Passive Component Switching Circuits

2020 ◽  
pp. 151-163
Author(s):  
Steve Moore
1976 ◽  
Author(s):  
R. CHAPMAN ◽  
J. ROOTSEY ◽  
I. POLIDI ◽  
W. DAVISON
Keyword(s):  

1998 ◽  
Vol 63 (7) ◽  
pp. 1012-1020 ◽  
Author(s):  
Antonín Lyčka ◽  
Josef Jirman ◽  
Alois Koloničný

The 15N, 13C, and 1H NMR spectra were measured for azo and hydrazo compounds derived from 1,3,3-trimethyl-2-methylidene-2,3-dihydroindole (Fischer base), which is a passive component with a terminal methylidene group. Products prepared by coupling in hydrochloric acid exist in the corresponding hydrazone form as the E-isomers. Neutralization gives a mixture of two isomeric azo compounds which differ in the arrangement at the C(2)=C(10) double bond. This mixture was alkylated with methyl iodide to obtain the =N-N(CH3)- hydrazone derivatives. The geometric isomers were resolved based on the NOESY approach and the stereospecific behaviour of the 2J(15N,13C) coupling constants was studied for the 15N-labelled compounds.


2021 ◽  
Vol 60 (7) ◽  
pp. 3313-3313
Author(s):  
Xiewei Xiong ◽  
Mingshu Xiao ◽  
Wei Lai ◽  
Li Li ◽  
Chunhai Fan ◽  
...  

2007 ◽  
Vol 16 (04) ◽  
pp. 507-516 ◽  
Author(s):  
SHAHRAM MINAEI ◽  
ERKAN YUCE

In this paper, a universal current-mode second-order active-C filter for simultaneously realizing low-pass, band-pass and high-pass responses is proposed. The presented filter employs only three plus-type second-generation current-controlled conveyors (CCCII+s). This filter needs no critical active and passive component matching conditions and no additional active and passive elements for realizing high output impedance low-pass, band-pass and high-pass characteristics. The angular resonance frequency (ω0) and quality factor (Q) of the proposed resistorless filter can be tuned electronically. To verify the theoretical analysis and to exhibit the performance of the proposed filter, it is simulated with SPICE program.


2010 ◽  
Vol 443 ◽  
pp. 543-548
Author(s):  
Jian Long Kuo ◽  
Kai Lun Chao ◽  
Chun Cheng Kuo

Because the solder residue was found in the manufacturing process which greatly affected the product quality, the purpose of this paper was to make the product quality improved and to find an optimal solution for process parameters in the flip chip process. The experimental testing was based on SMT manufacturing process. The amount and size of solder left on passive component in the process of manufacturing were considered as the quality traits. Since too many solders left on the passive component side during flux cleaning process, it was possible that the balling would be flowed into the chip, which caused the bump short in the chip and affected the quality of the product. In this paper, orthogonal array by using Taguchi method is adopted as the effective experimental method with the least experimental runs. Also, based on the quality evaluation of signal-to-noise ratio, the ANOVA is used to evaluate the effects of quality target according to the experimental results. The results reveal that the optimization in the process is confirmed. Therefore, this study can effectively improve the solder residue in semiconductor manufacturing process.


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