scholarly journals Strain measurement in heteroepitaxial layers—Silicon on sapphire

1986 ◽  
Vol 1 (5) ◽  
pp. 712-716 ◽  
Author(s):  
Thad Vreeland

An x-ray diffraction technique is presented for the determination of the strain tensor in an epitaxial layer grown on a crystallographically distinct substrate. The technique utilizes different diffracting planes in the layer and in a reference crystal fixed to the layer, and is illustrated by application to an ∼4000 Å (001) silicon layer grown on a (01$\overline 1$2 sapphire wafer. The principal strains were measured, and the measured strain normal to the layer was found to agree with the normal strain calculated from the measured in-plane strains within the experimental uncertainty of strain measurement. The principal stresses in the plane of the silicon film, calculated from the measured strains were −0.92 ± 0.16 GPa in the [100] direction and −0.98 ± 0.17 GPa in the [010] direction.

1982 ◽  
Vol 26 ◽  
pp. 275-282 ◽  
Author(s):  
C.N.J. Wagner ◽  
M.S. Boldrick ◽  
V. Perez-Mendez

AbstractA ϕ-ψ diffractometer has been designed and constructed to evaluate residual stresses in polycrystalline samples by x-ray diffraction. It permits rotations of the x-ray diffraction apparatus, consisting of an x-ray tube and a position-sensitive proportional counter, about two axes ϕ and ψ. The ϕ-rotation from 0° to 360° is carried out about the normal to the surface of the stationary sample, whereas the ψ-motion consists of a rotation from -45° to +45° about an axis lying in the sample surface and the diffraction plane, but perpendicular to the diffraction vector. This ϕ-ψ diffractometer permits the application of the ϕ- and ψ-differential and integral methods for the evaluation of the strain tensor and its gradient averaged over the depth of x-ray penetration into the sample. Assuming that isotropic elasticity theory is applicable, the stress tensor can then be evaluated from the measured strain tensor.


2014 ◽  
Vol 47 (5) ◽  
pp. 1699-1707 ◽  
Author(s):  
D. Bouscaud ◽  
A. Morawiec ◽  
R. Pesci ◽  
S. Berveiller ◽  
E. Patoor

Kossel microdiffraction in a scanning electron microscope enables determination of local elastic strains. With Kossel patterns recorded by a CCD camera and some automation of the strain determination process, this technique may become a convenient tool for analysis of strains. As for all strain determination methods, critical for the applicability of the Kossel technique is its strain resolution. The resolution was estimated in a number of ways: from the simplest tests based on simulated patterns (of an Ni alloy), through analysis of sharp experimental patterns of Ge, to estimates obtained byin situtensile straining of single crystals of the Ni-based superalloy. In the latter case, the results were compared with those of conventional X-ray diffraction and synchrotron-based Kossel diffraction. In the case of high-quality Ge patterns, a resolution of 1 × 10−4was reached for all strain tensor components; this corresponds to a stress of about 10 MPa. With relatively diffuse patterns from the strained Ni-based superalloy, under the assumption of plane stress, the strain and stress resolutions were 3 × 10−4and 60 MPa, respectively. Experimental and computational conditions for achieving these resolutions are described. The study shows potential perspectives and limits of the applicability of semiautomatic Kossel microdiffraction as a method of local strain determination.


1995 ◽  
Vol 380 ◽  
Author(s):  
So Tanaka ◽  
Christopher C. Umbach ◽  
Qun Shen ◽  
Jack M. Blakely

ABSTRACTWe have applied high resolution synchrotron X-ray diffraction to two-dimensional (2D) Si gratings with wavelengths of 300 and 400nm. We show that this method is very sensitive to both the geometry (grating wavelength, height, and angle of inclined sidewall) and the state of strain. Morphology changes produced by vacuum annealing can be detected so that the mass transport rates on Si surfaces can be measured. Strain measurements show that grating pillars covered with 1 lnm of thermal oxide were under tension (ε = 3.7 × 10−4). This strain was elastically relaxed by removing the oxide.


1985 ◽  
Vol 29 ◽  
pp. 353-366 ◽  
Author(s):  
Armin Segmüller

AbstractIn this paper, the application of recently developed x-ray diffraction techniques to the characterization of thin epitaxial films will be discussed. The double-crystal diffractometer, with high resolution in the non-dispersive arrangement, enables the materials scientist to study epitaxial systems having a very small mismatch with high precision. A key part of the characterization of an epitaxial film is the determination of the strain tensor by measuring lattice spacing! in various directions The determination of strain and composition profiles in ion-implanted films, epitaxial layers and superlattices by rocking-curve analysis will also be reviewed. Grazingincidence diffraction, an emerging new technique, can be used to obtain structural details parallel to the interface on films with thicknesses ranging down to a few atomic layers. The synchroton has now become increasingly available as a powerful source of x radiation which will facilitate the application of conventional and grazing-incidence diffraction to ultra-thin films.


1982 ◽  
Vol 15 (2) ◽  
pp. 154-159 ◽  
Author(s):  
C. S. G. Cousins ◽  
L. Gerward ◽  
J. Staun Olsen ◽  
B. Selsmark ◽  
B. J. Sheldon

The internal strain tensor of crystals having the diamond structure has a single independent component {\bar A}. A value {\bar A} = −0.18±0.01 for silicon has been found by observing the 006 forbidden reflection whilst applying a stress along the [1{\bar 1}0] axis. An energy-dispersive method was used so that advantage could be taken of the simultaneous presence of strong reflections (004 and 008) to align the sample with precision and to normalize the intensity measurements. In the course of investigation it was found that the strong reflections increased in intensity as a function of stress, suggesting that the crystal was undergoing a reversible change from the ideally perfect to the ideally imperfect state.


