Process Characterization

Author(s):  
James Seely
Author(s):  
Erika Schutte ◽  
Jack Martin

Abstract An ellipsometry based measurement protocol was developed to evaluate changes to MEMS sensor surfaces which may occur during packaging using unpatterned test samples. This package-level technique has been used to measure the 0-20 Angstrom thin films that can form or deposit on die during the packaging process for a variety of packaging processing conditions. Correlations with device performance shows this to be a useful tool for packaged MEMS device and process characterization.


Author(s):  
Daniel Cavasin ◽  
Abdullah Yassine

Abstract Bond pad metal corrosion was observed during assembly process characterization of a 0.13um Cu microprocessor device. The bond pad consisted of 12kÅ of Al-0.5%Cu atop 9kÅ of Cu, separated by a thin Ta diffusion barrier. The corrosion was first noted after the wafer dicing process. Analysis of the pad surface revealed pitting-type corrosion, consistent with published reports of classic galvanic cell reactions between Al2Cu (theta phase) particles and the surrounding Al pad metal. Analysis of the bond pads on samelot wafers which had not been diced showed higher-thanexpected incidence of hillock and pit hole defects on the Al surface. Statistically designed experiments were formulated to investigate the possibility that the observed pre-saw pad metal defects act as nucleation sites for galvanic corrosion during the sawing process. Analyses of the experimental samples were conducted using optical and scanning electron microscopy, along with focused ion beam deprocessing and energy dispersive X-ray. This paper explores the relationship between the presence of these pre-existing defects and the propensity for the bond pads to corrode during the dicing process, and reviews the conditions under which pit hole defects are formed during the final stages of the Cu-metallized wafer fabrication process. Indications are that strict control of wafer fab backend processes can reduce or eliminate the incidence of such defects, resulting in elimination of bond pad corrosion in the wafer dicing process.


2001 ◽  
Author(s):  
Terry Dyer ◽  
Ian J. Doohan ◽  
Martin Fallon ◽  
Dave McAlpine ◽  
Adam Aitkenhead ◽  
...  

Fuel ◽  
2021 ◽  
pp. 122670
Author(s):  
Yuebing Zhang ◽  
Quangui Li ◽  
Qianting Hu ◽  
Cheng Zhai ◽  
Mingyang Song ◽  
...  

Author(s):  
David Adeniji ◽  
Julius Schoop

Abstract The chief objective of manufacturing process improvement efforts is to significantly minimize process resources such as time, cost, waste, and consumed energy while improving product quality and process productivity. This paper presents a novel physics-informed optimization approach based on artificial intelligence (AI) to generate digital process twins (DPTs). The utility of the DPT approach is demonstrated for the case of finish machining of aerospace components made from gamma titanium aluminide alloy (γ-TiAl). This particular component has been plagued with persistent quality defects, including surface and sub-surface cracks, which adversely affect resource efficiency. Previous process improvement efforts have been restricted to anecdotal post-mortem investigation and empirical modeling, which fail to address the fundamental issue of how and when cracks occur during cutting. In this work, the integration of insitu process characterization with modular physics-based models is presented, and machine learning algorithms are used to create a DPT capable of reducing environmental and energy impacts while significantly increasing yield and profitability. Based on the preliminary results presented here, an improvement in the overall embodied energy efficiency of over 84%, 93% in process queuing time, 2% in scrap cost, and 93% in queuing cost has been realized for γ-TiAl machining using our novel approach.


Author(s):  
Wayne Cai ◽  
Glenn Daehn ◽  
Anupam Vivek ◽  
Jingjing Li ◽  
Haris Khan ◽  
...  

This paper aims at providing a state-of-the-art review of an increasingly important class of joining technologies called solid-state welding. Among many other advantages such as low heat input, solid-state processes are particularly suitable for dissimilar materials joining. In this paper, major solid-state joining technologies such as the linear and rotary friction welding, friction stir welding, ultrasonic welding, impact welding, are reviewed, as well as diffusion and roll bonding. For each technology, the joining process is first depicted, followed by the process characterization, modeling and simulation, monitoring/diagnostics/NDE, and ended with concluding remarks. A discussion section is provided after reviewing all the technologies on the common critical factors that affect the solid-state processes such as the joining mechanisms, chemical and materials compatibility, surface properties, and process conditions. Finally, the future outlook is presented.


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