532 Effect of adding porous Cu interlayer into Sn-Ag-Cu lead-free solder joint on microstructure and tensile strength
2013 ◽
Vol 2013.21
(0)
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pp. _532-1_-_532-3_
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2016 ◽
Vol 46
(3)
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pp. 1674-1682
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2007 ◽
Vol 345-346
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pp. 1393-1396
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2015 ◽
Vol 830-831
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pp. 265-269
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2012 ◽
Vol 622-623
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pp. 195-199
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