Analytical and experimental investigations into material removal mechanism of abrasive jet precision finishing with grinding wheel as restraint

2012 ◽  
Vol 12 (3) ◽  
pp. 266 ◽  
Author(s):  
Changhe Li ◽  
Zhanrui Liu ◽  
Yali Hou ◽  
Yucheng Ding
Keyword(s):  
Material Removal ◽  
Experimental Investigations ◽  
Grinding Wheel ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Precision Finishing

Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)

2008 ◽  
Vol 389-390 ◽  
pp. 459-464 ◽  
Author(s):  
Dong Ming Guo ◽  
Y.B. Tian ◽  
Ren Ke Kang ◽  
Li Bo Zhou ◽  
M.K. Lei
Keyword(s):  
Electron Microscope ◽  
Cross Section ◽  
Material Removal ◽  
Process Model ◽  
Grinding Wheel ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Mechanical Grinding ◽  
Study Results ◽  
Si Wafer

An innovative fixed abrasive grinding process of chemo-mechanical grinding (CMG) by using soft abrasive grinding wheel (SAGW) has been recently proposed to achieve a damage-free ground workpiece surface. The basic principle, ideas and characteristics of CMG with SAGW are briefly introduced in this paper. The CMG experiments using newly developed SAGW for Si wafer are conducted at the condition of dry grinding. The grinding performances are evaluated and analyzed in terms of surface roughness, surface topography and surface/subsurface damage of ground wafer by use of Zygo interferometer, Scan Introduction ning Electron Microscope (SEM) and Cross-section Transmission Electron Microscope (Cross-section TEM). The component of product of ground Si surface is studied by X-ray Photoelectron Spectroscopy (XPS) to verify chemical reaction between the abrasive / additives of grinding wheel and Si wafer. The CMG process model by using SAGW is developed to understand the material removal mechanism and generation principle of damage-free surface. The study results show that the material removal mechanism of CMG by using SAGW can be explained as a hybrid process of chemical and mechanical action.

scholarly journals Experimental Research on Material Removal Mechanism and Grinding Force of FeCoNiCrMo0.1 High Entropy Alloy (HEA)

2021 ◽  
Author(s):  
Ruchu Xu ◽  
Xuelong Wen ◽  
Yadong Gong ◽  
Xingchen Yu
Keyword(s):  
Material Removal ◽  
Grinding Force ◽  
Grinding Wheel ◽  
High Entropy Alloy ◽  
Force Model ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Grinding Forces ◽  
High Entropy ◽  
Cbn Grinding Wheel

Abstract High entropy alloy (HEA) is an advanced alloy material, which has a wide application prospect due to its excellent properties. However, the material removal mechanism and change rule of grinding force of HEA in the grinding process have seldom been studied. The main work of this paper is that the material removal mechanism of the FeCoNiCrMo0.1 HEA is obtained by analyzing grinding debris and subsurface microstructure after grinding, the theoretical grinding force model of HEAs in plane grinding process is established on the basis of the force of a single abrasive grain, and the experimental verification is performed. According to the experimental results, the influences of different grinding parameters on grinding force are discussed, the influences of different types of grinding wheels on grinding force are analyzed, and the grinding forces generated by grinding different FeCoNiCr HEAs are compared. The results indicate that the material removal mechanism of FeCoNiCrMo0.1 HEA is the plastic removal. With the increase of grinding speed and the decrease of grinding depth and feed speed, both normal and tangential grinding forces decrease. Under the same grinding parameters, the grinding force produced by electroplated CBN grinding wheel is greater, followed by resin-bonded CBN grinding wheel and vitrified CBN grinding wheel. The grinding force produced by grinding FeCoNiCrAl0.1 HEA is lower than that produced by grinding FeCoNiCrMo0.1 HEA under the same grinding conditions. The calculated value of grinding force model is consistent with the experimental value, which can scientifically reflect the variation law of HEA grinding force.

A Study on Residual Stresses in Machined Brittle Material

2016 ◽  
Vol 1136 ◽  
pp. 509-514
Author(s):  
Pei Lum Tso ◽  
Tsung Yun Tsai
Keyword(s):  
Residual Stresses ◽  
Material Removal ◽  
Surface Defects ◽  
Fused Silica ◽  
Grinding Wheel ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Photoelastic Method ◽  
Diamond Blade ◽  
Measuring Tool

Residual stresses in fused silica induced by two machining methods, diamond blade saw cutting and GC grinding wheel grinding, are studied in this study. Photoelastic method would be applied as measuring tool analyzing the gradient of residual stresses caused by different machining condition. This sentence is strange with analyzing the chips of grinding and observation of surface defects, it is assumed that the stresses gradient differs probably cause by the different material removal mechanism.

