting makes it very difficult to measure the thermodynamic properties and understand the underlying mechanism and behavior of workpiece material. Highly precise single-crystal Cu is popularly employed in optical and electronics industries. This study, therefore, implements the molecular dynamics technique to analyze the cutting behavior and surface and subsurface phenomenon in the nanoscale cutting of copper workpieces with a diamond tool. Molecular dynamics simulation is carried out for different ratios of uncut chip thickness ( a) to cutting edge radius ( r) to investigate material removal mechanism, cutting forces, surface and subsurface defects, material removal rate (MRR), and stresses involved during the nanoscale cutting process. Calculation of forces and amount of plowing indicate that a/ r = 0.5 is the critical ratio for which the average values of both increase to maximum. Material deformation mechanism changes from shear slip to shear zone deformation and then to plowing and elastic rubbing as the cutting depth/uncut chip thickness is reduced. The deformation during nano-cutting in terms of dislocation density changes with respect to cutting time. During the cutting process, it is observed that various subsurface defects like point defects, dislocations and dislocation loops, stacking faults, and stair-rod dislocation take place.

An Analytical Model for the Prediction of Minimum Chip Thickness in Micromachining

2005 ◽  
Vol 128 (2) ◽  
pp. 474-481 ◽  
Author(s):  
X. Liu ◽  
R. E. DeVor ◽  
S. G. Kapoor
Keyword(s):  
Analytical Model ◽  
Chip Thickness ◽  
Machining Process ◽  
Thickness Effect ◽  
Uncut Chip Thickness ◽  
Minimum Chip Thickness ◽  
Tool Edge Radius ◽  
Edge Radius ◽  
Tool Edge ◽  
Cutting Velocity

In micromachining, the uncut chip thickness is comparable or even less than the tool edge radius and as a result a chip will not be generated if the uncut chip thickness is less than a critical value, viz., the minimum chip thickness. The minimum chip thickness effect significantly affects machining process performance in terms of cutting forces, tool wear, surface integrity, process stability, etc. In this paper, an analytical model has been developed to predict the minimum chip thickness values, which are critical for the process model development and process planning and optimization. The model accounts for the effects of thermal softening and strain hardening on the minimum chip thickness. The influence of cutting velocity and tool edge radius on the minimum chip thickness has been taken into account. The model has been experimentally validated with 1040 steel and Al6082-T6 over a range of cutting velocities and tool edge radii. The developed model has then been applied to investigate the effects of cutting velocity and edge radius on the normalized minimum chip thickness for various carbon steels with different carbon contents and Al6082-T6.

A Multiscale Cutting Model Based on the Theory of Gradient Plasticity

2013 ◽  
Vol 698 ◽  
pp. 99-106
Author(s):  
Tarek Mabrouki ◽  
Jean François Rigal ◽  
Muhammad Asad
Keyword(s):  
Size Effect ◽  
Scale Effect ◽  
Material Removal ◽  
Cutting Tool ◽  
Chip Thickness ◽  
Gradient Plasticity ◽  
Model Based ◽  
Cutting Model ◽  
Orthogonal Case

The present paper highlights the importance of size effect consideration during the modelling of material removal by cutting tool, especially when passing from maco-to-micro scales. For that, the presented study concerns an orthogonal case of down-cut milling where the chip thickness is evolving. Consequently, to capture the scale effect when passing from macro to micro dimensions, the theory of gradient plasticity were adopted.

Experimental Investigation of Material Removal Mechanism in Grinding of Alumina by Single Grain Scratch Test

2013 ◽  
Vol 797 ◽  
pp. 96-102 ◽  
Author(s):  
Taghi Tawakoli ◽  
H. Kitzig ◽  
R. D. Lohner
Keyword(s):  
Material Removal ◽  
High Performance ◽  
Great Influence ◽  
Cutting Speed ◽  
Chip Thickness ◽  
Scratch Test ◽  
Ultrasonic Vibrations ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Pile Up

Alumina is a material that is frequently used in high performance applications. Grinding of alumina is usually associated with micro-cracks which deteriorate surface quality. In order to get a deeper knowledge of the characteristics of material removal mechanisms in alumina during grinding with and without ultrasonic vibration of the workpiece, single grit scratch tests were performed in this research. The effect of the ultrasonic vibrations and cutting speed on the material removal mechanism of alumina was investigated in the chip thickness range of 0.53 μm which is common in precision grinding operations. It was shown that the material pile-up decrease with higher cutting speed. On the other hand, the transition from ductile to brittle mode of material removal occurs earlier in higher cutting speeds. The ultrasonic vibrations showed great influence in the cutting speed 30 m/s in reducing the pile-up values.

Force and Energy in Grinding Zirconia Ceramics by Brazed Monolayered Diamond Wheels

2011 ◽  
Vol 487 ◽  
pp. 80-83
Author(s):  
Shu Sheng Li ◽  
Jiu Hua Xu ◽  
Y.C. Fu ◽  
H.J. Xu
Keyword(s):  
Material Removal ◽  
Chip Thickness ◽  
Ground Surface ◽  
Morphological Features ◽  
Removal Mechanism ◽  
Zirconia Ceramics ◽  
Grinding Forces ◽  
Thickness Change ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms

An investigation was undertaken to explore the grinding energy and removal mechanisms in grinding zirconia by using brazed diamond wheels. The grinding forces were measured and the morphological features of ground workpiece surfaces were examined. The results indicate that material removal mechanisms are dominated by the combined removal modes of brittle and ductile. The prevailing removal mechanism for the ground surface of zirconia changes from brittle to ductile when the maximum chip thickness change from large to small.

scholarly journals Atomic and Close-to-Atomic Scale Manufacturing: A Review on Atomic Layer Removal Methods Using Atomic Force Microscopy

2020 ◽  
Vol 3 (3) ◽  
pp. 167-186 ◽  
Author(s):  
Paven Thomas Mathew ◽  
Brian J. Rodriguez ◽  
Fengzhou Fang
Keyword(s):  
Atomic Force Microscopy ◽  
Semiconductor Industry ◽  
Atomic Layer ◽  
Atomic Scale ◽  
Small Scale ◽  
Electronic Components ◽  
Force Microscopy ◽  
Layer Removal ◽  
Atomic Force ◽  
Mechanical Methods

Abstract Manufacturing at the atomic scale is the next generation of the industrial revolution. Atomic and close-to-atomic scale manufacturing (ACSM) helps to achieve this. Atomic force microscopy (AFM) is a promising method for this purpose since an instrument to machine at this small scale has not yet been developed. As the need for increasing the number of electronic components inside an integrated circuit chip is emerging in the present-day scenario, methods should be adopted to reduce the size of connections inside the chip. This can be achieved using molecules. However, connecting molecules with the electrodes and then to the external world is challenging. Foundations must be laid to make this possible for the future. Atomic layer removal, down to one atom, can be employed for this purpose. Presently, theoretical works are being performed extensively to study the interactions happening at the molecule–electrode junction, and how electronic transport is affected by the functionality and robustness of the system. These theoretical studies can be verified experimentally only if nano electrodes are fabricated. Silicon is widely used in the semiconductor industry to fabricate electronic components. Likewise, carbon-based materials such as highly oriented pyrolytic graphite, gold, and silicon carbide find applications in the electronic device manufacturing sector. Hence, ACSM of these materials should be developed intensively. This paper presents a review on the state-of-the-art research performed on material removal at the atomic scale by electrochemical and mechanical methods of the mentioned materials using AFM and provides a roadmap to achieve effective mass production of these devices.

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