Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films

1988 ◽  
Vol 3 (5) ◽  
pp. 931-942 ◽  
Author(s):  
T. P. Weihs ◽  
S. Hong ◽  
J. C. Bravman ◽  
W. D. Nix
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Single Layer ◽  
Beam Theory ◽  
New Technique ◽  
Young’S Moduli ◽  
Silicon Micromachining ◽  
A New Technique

The mechanical deflection of cantilever microbeams is presented as a new technique for testing the mechanical properties of thin films. Single-layer microbeams of Au and SiO2 have been fabricated using conventional silicon micromachining techniques. Typical thickness, width, and length dimensions of the beams are 1.0,20, and 30 μm, respectively. The beams are mechanically deflected by a Nanoindenter, a submicron indentation instrument that continuously monitors load and deflection. Using simple beam theory and the load-deflection data, the Young's moduli and the yield strengths of thin-film materials that comprise the beams are determined. The measured mechanical properties are compared to those obtained by indenting similar thin films supported by their substrate.

A new technique for measuring the mechanical properties of thin films

1997 ◽  
Vol 6 (3) ◽  
pp. 193-199 ◽  
Author(s):  
W.N. Sharpe ◽  
B. Yuan ◽  
R.L. Edwards
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
New Technique ◽  
A New Technique

Real-Time and Full-Field Deflection Measurement of Thin Films Electroplated on the Single Crystal Silicon Wafers

2006 ◽  
Vol 306-308 ◽  
pp. 1289-1294
Author(s):  
Xi De Li ◽  
Cheng Wei
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Single Crystal ◽  
Sample Size ◽  
Real Time ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Full Field ◽  
Young’S Moduli

A special speckle microinterferometer has been developed to test the mechanical properties of thin films electroplated on the single crystal silicon wafer. A piezo-actuated micro-loading unit is synchronized with the microinterfermeter to measure thin film deflection in bending with an accuracy of sub-micrometers. All of the film specimens were microfabricated to be the type of microbridge samples. They are made of Cu and NiFe, the sizes from 1102.9µm to 213.7µm long, 491.0µm to 9.7µm wide. The corresponding thicknesses are 9.4µm and 7.6µm, respectively. Deflections of the microbradge samples can be measured full-field and real-time by using the microinterferometer and no patterning or marking of the specimen surface is needed. The loading force is directly measured using a miniature load cell. The Young’s moduli are calculated for both material and sample size from the load-deflection curves. Test techniques, procedures and factors which affect on the deflection measurements are briefly presented along with detailed analyzes of the results.

Numerical study on the measurement of thin film mechanical properties by means of nanoindentation

2001 ◽  
Vol 16 (10) ◽  
pp. 2974-2982 ◽  
Author(s):  
Xi Chen ◽  
Joost J. Vlassak
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Finite Element Method ◽  
Finite Element ◽  
Numerical Study ◽  
Substrate Effect ◽  
The Finite Element Method ◽  
Effect Factor ◽  
A New Technique

Nanoindentation is a technique commonly used for measuring thin film mechanical properties such as hardness and stiffness. In this study, we used the finite element method to investigate the effect of substrate and pileup on hardness and stiffness measurements of thin film systems. We define a substrate effect factor and construct a map that may be useful in the interpretation of indentation measurements when it is not possible to make indentations shallow enough to avoid the influence of the substrate on the measurements. A new technique for measuring mechanical properties of thin films by nanoindentation is suggested at the end of this article.

A new technique for testing the impact load of thin films: the coating impact test

1992 ◽  
pp. 102-107 ◽  
Author(s):  
O. Knotek ◽  
B. Bosserhoff ◽  
A. Schrey ◽  
T. Leyendecker ◽  
O. Lemmer ◽  
...  
Keyword(s):  
Thin Films ◽  
Impact Test ◽  
Impact Load ◽  
New Technique ◽  
A New Technique ◽  
The Impact

A new technique for characterization of pore structures in materials—application to the study of hydroxyapatite thin films

1998 ◽  
Vol 37 (4-5) ◽  
pp. 211-214
Author(s):  
C.M. Lopatin ◽  
T.L. Alford ◽  
V.B. Pizziconi ◽  
T. Laursen
Keyword(s):  
Thin Films ◽  
New Technique ◽  
Pore Structures ◽  
A New Technique

Deposition energy dependence in cluster-assembled thin film densities

2005 ◽  
Vol 908 ◽  
Author(s):  
Kristoffer Meinander ◽  
Tina Clauss ◽  
Kai Nordlund
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Molecular Dynamics ◽  
Energy Dependence ◽  
Computer Simulations ◽  
Cluster Atom ◽  
Cu Nanoclusters ◽  
Deposition Energy

AbstractMechanical properties of thin films grown by nanocluster deposition are highly dependent on the energy at which the clusters are deposited. Using molecular dynamics computer simulations we have quantitatively studied variations in the properties of copper thin films grown by deposition of Cu nanoclusters, at energies ranging from 5 meV to 10 eV per cluster atom, on a Cu (100) substrate.

Mechanical Properties and Wear Resistance of High Moment thin Film Head Materials

1994 ◽  
Vol 356 ◽  
Author(s):  
H. Deng ◽  
V. R. Inturi ◽  
J. A. Barnard
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Wear Resistance ◽  
Magnetic Thin Films ◽  
Mechanical And Tribological Properties ◽  
Sputtered Films ◽  
Recording Heads ◽  
High Density Recording ◽  
Worn Surface

AbstractMechanical and tribological properties of soft magnetic thin films with high permeability and low coercivity are very important for the application of these films in high-density recording heads. This paper reports our experimental observations on these important properties of FeTaN thin film head materials. Hardness(H) and Young’s modulus(E) for FeTaN sputtered films were determined by nanoindentation. Wear resistance of these films against commercial magnetic tapes was measured with a sphere-on-flat wear tester. The experimental results indicate that the FeTa films can be hardened when nitrogen is introduced. It was found in this study that the thermal stability of the mechanical properties such as hardness of thin films containing nitrogen is better than that of the film without nitrogen. However, our experiments also revealed that the wear resistance of FeTaN films decreases when the concentration of nitrogen increases and the hardness of the worn surface at a wear scar is lower than that of the unworn surface.

Characterization of Mechanical Properties of Thin Films by Nanoindentation Technique and Finite Element Simulation

2002 ◽  
Author(s):  
Zhaohui Shan ◽  
Suresh K. Sitaraman
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Finite Element ◽  
Strain Hardening Exponent ◽  
Plastic Properties ◽  
Titanium Thin Film ◽  
Nanoindentation Technique ◽  
Element Simulation ◽  
Titanium Thin Films

Titanium thin films have been widely used in microelectronics due to their good adhesion to substrates, such as Silicon wafer and Quartz. However, mechanical behavior of Titanium thin films has not been well characterized. This paper presents a methodology that combines the nanoindentation technique and finite element modeling to characterize the mechanical (elastic and plastic) properties of thin film with its application on Titanium thin film deposited on silicon substrate. The results show that the elastic properties (Young’s modulus) of the Titanium thin film does not change much from the bulk Titanium, and the plastic properties (yield stress and strain hardening exponent) of the Titanium thin film are higher than those of bulk Titanium. This method is also applicable for the study of mechanical properties of other thin films and small volume materials.

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