Large-Area Electronic Systems

2012 ◽  
pp. 145-155
Keyword(s):  
Electronic Systems ◽  
Large Area

Toward Manufacturing Low-Cost, Large-Area Electronics

MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 471-475 ◽  
Author(s):  
Marc Chason ◽  
Daniel R. Gamota ◽  
Paul W. Brazis ◽  
Krishna Kalyanasundaram ◽  
Jie Zhang ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Consumer Products ◽  
Electronic Systems ◽  
Printed Wiring Board ◽  
Large Area ◽  
Active Devices ◽  
Materials Research ◽  
Wiring Board ◽  
Large Area Electronics

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

scholarly journals Breathable, large-area epidermal electronic systems for recording electromyographic activity during operant conditioning of H-reflex

2020 ◽  
Vol 165 ◽  
pp. 112404 ◽  
Author(s):  
Young-Tae Kwon ◽  
James J.S. Norton ◽  
Andrew Cutrone ◽  
Hyo-Ryoung Lim ◽  
Shinjae Kwon ◽  
...  
Keyword(s):  
Operant Conditioning ◽  
H Reflex ◽  
Electronic Systems ◽  
Electromyographic Activity ◽  
Large Area

18-2: Oxide TFT LC Oscillators on Glass and Plastic for Wireless Functions in Large-Area Flexible Electronic Systems

2016 ◽  
Vol 47 (1) ◽  
pp. 207-210 ◽  
Author(s):  
Yasmin Afsar ◽  
Jenny Tang ◽  
Warren Rieutort-Louis ◽  
Liechao Huang ◽  
Yingzhe Hu ◽  
...  
Keyword(s):  
Electronic Systems ◽  
Large Area ◽  
Oxide Tft ◽  
Flexible Electronic ◽  
Lc Oscillators

(Keynote) Machine Learning and High-Speed Circuitry in Thin Film Transistors for Sensor Interfacing in Hybrid Large-Area Electronic Systems

2019 ◽  
Vol 92 (4) ◽  
pp. 121-134
Author(s):  
James Sturm ◽  
Yoni Mehlman ◽  
Levent E. Aygun ◽  
Can Wu ◽  
Z Zheng ◽  
...  
Keyword(s):  
Thin Film ◽  
Machine Learning ◽  
Thin Film Transistors ◽  
High Speed ◽  
Electronic Systems ◽  
Large Area

scholarly journals Electric Field Assisted Self-Healing of Open Circuits with Conductive Particle-Insulating Fluid Dispersions: Optimizing Dispersion Concentration

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Virendra Parab ◽  
Oppili Prasad ◽  
Sreelal Pillai ◽  
Sanjiv Sambandan
Keyword(s):  
Electric Field ◽  
Flexible Electronics ◽  
Image Sensor ◽  
Electronic Systems ◽  
Self Healing ◽  
Wearable Electronics ◽  
Large Area ◽  
Open Faults ◽  
The Impact ◽  
Conductive Particles

AbstractOpen circuit faults in electronic systems are a common failure mechanism, particularly in large area electronic systems such as display and image sensor arrays, flexible electronics and wearable electronics. To address this problem several methods to self heal open faults in real time have been investigated. One approach of interest to this work is the electric field assisted self-healing (eFASH) of open faults. eFASH uses a low concentration dispersion of conductive particles in an insulating fluid that is packaged over the interconnect. The electric field appearing in the open fault in a current carrying interconnect polarizes the conductive particles and chains them up to create a heal. This work studies the impact of dispersion concentration on the heal time, heal impedance and cross-talk when eFASH is used for self-healing. Theoretical predictions are supported by experimental evidence and an optimum dispersion concentration for effective self-healing is identified.

Large Area Printing of Organic Transistors via a High Throughput Dry Process

2002 ◽  
Vol 736 ◽  
Author(s):  
Graciela B. Blanchet ◽  
Yueh-Lin Loo ◽  
J. A. Rogers ◽  
F. Gao ◽  
C. R. Fincher
Keyword(s):  
High Speed ◽  
Electrical Performance ◽  
Organic Transistors ◽  
Electronic Systems ◽  
Large Area ◽  
Additive Process ◽  
Organic Electronic ◽  
Dry Process ◽  
Thermal Transfer ◽  
Expected Benefits

Organic electronic systems offer the advantage of low weight and flexibility at potentially lower cost. Although the fabrication of functioning plastic transistors using approaches such as ink jet, lithography and stamping has been described i1–3, chemically compatible materials that allow for the sequential application of liquid layers is a technical barrier. Material issues maybe the Achilles heel of ultimately printing organic electronic devices as newspapers today, at high speeds and in a reel to reel process. We introduce a novel process–thermal transfer–a non-lithographic technique that enables printing multiple, successive layers via a dry additive process. This method is capable of patterning a range of organic materials at high speed over large areas with micron size resolution and excellent electrical performance. Such a dry, potentially reel-to-reel printing method may provide a practical route to realizing the expected benefits of plastics for electronics. We illustrate the viability of thermal transfer and the ability to develop suitable printable organics conductors by fabricating a functioning 4000 cm2 transistor array.

Cured Shapes and Snap-Through Loads Analysis of Bi-Stable Polyimide Film Hybrid Composite Laminates

2016 ◽  
Author(s):  
Jianqiang Hu ◽  
Fuhong Dai
Keyword(s):  
Flexible Electronics ◽  
Hybrid Composite ◽  
Composite Laminates ◽  
Chemical Properties ◽  
Polyimide Film ◽  
Electronic Systems ◽  
Large Area ◽  
Element Analysis ◽  
Loads Analysis ◽  
Functional Components

Bi-stable composite laminates have potential in application on conformal, morphing and deployable structures due to their bi-stable, load-bearing, deformable and conformal characteristics. To expand their applications in multifunctional structures, other functional components (such as flexible sensors networks, flexible antennas and other large-area flexible electronic systems) are required to integrate into the bi-stable composite laminates. Polyimide (PI) film usually serves as the substrate of flexible electronics due to its excellent mechanical, thermal and chemical properties. In this study, the cured shapes and snap-through loads of the bi-stable polyimide film hybrid composite laminates are numerically and experimentally studied. The lay-ups of the bi-stable polyimide film hybrid composite laminate are [PI/02/902], [02/PI/902], [02/902/PI], [PI/02/902/PI], [PI/02/PI/902/PI], respectively. The results from the finite element analysis are compared with the experimental ones and show good agreements.

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