Research on the Topography Features of the Densely Bonded Diamond Grinding Wheel Dressed by Elliptical Ultrasonic Vibration

2011 ◽  
Vol 188 ◽  
pp. 330-335
Author(s):  
Bo Zhao ◽  
C.Y. Zhao ◽  
G.F. Gao
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal ◽  
Bonding Agent ◽  
Grinding Wheel ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Wheel Surface ◽  
Dressing Method ◽  
Diamond Grinding Wheel ◽  
Abrasive Grains

In this paper, on the influence of different dressing methods, such as elliptical ultrasonic vibration, on the grinding wheel bonded delta, the morphology of abrasive grains of wheel, the protrusion height and the grinding wheel topography was studied by experiment. The experiment shows that the abrasive grains of grinding wheel surface dressed by elliptical ultrasonic vibration are great in protrusion height and trench depth, and the bonded delta grain after grinding is narrow, short, and irregular with significant reduced semi-surrounded area compared with by ordinary dressing method. The abrasive grains of metal-bonded diamond grinding wheel surface dressed by elliptical ultrasonic vibration are basically intact, and due to the high-speed collision between abrasive grains, local micro-break is easy to occur on the abrasive grains to form multiple micro-cutting edges. The abrasive grains of grinding wheel surface dressed by ordinary dressing method are fractured and broken, while that of resin-bonded grinding wheel surface have a high ratio to be loose and shedding. For the metal or resin-bonded grinding wheel surface dressed by elliptical ultrasonic vibration, its material removal mechanism may primarily be the removal of bonding ductility and the fine-crushing of abrasive grains; for the metal-bonded grinding wheel surface dressed by ordinary method, its material removal mechanism may primarily be the fracture and break of abrasive grains, secondly be the fracture of bonding agent; and for the resin-bonded grinding wheel surface, its material removal mechanism may mainly be the looseness and shedding of abrasive grains caused by the fracture of bonding agent, secondly be the fracture of abrasive grains. Compared with ordinary dressing method, elliptical ultrasonic vibration dressed abrasive grains are dense at shaft and sparse in periphery, with a large quantity of static effective abrasive grains, great protrusion height and an excellent nature of contour.

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study

Microgrinding of Nanostructured Carbide Coatings: Ground Surface and Subsurface Damage Observations

2006 ◽  
Vol 304-305 ◽  
pp. 276-280 ◽  
Author(s):  
Y.H. Ren ◽  
Zhi Xiong Zhou ◽  
Zhao Hui Deng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Material Removal ◽  
Ground Surface ◽  
Subsurface Damage ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Carbide Coatings ◽  
Subsurface Layers ◽  
Scanning Electron

Surface microgrinding of the nanostructured WC/12Co coatings have been undertaken with diamond wheels under various conditions. Nondestructive and destructive approaches were utilized to assess damage in ground nanostructured coatings. Different surface and subsurface configurations were observed by scanning electron microscopy. This paper investigates the effects of microgrinding conditions on damage formation in the surface and subsurface layers of the ground nanostructured WC/12Co coatings. And the material-removal mechanism has been discussed.

The Research and Development on the Material Removal Mechanism of the Ultrasonic Cutting

2014 ◽  
Vol 1027 ◽  
pp. 40-43
Author(s):  
Yan Yan Lou ◽  
Yan Zhang ◽  
Ying Gao ◽  
Jia Chen Zhang ◽  
Yan Zhou Sun
Keyword(s):  
Material Removal ◽  
Development Trend ◽  
Ultrasonic Machining ◽  
Removal Mechanism ◽  
Rotary Ultrasonic Machining ◽  
Material Removal Mechanism ◽  
Material Removal Model ◽  
The Development Trend ◽  
Removal Model ◽  
Ultrasonic Cutting

Ultrasonic machining is an important part of modern processing technology which is adapt to all kinds of hard brittle materials processing. This paper reviews the latest progress of the material removal mechanism on one-dimensional ultrasonic machining, two-dimensional ultrasonic machining and rotary ultrasonic machining, and expounds the development trend of establishing the material removal model of the ultrasonic machining.

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