Wafer-scale high-density edge coupling for high throughput testing of silicon photonics

2018 ◽  
Author(s):  
Robert Polster ◽  
Liang Yuan Dai ◽  
Oscar A. Jimenez ◽  
Qixiang Cheng ◽  
Michal Lipson ◽  
...  
Keyword(s):  
High Throughput ◽  
Silicon Photonics ◽  
High Density ◽  
Wafer Scale

High-Throughput Screening and Characterization of a High-Density Soybean Mutant Library Elucidate the Biosynthesis Pathway of Triterpenoid Saponins

2019 ◽  
Vol 60 (5) ◽  
pp. 1082-1097 ◽  
Author(s):  
Panneerselvam Krishnamurthy ◽  
Yukiko Fujisawa ◽  
Yuya Takahashi ◽  
Hanako Abe ◽  
Kentaro Yamane ◽  
...  
Keyword(s):  
High Throughput ◽  
High Throughput Screening ◽  
High Density ◽  
Biosynthesis Pathway ◽  
Mutant Library ◽  
Triterpenoid Saponins

Si Photonics Deployment Using Cu Pillar Interconnect and Chip On Wafer Platform

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001663-001681
Author(s):  
Miguel Jimarez
Keyword(s):  
Light Source ◽  
Silicon Photonics ◽  
High Speed ◽  
High Sensitivity ◽  
Optical Path ◽  
Clock Recovery ◽  
Wafer Scale ◽  
Si Photonics ◽  
Cu Pillar ◽  
Fine Pitch

We introduce a high-speed 4x25Gbps, MSA-compliant, QSFP transceiver built on a Silicon Photonics platform. The transceiver integrates high sensitivity receivers, CTLE, clock recovery, modulator drivers and BIST on a TSMC 28nm die connected to the photonic die thru a fine pitch (50um) Copper Pillar interface. A wafer-scale approach, Chip on Wafer, CoW, is used to assemble the electronic die and the light source on to the photonic die, so that the full optical path can be tested, at speed, in loopback configuration in wafer form, using a standard ATE solution. This presentation focuses on the CoW assembly development aspects of the transceiver. Wafer probe and bump, die processing services, CoW assembly and Back End of Line, BEOL, Test Services will be presented.

scholarly journals Chinese Fir Breeding in the High-Throughput Sequencing Era: Insights from SNPs

Forests ◽  
2019 ◽  
Vol 10 (8) ◽  
pp. 681 ◽  
Author(s):  
Huiquan Zheng ◽  
Dehuo Hu ◽  
Ruping Wei ◽  
Shu Yan ◽  
Runhui Wang
Keyword(s):  
Population Structure ◽  
Genetic Structure ◽  
High Throughput ◽  
High Throughput Sequencing ◽  
Breeding Population ◽  
Population Diversity ◽  
Chinese Fir ◽  
High Density ◽  
Population Structure Analysis ◽  
Snp Panel

Knowledge on population diversity and structure is of fundamental importance for conifer breeding programs. In this study, we concentrated on the development and application of high-density single nucleotide polymorphism (SNP) markers through a high-throughput sequencing technique termed as specific-locus amplified fragment sequencing (SLAF-seq) for the economically important conifer tree species, Chinese fir (Cunninghamia lanceolata). Based on the SLAF-seq, we successfully established a high-density SNP panel consisting of 108,753 genomic SNPs from Chinese fir. This SNP panel facilitated us in gaining insight into the genetic base of the Chinese fir advance breeding population with 221 genotypes for its genetic variation, relationship and diversity, and population structure status. Overall, the present population appears to have considerable genetic variability. Most (94.15%) of the variability was attributed to the genetic differentiation of genotypes, very limited (5.85%) variation occurred on the population (sub-origin set) level. Correspondingly, low FST (0.0285–0.0990) values were seen for the sub-origin sets. When viewing the genetic structure of the population regardless of its sub-origin set feature, the present SNP data opened a new population picture where the advanced Chinese fir breeding population could be divided into four genetic sets, as evidenced by phylogenetic tree and population structure analysis results, albeit some difference in membership of the corresponding set (cluster vs. group). It also suggested that all the genetic sets were admixed clades revealing a complex relationship of the genotypes of this population. With a step wise pruning procedure, we captured a core collection (core 0.650) harboring 143 genotypes that maintains all the allele, diversity, and specific genetic structure of the whole population. This generalist core is valuable for the Chinese fir advanced breeding program and further genetic/genomic studies.

scholarly journals New developments in high-throughput resequencing and variation detection using high density microarrays

2002 ◽  
Vol 19 (4) ◽  
pp. 402-409 ◽  
Author(s):  
Janet A. Warrington ◽  
Nila A. Shah ◽  
Xiyin Chen ◽  
Michael Janis ◽  
Chunmei Liu ◽  
...  
Keyword(s):  
High Throughput ◽  
High Density ◽  
New Developments

Shadow Edge Lithography and Application to Nanofluidics

2010 ◽  
Author(s):  
Woon-Hong Yeo ◽  
Dong Won Lee ◽  
Kyong-Hoon Lee ◽  
Jae-Hyun Chung
Keyword(s):  
Fuel Cells ◽  
High Resolution ◽  
High Throughput ◽  
Single Molecule ◽  
Chemical Sensors ◽  
Geometric Distribution ◽  
High Vacuum ◽  
Vacuum Evaporation ◽  
Wafer Scale ◽  
Nanoscale Patterns

Many upcoming applications, such as nanoelectronic circuitry, single-molecule based chips, nanofluidics, chemical sensors, and fuel cells, require large arrays of nanochannels and nanowires. To commercialize such nanostructured devices, a high resolution and high throughput patterning method is essential. For this purpose, we developed the shadow edge lithography (SEL) as a wafer-scale, high-throughput nanomanufacturing method [1]. In the proposed method, the shadow effect in the high-vacuum evaporation was theoretically analyzed to predict the geometric distribution of the nanoscale patterns [2]. In experiment, nanoscale patterns were created by the shadow of aluminum (Al) edges that were prepatterned using a conventional microfabrication method.

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