1853 A New Technique for the Adhesive Strength Evaluation of Copper Thin Film Wirings on Polyimide Films
2005 ◽
Vol 2005.6
(0)
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pp. 283-284
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1988 ◽
Vol 3
(5)
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pp. 931-942
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Keyword(s):
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1988 ◽
Vol 6
(3)
◽
pp. 1756-1758
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1987 ◽
Vol 5
(4)
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pp. 1760-1761
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2020 ◽
Vol 2020
(0)
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pp. J04209
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