2012 ◽  
Vol 45 (4) ◽  
pp. 705-718 ◽  
Author(s):  
Hemant Sharma ◽  
Richard M. Huizenga ◽  
S. Erik Offerman

This second part of the paper on an analysis strategy for data acquired using three-dimensional X-ray diffraction (3DXRD) describes the procedure for the determination of the grain characteristics for thousands of grains. The approach developed here is orders of magnitude faster than those presently available for indexing thousands of grains. Using information obtained from the steps described in Part I [Sharma, Huizenga & Offerman (2012).J. Appl. Cryst.45, 693–704], the volume, crystallographic orientation, centre-of-mass position and strain state of grains in the sample can be determined. The algorithms dealing with the determination of the orientation, centre-of-mass position and strain state of the grains are divided into two parts. The first deals with indexing,i.e.it assigns diffraction spots to individual grains assuming an unstrained lattice, and the second deals with the refinement of the crystallographic orientation, centre-of-mass position and strain state of the grains using the diffraction spots assigned during indexing. The different approaches to indexing that exist in the literature are presented and compared with the novel approach developed here. Indexing can be run in two modes depending on the number of grains. For large numbers of grains, the approach employs a novel sample `surface' scanning technique, in combination with a reduced number of search orientations, to achieve high robustness and computation efficiency. For small numbers of grains, the approach neglects the position of the diffracting grains in the sample in order to improve the computation efficiency. For unstrained samples, both modes of indexing and the subsequent process of refinement are validated using simulated data for 60 and 3000 grains. In both cases, the centre-of-mass position of the grains was determined with a mean error of 0.7 µm and the orientation was determined with a mean error of 0.0003°. Furthermore, an experiment was `mimicked' by introducing experimental errors into the simulation for 3000 grains. The resulting mean errors in the centre-of-mass position (2.1 µm) and orientation (0.008°) of the grains are higher than those for the ideal simulations, and the errors in an experiment will depend on the `true' experimental errors. The algorithms dealing with strained samples are validated using a simulation for 3000 grains with mimicked experimental errors. The centre-of-mass position, crystallographic orientation, normal strain tensor components and shear strain tensor components of the grains were determined with mean errors of 8 µm, 0.006°, 5.2 × 10−5and 2.8 × 10−5, respectively. The possibility of obtaining grain-level information for thousands of grains with a high speed of acquisition makes the technique very attractive forin situstudies of thermomechanical processes in polycrystalline materials.


Metals ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 774
Author(s):  
Chris A. Simpson ◽  
David M. Knowles ◽  
Mahmoud Mostafavi

Accurate residual lattice strain measurements are highly dependent upon the precision of the diffraction peak location and the underlying microstructure suitability. The suitability of the microstructure is related to the requirement for valid powder diffraction sampling statistics and the associated number of appropriately orientated illuminated. In this work, these two sources of uncertainty are separated, and a method given for both the quantification of errors associated with insufficient grain sampling statistics and minimization of the total lattice strain measurement uncertainty. It is possible to reduce the total lattice strain measurement uncertainty by leveraging diffraction peak measurements made at multiple azimuthal angles. Lattice strain measurement data acquired during eight synchrotron X-ray diffraction experiments, monochromatic and energy dispersive, has been assessed as per this approach, with microstructural suitability being seen to dominate total measurement uncertainty when the number of illuminated grains was <106. More than half of the studied experimental data fell into this category, with a severe underestimation of total strain measurement uncertainty being possible when microstructural suitability is not considered. To achieve a strain measurement uncertainty under 10−4, approximately 3×105 grains must be within the sampled gauge volume, with this value varying with the multiplicity of the family of lattice planes under study. Where additional azimuthally arrayed data are available an in-plane lattice strain tensor can be extracted. This improves overall strain measurement accuracy and an uncertainty under 10−4 can then be achieved with just 4×104 grains.


1988 ◽  
Vol 21 (1) ◽  
pp. 38-41 ◽  
Author(s):  
R. H. Fenn ◽  
A. M. Jones

The determination of the full three-dimensional stress tensor in a specimen by X-ray diffraction requires that the strain be measured with the sample tilted in both a positive and a negative sense for different rotations of the sample in its own plane. The error introduced in the measured strain as a function of the position of the specimen relative to the X-ray diffractometer axis is investigated and it is shown that the negative tilt values are more sensitive to sample position than the positive tilt values. The determination of the shear stress components uses the difference between the measured strain at equivalent positive and negative tilts and hence it is shown that displacement of the sample could lead to incorrect deductions concerning the presence and magnitude of the shear stress components.


1995 ◽  
Vol 403 ◽  
Author(s):  
T. Marieb ◽  
A. S. Mack ◽  
N. Cox ◽  
D. Gardner ◽  
X. C. Mu

AbstractPassivated Cu lines deposited by CVD, electroplating, and sputter-reflow were investigated using x-ray diffraction. Blanket films of the three types were measured for strain and texture post-deposition and after an anneal step to mimic the passivation temperature step. Texture in the CVD films was random, while the electroplated and sputtered films showed a strong {111} texture. Lines were then measured of each type. The measured strain was modeled using finite element calculations. While the strain in Cu was high compared to Al lines of similar geometry, no stress voiding was observed using high voltage scanning electron microscopy.


Sign in / Sign up

Export Citation Format

Share Document